DAC0807 NSC | Alldatasheet

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Technical content

Features

Y Relative accuracy: g0.19% error maximum (DAC0808) Y Full scale current match: g1 LSB typ Y 7 and 6-bit accuracy available (DAC0807, DAC0806) Y Fast settling time: 150 ns typ Y Noninverting digital inputs are TTL and CMOS compati- ble Y High speed multiplying input slew rate: 8 mA/ ms Y Power supply voltage range: g4.5V to g18V Y Low power consumption: 33 mW @ g5V Block and Connection Diagrams TL/H/5687–1 Dual-In-Line Package TL/H/5687–2 Small-Outline Package TL/H/5687–13 Top View

Ordering Information

ACCURACY OPERATING TEMPERATURE ORDER NUMBERS RANGE J PACKAGE (J16A) * N PACKAGE (N16A) * SO PACKAGE (M16A) DAC0808LCN MC1408P8 DAC0808LCM 7-bit 0 §CsTAsa75§C DAC0807LCJ MC1408L7 DAC0807LCN MC1408P7 DAC0807LCM 6-bit 0 §CsTAsa75§C DAC0806LCJ MC1408L6 DAC0806LCN MC1408P6 DAC0806LCM *Note. Devices may be ordered by using either order number. Order Number DAC0808, DAC0807, or DAC0806 See NS Package Number J16A, M16A or N16A C1995 National Semiconductor Corporation RRD-B30M115/Printed in U. S. A.

Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Power Supply Voltage V CC a18 V DC VEE b18 V DC Digital Input Voltage, V5–V12 b10 V DC to a18 V DC Applied Output Voltage, V O b11 V DC to a18 V DC Reference Current, I 14 5m A Reference Amplifier Inputs, V14, V15 V CC,V EE Power Dissipation (Note 3) 1000 mW ESD Susceptibility (Note 4) TBD Storage Temperature Range b65§Ct o a150§C Lead Temp. (Soldering, 10 seconds) Dual-In-Line Package (Plastic) 260 §C Dual-In-Line Package (Ceramic) 300 §C Surface Mount Package Vapor Phase (60 seconds) 215 §C Infrared (15 seconds) 220 §C Operating Ratings Temperature Range T MIN s TA s TMAX DAC0808LC Series 0 sTA s a75§C

Electrical Characteristics

(VCC e 5V, V EE eb 15 V DC,V REF/R14 e 2 mA, DAC0808: T A eb 55§Ct o a125§C, DAC0808C, DAC0807C, DAC0806C, T A e 0§Ct o a75§C, and all digital inputs at high logic level unless otherwise noted.) Symbol Parameter Conditions Min Typ Max Units Er Relative Accuracy (Error Relative (Figure 4) % to Full Scale I O) DAC0808LC (LM1408-8) g0.19 % DAC0807LC (LM1408-7), (Note 5) g0.39 % DAC0806LC (LM1408-6), (Note 5) g0.78 % Settling Time to Within (/2 LSB T Ae25§C (Note 6), 150 ns (Includes t PLH) (Figure 5) tPLH,t PHL Propagation Delay Time T A e 25§C, (Figure 5) 30 100 ns TCIO Output Full Scale Current Drift g20 ppm/ §C MSB Digital Input Logic Levels (Figure 3) VIH High Level, Logic ‘‘1’’ 2 V DC VIL Low Level, Logic ‘‘0’’ 0.8 V DC MSB Digital Input Current (Figure 3) High Level V IH e 5V 0 0.040 mA Low Level V IL e 0.8V b0.003 b0.8 mA I15 Reference Input Bias Current (Figure 3) b1 b3 mA Output Current Range (Figure 3) VEE eb 5V 0 2.0 2.1 mA VEE eb 15V, T A e 25§C 0 2.0 4.2 mA IO Output Current V REF e 2.000V, R14 e 1000X, (Figure 3) 1.9 1.99 2.1 mA Output Current, All Bits Low (Figure 3) 04 mA Output Voltage Compliance (Note 2) E r s 0.19%, T A e 25§C VEEeb5V, I REFe1m A b0.55, a0.4 V DC VEE Below b10V b5.0, a0.4 V DC

the device beyond its specified operating conditions. Note 2: Range control is not required. line N package, this number increases to 175 §C/W and for the small outline M package this number is 100 §C/W. Note 4: Human body model, 100 pF discharged through a 1.5 k X resistor. Note 5: All current switches are tested to guarantee at least 50% of rated current. Note 7: Pin-out numbers for the DAL080X represent the dual-in-line package. The small outline package pinout differs from the dual-in-line package. FIGURE 1. a10V Output Digital to Analog Converter (Note 7)

Typical Performance Characteristics VCC e 5V, V EE eb 15V, T A e 25§C, unless otherwise noted Logic Input Current vs Input Voltage Bit Transfer Characteristics Logic Threshold Voltage vs Temperature Output Current vs Output Voltage (Output Voltage Compliance) Output Voltage Compliance vs Temperature Typical Power Supply Current vs Temperature Typical Power Supply Current vs V EE Typical Power Supply Current vs V CC Reference Input Frequency Response Unless otherwise specified: R14 e R15 e 1k X,C e 15 pF, pin 16 to VEE;R L e 50X, pin 4 to ground. Curve A: Large Signal Bandwidth Method of Figure 7 ,V REF e 2 Vp-p offset 1 V above ground. Curve B: Small Signal Bandwidth Method of Figure 7 ,R L e 250X,V REF e 50 mVp-p offset 200 mV above ground. Curve C: Large and Small Signal Bandwidth Method of Figure 9 (no op amp, R L e 50X), R S e 50X,V REF e 2V, V S e 100 mVp-p centered at 0V. TL/H/5687–5

FIGURE 2. Equivalent Circuit of the DAC0808 Series (Note 7)

Physical Dimensions inches (millimeters) Dual-In-Line Package Order Number DAC0807 or DAC0806 Small Outline Package Order Number DAC0806LCM, DAC0807LCM or DAC0808LCM

DAC0808/DAC0807/DAC0806 8-Bit D/A Converters Physical Dimensions inches (millimeters) (Continued) Dual-In-Line Package Order Number DAC0808, DAC0807 or DAC0806 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant support device or system whose failure to perform can into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life failure to perform, when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can effectiveness. be reasonably expected to result in a significant injury to the user. National Semiconductor National Semiconductor National Semiconductor National Semiconductor Corporation Europe Hong Kong Ltd. Japan Ltd.

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