DA16600MOD

Renesas Technology Corp

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module 04-Jan-2023

Manufacturer: Renesas Technology Corp

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DA16600MOD RENESAS | Alldatasheet

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Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 1 of 28 © 2023 Renesas Electronics General Description The DA16600 series is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy Combo Module solution. This module includes the DA16200 that has an 802.11b/g/n radio (PHY), a baseband processor, a media access controller (MAC), on-chip memory, and a host networking application processor. DA16600 also has a DA14531 that has a 2.4 GHz transceiver and an Arm® Cortex-M0+® microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. The radio transceiver, the baseband processor, and the qualified Bluetooth ® low energy stack is fully compliant with the Bluetooth Low Energy 5.1 standard. The DA16600 is a synthesis of breakthrough ultra-low-power technologies, which enables an extremely low power operation in the module. The DA16200 and DA14531 shut down every micro element of the chip that is not in use, which creates a power consumption that is near zero when not actively transmitting or receiving data. Such low power operation can extend the battery life up to a year or more depending on the application. The DA16600 also enables ultra-low power transmission and reception modes when the SoC needs to be awake to exchange information with other devices. Advanced algorithms enable sleep mode until the exact moment when wake up is required to transmit or receive data. Module Features ■ Module Variants □ DA16600MOD-AAC4WA32 (Chip Antenna) □ DA16600MOD-AAE4WA32 (u.FL Connector) ■ Dimensions □ 14.3 mm × 24.3 mm × 3.0 mm, 51-Pins ■ Operating temperature range □ -40 °C to 85 °C ■ Regulatory certifications: □ FCC □ IC □ CE □ TELEC Wi-Fi Features ■ Highly integrated ultra-low power Wi-Fi® system on a chip ■ RF Performance □ Tx Power: +18 dBm, 1 Mbps DSSS □ Rx Sensitivity: -97.5 dBm, 1 Mbps DSSS ■ Full offload: SoC runs full networking OS and TCP/IP stack ■ Hardware accelerators □ General HW CRC engine □ HW zeroing function for fast booting □ Pseudo random number generator (PRNG) ■ SPI flash Memory □ 32 M-bit / 4 M-byte ■ Wi-Fi processor □ IEEE 802.11b/g/n, 1x1, 20 MHz channel bandwidth, 2.4 GHz □ Wi-Fi security: WPA/WPA2- Enterprise/Personal, WPA2 SI, WPA3 SAE, and OWE □ Vendor EAP types: EAP- TTLS/MSCHAPv2, PEAPv0/EAP- MSCHAPv2, PEAPv1, EAP-FAST, and EAP-TLS □ Operating modes: Station, Soft AP □ WPS-PIN/PBC for easy Wi-Fi provisioning □ Fast Wi-Fi connections

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 2 of 28 © 2023 Renesas Electronics ■ Complete software stack □ Comprehensive networking software stack □ Provides TCP/IP stack in the form of network socket APIs ■ CPU core subsystem □ Arm® Cortex®-M4F core with clock frequency of 30~160 MHz □ ROM: 256 KB, SRAM: 512 KB, OTP: 8 KB, Retention Memory: 48 KB ■ Advanced security □ Secure booting □ Secure debugging using JTAG/SWD and UART ports □ Secure asset storage ■ Built-in hardware crypto engines for advanced security □ TLS/DTLS security protocol functions □ Crypto engine for key deliberate generic security functions: AES (128,192,256), DES/3DES, SHA1/224/256, RSA, DH, ECC, CHACHA, and TRNG ■ Supports various interfaces □ Two UARTs □ SPI Master/Slave interface □ I2C Master/Slave interface □ I2S for digital audio streaming □ 4-channel PWM □ Individually programmable, multiplexed GPIO pins □ JTAG and SWD ■ Built-in 2-channel auxiliary ADC for sensor interfaces □ 12-bit SAR ADC: single-ended two channels ■ Supply □ Operating voltage: 2.1 V to 3.6 V (typical: 3.3 V) □ 2 Digital I/O Supply Voltage: 1.8 V / 3.3 V □ Black-out and brown-out detector ■ Power management unit □ On-Chip RTC □ Wake-up control of fast booting or full booting with minimal initialization time □ Supports three ultra-low power sleep modes Bluetooth Features ■ Bluetooth □ Compatible with Bluetooth® v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core □ Supports up to 3 connections ■ Processing and memories □ 16 MHz 32-bit Arm®Cortex-M0+ with SWD interface □ 48 Kbytes RAM □ 144 Kbytes ROM □ 32 Kbytes OTP ■ Current Consumption □ 2 mA RX at VBAT = 3V □ 4 mA TX at VBAT = 3 V and 0 dBm □ 1.8 uA at sleep with all RAM retained ■ Radio □ Programmable RF transmit power □ -93 dBm receiver sensitivity ■ Interfaces □ 2 channel 11-bit ENOB ADC □ 2 general purpose timers with PWM □ 5 GPIOs □ SPI □ 2x UART, 1-wire UART support □ I2C ■ Power management □ Operating range (1.8 V - 3.3 V) □ Inrush current control ■ Other □ Real Time Clock □ Trimmed 32 MHz Crystal

1 References

DA16600MOD consist of a DA16200 and a DA14531 chipset. Please see the respective chipset and module datasheets for details. [1] DA16200 Datasheet, Renesas Electronics [2] DA16200MOD Datasheet, Renesas Electronics [3] DA14531, Datasheet, Renesas Electronics [4] DA14531MOD Datasheet, Renesas Electronics

2 Block Diagram

The DA16600 provides a high level of integration for a battery used wireless system, with integrated IEEE 802.11 b/g/n and Bluetooth V5.1. The DA16600 is designed to address the needs of battery used devices that require minimal power consumption and reliable operation. Figure 1 shows the interconnection of all the physical blocks in DA16600MOD. GPIO Multiplexing 2.4GHz BPF & Matching Circuit U.FL connector or Chip antenna

40 MHz

32.768 KHz Crystal DA16200 Low power Wi-Fi SoC SPDT for antenna switching DA14531 Low power BLE SoC UART Matching Circuit 4MByte Serial Flash RTC control UART for debug

32 MHz

Figure 1: DA16600 Block Diagram

3 Pinout

3.1 Pinout Description (51-pins)

P0_6 P0_2 GND TEST or NC GND RTC_PWR_KEY TP RTC_GPO TMS TCLK GPIOC_8 GPIOC_7 GPIOC_6 UART0_TXD UART0_RXD VDD_DIO2 TP TP TP GND GND TP TP TP RTC_WAKE_UP2 GND GND VBAT_3V3 GND GND GPIOA11 GPIOA10 GPIOA9 GPIOA8 GPIOA7 GPIOA6 TP TP VDD_DIO1 GPIOA3 GPIOA2 TP TP P0_9 P0_8 P0_7 P0_5 P0_11 P0_10 VBAT_BLE Figure 2: DA16600MOD 51-Pins Pinout Diagram (Top View)

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 8 of 28 © 2023 Renesas Electronics Table 1: Pin Description #Pin Pin Name Type Drive(mA) Reset State Related Device

Description

1 NC AI DA14531 Not Connect

2 P0_2 DIO DA14531 General Purpose I/O,

JTAG I/F, SWCLK

3 P0_6 DIO DA14531 Internally connected to

4 GND GND Common Ground

5 TEST or NC AI Common Chip antenna type:

RF_Test u.FL connector type: NC

6 GND GND Common Ground

7 RTC_PWR_KEY DI DA16200 RTC block enable signal

8 TP DNC DA16200 RTC block wake up

9 RTC_GPO DO DA16200 Sensor control signal

10 TMS DIO 2/4/8/12 I-PU DA16200 JTAG I/F, SWDIO

11 TCLK DIO 2/4/8/12 I-PD DA16200 JTAG I/F, SWCLK,

12 GPIOC_8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

13 GPIOC_7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

14 GPIOC_6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

15 UART0_TXD DO 2/4/8/12 O DA16200 UART transmit data

16 UART0_RXD DI 2/4/8/12 I DA16200 UART receive data

17 VDD_DIO2 VDD DA16200 Supply power for digital

GPIOC6~GPIOC8, TMS/TCLK, TXD/RXD

18 TP DNC DA16200 F_IO0 is internally

19 TP DNC DA16200 F_CLK is internally

20 TP DNC DA16200 F_IO3 is internally

21 GND GND Common Ground

22 GND GND Common Ground

23 TP DNC DA16200 F_IO1 is internally

24 TP DNC DA16200 F_CSN is internally

25 TP DNC DA16200 F_IO2 is internally

26 RTC_WAKE_UP2 DI DA16200 RTC block wake-up

27 GND GND Common Ground

28 VBAT_3V3 VDD DA16200 Supply power for internal

DC-DC, DIO_LDO, and Analog IP of DA16200

29 GND GND Common Ground

30 GND GND Common Ground

31 GND GND Common Ground

32 GPIOA11 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

33 GPIOA10 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

34 GPIOA9 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

35 GPIOA8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

36 GPIOA7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

37 GPIOA6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

38 TP DNC 2/4/8/12 I-PD Common GPIOA5 of DA16200 is

P0_3 of DA14531 Note 1

39 TP DNC 2/4/8/12 I-PD Common GPIOA4 of DA16200 is

P0_4 of DA14531 Note 1

40 VDD_DIO1 VDD DA16200 Supply power for digital

GPIOA0~GPIOA11 41 GPIOA3 AI/DIO 2/4/8/12 I-PD DA16200 Aux. ADC input/General Purpose I/O 42 GPIOA2 AI/DIO 2/4/8/12 I-PD DA16200 Aux. ADC input/General Purpose I/O

43 TP DNC 2/4/8/12 I-PD Common GPIOA1 of DA16200 is

P0_0 of DA14531 Note 1, Note 2

44 TP DNC 2/4/8/12 I-PD Common GPIOA0 of DA16200 is

P0_1 of DA14531 Note 1 45 P0_9 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O, UART Debug TXD 46 P0_8 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O, UART Debug RXD 47 P0_7 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O 48 P0_5 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 10 of 28 © 2023 Renesas Electronics #Pin Pin Name Type Drive(mA) Reset State Related Device 49 P0_11 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O 50 P0_10 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O

51 VBAT_BLE VDD DA14531 Supply power for

Note 1 Pin3, Pin8, Pin 38, Pin 39, Pin 43, and Pin 44 are connected internally so these pins can\`t be used as GPIO or as wake up input in application system. Note 2 P0_0 has a reset function, but it is shared with GTL. It is recommended to connect the remaining GPIO as an additional reset function when P0_0 is not available for reset in abnormal situations. This device provides various interfaces to support many kinds of applications. In DA16200, it is possible to control each pin according to the required application in reference to the pin multiplexing illustrated in Table 2. Pin control can be realized through register setting. In DA14531, I/O pin assignment can be configured by the SW and is organized into the Port 0. Please refer the datasheet and user manual of DA16200 and DA14531 respectively for detail information. Table 2: DA16200 Pin Multiplexing Within the DA16600 module, various pins of the DA16200 and the DA14531 are internally connected and therefore cannot be used as GPIOs and are marked as TP (test points) on the DA16600MOD package. The GPIOs which are not available are:

DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5 Due to these internal connections, the SDIO, SDeMMC and UART1 interfaces of the DA16200 are not available. To support Bluetooth Coexistence, P06 of the DA14531 (which is internally connected to the RF switch) must be connected to a DA16200 GPIO pin as follows:
For 1 pin Bluetooth Coexistence, connect P0_6 to GPIOA10
For 3 pin Bluetooth Coexistence, connect P0_6 to GPIOA9 If GPIOA9 or GPIOA10 is used for Bluetooth Coexistence, then it cannot be used as a GPIO.

4 Electrical Specification

4.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, so functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification are not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Table 3: Absolute Maximum Ratings Parameter #Pins Min Max Units VBAT_3V3 28 -0.2 3.7 V VDD_DIO1 40 -0.2 3.7 V VDD_DIO2 17 -0.2 3.7 V VBAT_BLE 51 -0.1 3.6 V Storage temperature range -40 +125 °C

4.2 Recommended Operating Conditions

Table 4: Recommended Operating Conditions Parameter #Pins Min Typ Max Units VBAT_3V3 28 2.1 3.6 V VDD_DIO1 40 1.62 3.6 V VDD_DIO2 17 1.62 3.6 V VBAT_BLE 51 1.8 3.3 V Operating temperature range (TA) -40 +85 °C

4.3 Electrical Characteristics

4.3.1 DC Parameters, 1.8 V IO Table 5: DC Parameters, 1.8 V IO Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage Guaranteed logic Low level Note 1 VSS 0.3 × DVDD V VIH Input High Voltage Guaranteed logic High level 0.7 × DVDD DVDD V VOL Output Low Voltage DVDD=Min. VSS 0.2 × DVDD V VOH Output High Voltage DVDD=Min. 0.8 × DVDD DVDD V RPU Pull-up Resistor VPAD=VIH, DIO=Min. 32.4 kΩ RPD Pull-down Resistor VPAD=VIL, DIO=Min. 32.4 Note 1 DVDD = 1.8V, VDD_DIO1, VDD_DIO2 Logic Level.

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 13 of 28 © 2023 Renesas Electronics 4.3.2 DC Parameters, 3.3 V IO Table 6: DC Parameters, 3.3 V IO Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage Guaranteed logic Low level Note 2 VSS 0.8 V VIH Input High Voltage Guaranteed logic High level 2.0 DVDD V VOL Output Low Voltage DVDD=Min. VSS 0.4 V VOH Output High Voltage DVDD=Min. 2.4 DVDD V RPU Pull-up Resistor VPAD=VIH, DIO=Min. 19.4 kΩ RPD Pull-down Resistor VPAD=VIL, DIO=Min. 16.0 Note 2 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 Logic Level.

4.3.3 DC Parameters for RTC Block

There are several control pins in RTC block. Table 7: DC Parameters for RTC block, 3.3 V VBAT Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage Guaranteed logic Low level VSS 0.6 V VIH Input High Voltage Guaranteed logic High level 2.2 VBAT V (RTC block: RTC_PWR_KEY, RTC_WAKE_UP2) Table 8: DC Parameters for RTC block, 2.1 V VBAT Symbol Parameter Condition Min Typ Max Units VIL Input Low Voltage Guaranteed logic Low level VSS 0.3 V VIH Input High Voltage Guaranteed logic High level 1.6 VBAT V (RTC block: RTC_PWR_KEY, RTC_WAKE_UP2)

4.4 Radio Characteristics

4.4.1 Wi-Fi Characteristics

TA = +25 °C, VBAT = 3.3 V, CH1 (2412 MHz) Table 9: Wi-Fi Receiver Characteristics Parameter Condition Min Typ Max Units Sensitivity (8% PER for 11b rates, 10% PER for 11g/11n rates) 1 Mbps DSSS -98.5 -97.5 -95.5 dBm

2 Mbps DSSS -94 -93 -91

11 Mbps CCK -89 -88 -86

6 Mbps OFDM -90 -89 -87

9 Mbps OFDM -90 -89 -87

18 Mbps OFDM -88 -87 -85

36 Mbps OFDM -81 -80 -78

54 Mbps OFDM -75 -74 -72

MCS0(GF) -90 -89 -87 MCS7(GF) -72 -71 -69 Maximum input level (8% PER for 11b rates, 10% PER for 11g/11n rates) 802.11b -4 0 0 802.11g -10 -4 -3 Table 10: Wi-Fi Transmitter Characteristics Parameter Condition Min Typ Max Units Maximum Output Power measured form IEEE spectral mask and EVM

1 Mbps DSSS 15 18 19

2 Mbps DSSS 15 18 19

5.5 Mbps CCK 15 18 19

11 Mbps CCK 15 18 19

6 Mbps OFDM 14 17 18

9 Mbps OFDM 14 17 18

12 Mbps OFDM 14 17 18

18 Mbps OFDM 14 17 18

24 Mbps OFDM 13 16 17

36 Mbps OFDM 13 16 17

48 Mbps OFDM 11.5 14.5 15.5 54 Mbps OFDM 10.5 13.5 14.5 MCS0 OFDM 14 17 18 MCS7 OFDM 10.5 13.5 14.5 Transmit center frequency accuracy -25 +25 ppm

4.4.2 Bluetooth® LE Characteristics

Table 11: Radio 1 Mb/s – AC Characteristics Parameter Description Condition Min Typ Max Unit PSENS_CLEAN sensitivity level Dirty Transmitter disabled; DC-DC converter disabled; PER = 30.8 %; Note 1 -93 dBm PSENS_EPKT sensitivity level Extended packet size (255 octets) Note 1 -90 dBm Note 1 Measured according to Bluetooth® Low Energy Test Specification RF-PHY.TS/5.1.0

4.5 Current Consumption

4.5.1 Wi-Fi Characteristics

TA = +25 °C, VBAT = 3.3 V, w/ CPU clock is 80 MHz. Table 12: Current Consumption in Active State Parameter Condition Min Typ Max Units ACTIVE TX 1 Mbps DSSS @ 18.0 dBm 260 280 320 mA 6 Mbps OFDM @ 17.0 dBm 240 260 300 54 Mbps OFDM @ 13.5 dBm 180 200 240 MCS7 @ 13.5 dBm 180 200 240 RX No signal Note 1 25 29 51 1 Mbps DSSS Note 1 26.5 30.5 53 1 Mbps DSSS 27 37.5 54 54 Mbps OFDM 29 38.5 54 MCS7 29 38.5 54 Note 1 Low Power Mode & CPU clock 30 MHz. TA = +25 °C, VBAT = 3.3 V Table 13: Current Consumption in Low Power Operation Parameter Condition Min Typ Max Units Low Power Operation Sleep 1 5.2 Note 1 µA Sleep 2 6.8 Note 1 Sleep 3 8.5 Note 1 Note 1 RF switch current consumption is included. VDD of RF switch is connected to VBAT_3V3 for DA16200 and typical current consumption of RF switch is 5 µA.

4.5.2 Bluetooth® LE Characteristics

Table 14: DC Characteristics Parameter Description Conditions Min Typ Max Units IBAT_ACTIVE Battery supply current 0.4 mA IBAT_BLE_ADV_100ms Average battery supply current with system in Advertising state (3 channels) every 100ms and extended sleep with all RAM retained. µA IBAT_BLE_CONN_30ms Average battery supply current with system in a connection state with 30ms connection interval and extended sleep with all RAM retained. µA IBAT_HIBERN Battery supply current with system shut down 0.6 µA IBAT_RF_RX Battery supply current Continuous Rx 2.3 mA IBAT_RF_TX_+2 Battery supply current Continuous Tx; Output power at 2dBm Note 1 4.3 mA IBAT_RF_TX_-1 Battery supply current Continuous Tx; Output power at -1dBm Note 2 3.6 mA IBAT_RF_TX_-4 Battery supply current Continuous Tx; Output power at -4dBm 2.8 mA Note 1 All Bluetooth applications run on DA16200, so DA16200 should be active to handle Bluetooth data (e.g. Bluetooth Connection Request coming from a Bluetooth peer), in which case, Rx active current of DA16200 is added to the total current consumption. Note 2 The actual Tx output power is slightly different than the one indicated in the parameter name.

4.6 Radiation Performance

Figure 3: TIS 3D Figure 4: TRP 3D

4.7 ESD Ratings

Table 15: ESD Performance Reliability Test Standards Test Conditions Result Human Body Model (HBM) ANSI/ESDA/JEDEC JS-001-2017 ± 2,000 V Pass Charge Device Mode (CDM) ANSI/ESDA/JEDEC JS-002-2018 ± 500 V Pass

5 Power-on Sequence

The sequence after the initial switching from power-off to power-on of DA16200 is shown in Figure 5. The RTC_PWR_KEY is a pin that enables the RTC block of DA16200. Once RTC_PWR_KEY is enabled after VBAT power is supplied, all the internal regulators are switched on automatically in the sequence pre-defined by the RTC block. Once RTC_PWR_KEY is switched on, LDOs for both XTAL and digital I/O are switched on shortly and then the DC-DC regulator is switched on according to the pre-defined interval. The enabling intervals can also be modified in the register settings after initial power-up. CLK_32K VBAT POWER_KEY IO Voltage 50% VBAT 50% IO 50% VBAT Figure 5: Power On Sequence Table 16: Power On Sequence Timing Requirements Name Description Min Typ Max Unit T0 VBAT power-on time from 10 % to 90 % of VBAT ms T1 IO voltage and VCC supply 0 ms T2 RTC_PWR_KEY turn-on time from 50 % VBAT to 50 % POWER_KEY * Note 3 5*T0 ms T3 Internal RC oscillator wake-up time 217 µs Note 3 If the T0 = 10 ms to switch on VBAT, the recommended T2 is 50 ms for the safe booting operation. It would be externally controlled by MCU or it would be implemented using RC filter at the input of RTC_PWR_KEY. The recommended C is 470 nF or 1 uF (not to exceed 1 uF) and R value is chosen to have T2 delay. For example, R and C values will be 82 kΩ and 1uF when T0 = 10 ms.

6 Applications Schematic

6.1 Typical Application

GPIOA_10 P0_7 P0_5 GPIOA_8 VDD_DIO1 P0_11 P0_10 VBAT_BLE GPIOA_9 External Power Control UART Interface for debug DA16600 MOD Series GND NC P0_2 RTC_PWR_KEY TP P0_6 GND TEST or NC GND RTC_GPO TMS TCLK GPIOC_8 GPIOC_7 GPIOC_6 UART0_TX UART0_RX VDD_DIO2 P0_2 P0_6 VDD_DIO2 JTAG Interface GPIO Interface VBAT_3V3 External Wake- up Control RTC_WAKE_UP2 GPIO Interface GPIO Interface GPIO Interface BLE_Debug /GPIO Interface 10uF 1uF 1uF VBAT_BLE P0_10 P0_11 P0_5 GPIOA_11 GPIOA_10 GPIOA_9 GPIOA_8 GPIOA_7 GPIOA_6 TP TP GPIOA_3 GPIOA_2 TP TP P0_9 P0_8 P0_7 4.7K VDD_DIO1 10uF *Note: Remove R1 and C1 when MCU controls 'RTC_PWR_KEY' If not controlled by MCU, keep R1 and C1 and connect to VBAT. Figure 6: Typical Application Table 17: Coexistence Connection DA14531 part DA16200 part Function P0_5 GPIOA_8 Wi-Fi_ACT P0_6 GPIOA_9 BT_ACT P0_7 GPIOA_10 BT_PRIO Table 18: Component Value Part Reference Value Description R1 470 kΩ Remove R1 when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. For detail information, see Section 5. C1 1 uF Remove C1 when MCU control ‘RTC_PWR_KEY’. This value should be chosen by customer application to achieve the enough delay time depending on the power-on time of VBAT. Not to exceed 1uF. For detail information, see Section 5.

7 Package Information

7.1 Dimension: DA16600MOD-AAC

Unit: millimeters (mm) Figure 7: AAC Module Dimension

7.2 Dimension: DA16600MOD-AAE

Unit: millimeters (mm)

7.3 PCB Land Pattern

Unit: millimeters (mm) Figure 9: PCB Land Pattern (Top View)

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 22 of 28 © 2023 Renesas Electronics Figure 10: PCB Land Pattern (Bottom View) Ant GND is only needed on the bottom of the PCB. GND must be removed for all layers including the inner layer except the bottom. See Figure 11 for details.

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 23 of 28 © 2023 Renesas Electronics 7.4 4-layer PCB Example Top Layer layer 2 layer 3 Bottom layer Figure 11: 4-Layer PCB Example

7.5 Soldering Information

7.5.1 Recommended Condition for Reflow Soldering

The reflow profile depends on the solder paste being used and the recommendations from the paste manufacturer should be followed to determine the proper reflow profile. Table 19: Typical Reflow Profile (Lead Free): J-STD-020C Profile Feature Lead Free SMD Average ramp up rate (Tsmax to Tp) 3 °C/s Max. Preheat

Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (Tsmax to Tsmin)
150 °C
200 °C
60 to 180 seconds Time maintained above
Temperature (TL)
Time (tL)
217 °C
60 to 150 seconds Peak/Classification temperature (Tp) 260 °C Time within 5 °C of peak temperature (tp) 20 to 40 seconds Ramp down rate 6 °C/s Max. Time from 25 °C to peak temperature 8 minutes Max. Figure 12: Reflow Condition

8 Ordering Information

The order number consists of the part number followed by a suffix that indicates the packing method. For details and availability, please visit the Low Power Wi-Fi | Renesas website or contact your local sales representative. Table 20: Ordering Information (Samples) Part Number Pins Size (mm) Shipment Form Pack Quantity DA16600MOD-AAC4WA32 51 14.3 x 24.3 x 3.0 Reel DA16600MOD-AAE4WA32 51 14.3 x 24.3 x 3.0 Reel Table 21: Ordering Information (Production) Part Number Pins Size (mm) Shipment Form Pack Quantity DA16600MOD-AAC4WA32 51 14.3 x 24.3 x 3.0 Reel 500 DA16600MOD-AAE4WA32 51 14.3 x 24.3 x 3.0 Reel 500 Part Number Legend: DA16600MOD-AAC4WA32 AA: Module revision number C: Select module type [C] Chip antenna, [E] u.FL connector 4: Flash memory [4] 4Mbyte, [2] 2 Mbyte W: Voltage range A3: Package No. 2: T&R packing

Revision History

3.2 04-Jan-2023 Section 3.1 Updated coexistence description. Updated Table 3 to add storage temperature range and adjusted min max voltages 3.1 14-June-2022

Update logo, disclaimer, copyright.
Section 3.1 Updated Pin Multiplexing Table 2
Section 6 Updated application Schematic Figure 6
Updated Pin description Table 1 3.0 23-Feb-2021 Official release 1.4 26-Oct-2020 Modified application schematic 1.3 15-July-2020 Modified application schematic 1.2 22-May-2020 Added ESD performance, Table 15 1.1 29-April-2020 Preliminary datasheet

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module Datasheet Revision 3.2 04-Jan-2023 CFR0011-120-00 27 of 28 © 2023 Renesas Electronics Status Definitions Revision Datasheet Status Product Status Definition 1.<n> Target Development This datasheet contains the design specifications for product development. Specifications may be changed in any manner without notice. 2.<n> Preliminary Qualification This datasheet contains the specifications and preliminary characterization data for products in pre-production. Specifications may be changed at any time without notice in order to improve the design. 3.<n> Final Production This datasheet contains the final specifications for products in volume production. The specifications may be changed at any time in order to improve the design, manufacturing and supply. Major specification changes are communicated via Customer Product Notifications. Datasheet changes are communicated via www.renesas.com. 4.<n> Obsolete Archived This datasheet contains the specifications for discontinued products. The information is provided for reference only. Reach and RoHS Compliance Renesas Electronics’s suppliers certify that its products are in compliance with the requirements of REACH and Directive 2015/863/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoH S certificates from our suppliers are available on request.

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Product Information

DA16600MOD specifications and overview.

Summary

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module 04-Jan-2023

Description

Ultra-Low Power Wi-Fi + Bluetooth® LE Combo Module 04-Jan-2023

Source title DA16600MOD Datasheet(PDF) - Renesas Technology Corp

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Document overview

Technical content

Contents

1 References

2 Block Diagram

40 MHz

32 MHz

3 Pinout

3.1 Pinout Description (51-pins)

Description

1 NC AI DA14531 Not Connect

2 P0_2 DIO DA14531 General Purpose I/O,

3 P0_6 DIO DA14531 Internally connected to

4 GND GND Common Ground

5 TEST or NC AI Common Chip antenna type:

6 GND GND Common Ground

7 RTC_PWR_KEY DI DA16200 RTC block enable signal

8 TP DNC DA16200 RTC block wake up

9 RTC_GPO DO DA16200 Sensor control signal

10 TMS DIO 2/4/8/12 I-PU DA16200 JTAG I/F, SWDIO

11 TCLK DIO 2/4/8/12 I-PD DA16200 JTAG I/F, SWCLK,

12 GPIOC_8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

13 GPIOC_7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

14 GPIOC_6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

15 UART0_TXD DO 2/4/8/12 O DA16200 UART transmit data

16 UART0_RXD DI 2/4/8/12 I DA16200 UART receive data

17 VDD_DIO2 VDD DA16200 Supply power for digital

18 TP DNC DA16200 F_IO0 is internally

19 TP DNC DA16200 F_CLK is internally

20 TP DNC DA16200 F_IO3 is internally

21 GND GND Common Ground

22 GND GND Common Ground

23 TP DNC DA16200 F_IO1 is internally

24 TP DNC DA16200 F_CSN is internally

25 TP DNC DA16200 F_IO2 is internally

26 RTC_WAKE_UP2 DI DA16200 RTC block wake-up

27 GND GND Common Ground

28 VBAT_3V3 VDD DA16200 Supply power for internal

29 GND GND Common Ground

30 GND GND Common Ground

31 GND GND Common Ground

32 GPIOA11 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

33 GPIOA10 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

34 GPIOA9 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

35 GPIOA8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

36 GPIOA7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

37 GPIOA6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

38 TP DNC 2/4/8/12 I-PD Common GPIOA5 of DA16200 is

39 TP DNC 2/4/8/12 I-PD Common GPIOA4 of DA16200 is

40 VDD_DIO1 VDD DA16200 Supply power for digital

43 TP DNC 2/4/8/12 I-PD Common GPIOA1 of DA16200 is

44 TP DNC 2/4/8/12 I-PD Common GPIOA0 of DA16200 is

51 VBAT_BLE VDD DA14531 Supply power for

4 Electrical Specification

4.1 Absolute Maximum Ratings

4.2 Recommended Operating Conditions

4.3 Electrical Characteristics

4.3.3 DC Parameters for RTC Block

4.4 Radio Characteristics

4.4.1 Wi-Fi Characteristics

2 Mbps DSSS -94 -93 -91

11 Mbps CCK -89 -88 -86

6 Mbps OFDM -90 -89 -87

9 Mbps OFDM -90 -89 -87

18 Mbps OFDM -88 -87 -85

36 Mbps OFDM -81 -80 -78

54 Mbps OFDM -75 -74 -72

1 Mbps DSSS 15 18 19

2 Mbps DSSS 15 18 19

5.5 Mbps CCK 15 18 19

11 Mbps CCK 15 18 19

6 Mbps OFDM 14 17 18

9 Mbps OFDM 14 17 18

12 Mbps OFDM 14 17 18

18 Mbps OFDM 14 17 18

24 Mbps OFDM 13 16 17

36 Mbps OFDM 13 16 17