DA16600MOD_V01 RENESAS | Alldatasheet

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Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 1 © 2025 Renesas Electronics General Description The DA16600 series is a highly integrated ultra-low-power Wi-Fi® + Bluetooth® Low Energy Combo Module solution. This module includes the DA16200 that has an 802.11b/g/n radio (PHY), a baseband processor, a media access controller (MAC), on-chip memory, and a host networking application processor. The DA16600 also has a DA14531 that has a 2.4 GHz transceiver and an Arm® Cortex-M0+® microcontroller with a RAM of 48 kB and a One-Time Programmable (OTP) memory of 32 kB. The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack are fully compliant with the Bluetooth Low Energy 5.1 standard. The DA16600 is a synthesis of breakthrough ultra-low-power technologies, which enables an extremely low power operation in the module. The DA16200 and DA14531 shut down every micro element of the chip that is not in use, which creates a power consumption that is near zero when not actively transmitting or receiving data. Such low power operation can extend the battery life up to a year or more depending on the application. The DA16600 also enables ultra-low-power transmission and reception modes when the SoC needs to be awake to exchange information with other devices. Advanced algorithms enable Sleep mode until the exact moment when wake-up is required to transmit or receive data. Module Features ▪ Module Variants

  • DA16600MOD-AAC4WA32 (Chip Antenna)
  • DA16600MOD-AAE4WA32 (u.FL Connector) ▪ Dimensions
  • 14.3 mm × 24.3 mm × 3.0 mm, 51 -pins ▪ Operating temperature range
  • -40 °C to 85 °C ▪ Regulatory certifications:
  • FCC
  • IC
  • CE
  • TELEC
  • KCC
  • IMDA
  • NCC
  • SRRC
  • WPC Wi-Fi Features ▪ Highly integrated ultra-low-power Wi-Fi® system on a chip ▪ RF performance
  • TX Power: +18 dBm, 1 Mbps DSSS
  • RX Sensitivity: -97.5 dBm, 1 Mbps DSSS ▪ Full offload: SoC runs full networking OS and TCP/IP stack ▪ Hardware accelerators
  • General hardware CRC engine
  • Hardware zeroing function for fast booting
  • Pseudo random number generator (PRNG) ▪ SPI Flash memory
  • 32-Mbit/4 MB ▪ Complete software stack
  • Comprehensive networking software stack
  • Provide TCP/IP stack in the form of network socket APIs ▪ Wi-Fi processor
  • IEEE 802.11b/g/n, 1x1, 20 MHz channel bandwidth, 2.4 GHz
  • Wi-Fi security: WPA/WPA2-Enterprise/Personal, WPA2 SI, WPA3 SAE, and OWE
  • Vendor EAP types: EAP-TTLS/MSCHAPv2, PEAPv0/EAP-MSCHAPv2, PEAPv1, EAP-FAST, and EAP-TLS
  • Operating modes: Station and Soft AP
  • WPS-PIN/PBC for easy Wi-Fi provisioning
  • Fast Wi-Fi connections ▪ Support various interfaces
  • Two UARTs
  • SPI Master/Slave interfaces
  • I2C Master/Slave interfaces
  • I2S for digital audio streaming
  • 4-channel PWM

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 2 ▪ CPU core subsystem

  • Arm® Cortex® -M4F core with clock frequency of 30~160 MHz
  • ROM: 256 kB, SRAM: 512 kB, OTP: 8 kB, Retention Memory: 48 kB ▪ Advanced security
  • Secure booting
  • Secure debugging using JTAG/SWD and UART ports
  • Secure asset storage ▪ Built-in hardware crypto engines for advanced security
  • TLS/DTLS security protocol functions
  • Crypto engine for key deliberate generic security functions: AES (128,192,256), DES/3DES, SHA1/224/256, RSA, DH, ECC, CHACHA, and TRNG
  • Individually programmable, multiplexed GPIO pins
  • JTAG and SWD ▪ Built-in 2-channel auxiliary ADC for sensor interfaces
  • 12-bit SAR ADC: single-ended two channels ▪ Supply
  • Operating voltage: 2.1 V to 3.6 V (typical: 3.3 V)
  • 2 Digital I/O supply voltage: 1.8 V/3.3 V
  • Blackout and brownout detector ▪ Power management unit
  • On-chip RTC
  • Wake-up control of fast booting or full booting with minimal initialization time
  • Support three ultra-low-power Sleep modes. Bluetooth Features ▪ Bluetooth
  • Compatible with Bluetooth® v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core
  • Support up to 3 connections ▪ Processing and memories
  • 16 MHz 32-bit Arm® Cortex-M0+ with SWD interface
  • 48 kB RAM
  • 144 kB ROM
  • 32 kB OTP ▪ Current consumption
  • 2 mA RX at VBAT = 3 V
  • 4 mA TX at VBAT = 3 V and 0 dBm
  • 1.8 uA at sleep with all RAM retained ▪ Radio
  • Programmable RF transmit power
  • -93 dBm receiver sensitivity ▪ Interfaces
  • 2 channel 11-bit ENOB ADC
  • 2 general purpose timers with PWM
  • 5 GPIOs
  • SPI
  • 2x UART, 1-wire UART support
  • I2C ▪ Power management
  • Operating range (1.8 V - 3.3 V)
  • Inrush current control ▪ Others
  • Real Time Clock
  • Trimmed 32 MHz crystal.

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 3

Contents

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 5 1. Terms and Definitions CRC Cyclic Redundancy Check DMA Direct Memory Access GPIO General Purpose Input/Output I2C Inter-Integrated Circuit I2S Inter-IC Sound IoT Internet of Things JTAG Joint Test Action Group LDO Low-dropout Regulator PLL Phase-locked Loop PRNG Pseudo Random Number Generator PWM Pulse Width Modulation QSPI Quad-lane SPI RTC Real-time Clock SAR ADC Successive Approximation Analog-to-Digital Converter SPI Serial Peripheral Interface SWD Serial Wire Debug UART Universal Asynchronous Receivers and Transmitter 2. References [1] DA16200 Datasheet, Renesas Electronics. [2] DA16200MOD Datasheet, Renesas Electronics. [3] DA14531 Datasheet, Renesas Electronics. [4] DA14531MOD Datasheet, Renesas Electronics. Note 1 References are for the latest published version, unless otherwise indicated.

require minimal power consumption and reliable operation. Figure 1 shows the interconnection of all the physical blocks in the DA16600MOD.

2.4 GHz

40 MHz

32 MHz

Figure 1. DA16600MOD block diagram

Figure 2. DA16600MOD 51 pinout diagram (top view)

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 8 Table 1. Pin description

Description

1 NC AI DA14531 Not connected

2 P0_2 DIO DA14531 General Purpose I/O,

JTAG I/F, SWCLK

3 P0_6 DIO DA14531 Internally connected to RF switch

(Note 1).

4 GND GND Common Ground

5 TEST or NC AI Common Chip antenna type: RF_Test

u.FL connector type: NC

6 GND GND Common Ground

7 RTC_PWR_KE

Y DI DA16200 RTC block enable signal.

8 TP DNC DA16200 RTC block wake-up signal is

internally connected (Note 1).

9 RTC_GPO DO DA16200 Sensor control signal

10 TMS DIO 2/4/8/12 I-PU DA16200 JTAG I/F, SWDIO

11 TCLK DIO 2/4/8/12 I-PD DA16200 JTAG I/F, SWCLK, General Purpose

12 GPIOC_8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

13 GPIOC_7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

14 GPIOC_6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

15 UART0_TXD DO 2/4/8/12 O DA16200 UART transmit data

16 UART0_RXD DI 2/4/8/12 I DA16200 UART receive data

17 VDD_DIO2 VDD DA16200 Supply power for digital I/O

GPIOC6~GPIOC8, TMS/TCLK, TXD/RXD

18 TP DNC DA16200 F_IO0 is internally connected to

Flash memory.

19 TP DNC DA16200 F_CLK is internally connected to

Flash memory.

20 TP DNC DA16200 F_IO3 is internally connected to

Flash memory.

21 GND GND Common Ground

22 GND GND Common Ground

23 TP DNC DA16200 F_IO1 is internally connected to

Flash memory.

24 TP DNC DA16200 F_CSN is internally connected to

Flash memory.

25 TP DNC DA16200 F_IO2 is internally connected to

Flash memory.

26 RTC_WAKE_U

DI DA16200 RTC block wake-up signal

27 GND GND Common Ground

28 VBAT_3V3 VDD DA16200 Supply power for internal DC-DC,

DIO_LDO, and Analog IP of DA16200

29 GND GND Common Ground

30 GND GND Common Ground

31 GND GND Common Ground

32 GPIOA11 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

33 GPIOA10 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

34 GPIOA9 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 9 #Pin Pin name Type Drive (mA) Reset state Related device

35 GPIOA8 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

36 GPIOA7 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

37 GPIOA6 DIO 2/4/8/12 I-PD DA16200 General Purpose I/O

38 TP DNC 2/4/8/12 I-PD Common GPIOA5 of DA16200 is internally

connected to P0_3 of DA14531 (Note 1)

39 TP DNC 2/4/8/12 I-PD Common GPIOA4 of DA16200 is internally

connected to P0_4 of DA14531 (Note 1)

40 VDD_DIO1 VDD DA16200 Supply power for digital I/O

GPIOA0~GPIOA11

41 GPIOA3 AI/DIO 2/4/8/12 I-PD DA16200 Aux ADC input/General Purpose I/O

42 GPIOA2 AI/DIO 2/4/8/12 I-PD DA16200 Aux ADC input/General Purpose I/O

43 TP DNC 2/4/8/12 I-PD Common GPIOA1 of DA16200 is internally

connected to P0_0 of DA14531 (Note 1 and Note 2)

44 TP DNC 2/4/8/12 I-PD Common GPIOA0 of DA16200 is internally

connected to P0_1 of DA14531 (Note 1) 45 P0_9 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O, UART Debug TXD 46 P0_8 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O, UART Debug RXD 47 P0_7 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O 48 P0_5 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O 49 P0_11 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O 50 P0_10 DIO 3.5 / 0.3 I-PD DA14531 General Purpose I/O

51 VBAT_BLE VDD DA14531 Supply power for DA14531

Note 1 Pin3, Pin8, Pin 38, Pin 39, Pin 43, and Pin 44 are connected internally so these pins cannot be used as GPIO or wake-up input in application system. Note 2 P0_0 has a reset function, but it is shared with GTL. Renesas recommends connecting the remaining GPIO as an additional reset function when P0_0 is not available for reset in abnormal situations. NOTE See DA16200 datasheet, Ref. [1] and DA14531 datasheet, Ref. [3] for GPIOs functionality. Within the DA16600 module, 4 pins of the DA16200 and the DA14531 are internally connected and therefore cannot be used as GPIOs and are marked as TP (test points) on the DA16600MOD package. The following GPIOs are not available: ▪ DA16200: GPIOA0, GPIOA1, GPIOA4, GPIOA5 Because of these internal connections, the SDIO, SDeMMC, and UART1 interfaces of the DA16200 are not available. To support Bluetooth Coexistence, P06 of the DA14531 (which is internally connected to the RF switch) must be connected to a DA16200 GPIO pin as follows: ▪ For 1 pin Bluetooth Coexistence, connect P0_6 to GPIOA10 ▪ For 3 pin Bluetooth Coexistence, connect P0_6 to GPIOA9 If GPIOA9 or GPIOA10 is used for Bluetooth Coexistence, it cannot be used as a GPIO.

  1. Electrical Specifications

5.1 Absolute Maximum Ratings

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Rating conditions for extended periods may affect device reliability. Table 2. Absolute maximum ratings

5.2 Recommended Operating Conditions

Table 3. Recommended operating conditions

5.3 Electrical Characteristics

Table 4. DC parameters, 1.8 V I/O Note 1 DVDD = 1.8 V, VDD_DIO1, VDD_DIO2 logic level. Table 5. DC parameters, 3.3 V I/O

Note 1 DVDD= 3.3 V, VDD_DIO1, VDD_DIO2 logic level.

5.3.3 DC Parameters for RTC Block

There are several control pins in RTC block. Table 6. DC parameters for RTC block, 3.3 V VBAT Table 7. DC parameters for RTC block, 2.1 V VBAT

5.4 Radio Characteristics

5.4.1 Wi-Fi Characteristics

Typical values are at TA = +25 °C, VBAT = 3.3 V, and CH1 (2412 MHz), unless otherwise specified. Table 8. Wi-Fi receiver characteristics

2 Mbps DSSS -94 -93 -91

11 Mbps CCK -89 -88 -86

6 Mbps OFDM -90 -89 -87

9 Mbps OFDM -90 -89 -87

18 Mbps OFDM -88 -87 -85

36 Mbps OFDM -81 -80 -78

54 Mbps OFDM -75 -74 -72

Table 9. W-Fi transmitter characteristics

1 Mbps DSSS 15 18 19

2 Mbps DSSS 15 18 19

5.5 Mbps CCK 15 18 19

11 Mbps CCK 15 18 19

6 Mbps OFDM 14 17 18

9 Mbps OFDM 14 17 18

12 Mbps OFDM 14 17 18

18 Mbps OFDM 14 17 18

24 Mbps OFDM 13 16 17

36 Mbps OFDM 13 16 17

5.4.2 Bluetooth® LE Characteristics

Table 10. Radio 1 MB/s – AC characteristics Note 1 Measured according to the Bluetooth® Low Energy Test Specification RF-PHY.TS/5.1.0.

5.5 Current Consumption

5.5.1 Wi-Fi Characteristics

Typical values are at TA = +25 °C and VBAT = 3.3 V, unless otherwise specified, with CPU clock is 80 MHz. Table 11. Current consumption in ACTIVE state Note 1 Low Power Mode and CPU clock is 30 MHz. Table 12. Current consumption in low power operation typical current consumption of RF switch is 5 µA.

5.5.2 Bluetooth® LE Characteristics

Table 13. DC characteristics DA16200 is added to the total current consumption. Note 2 The actual TX output power is slightly different than the one indicated in the parameter name.

5.6 Radiation Performance

Figure 3. Measurement plane definition Measurements are carried out for the module installed in the upper left corner on the reference evaluation board.

Figure 4. TIS 3D Figure 5. TRP 3D

5.7 ESD Ratings

Table 14. ESD performance

5.8 Clock Electrical Characteristics

source clock for the internal PLL while the PLL output is used for the internal processor and Wi -Fi system block.

5.8.1 RTC Clock Source

5.8.2 Main Clock Source

clock. Basically, the external clock is 40 MHz.

The sequence after the initial switching from power-off to power-on of the DA16200 is shown in Figure 6. pre-defined by the RTC block. modified in the register settings after initial power-up. Figure 6. Power-on sequence Table 15. Power-on sequence timing requirements and C values are 82 kΩ and 1uF when T0 = 10 ms.

Figure 7. Application schematic Table 16. Coexistence connection Table 17. Component value Remove R1 when MCU controls the RTC_PWR_KEY. Remove C1 when MCU controls the RTC_PWR_KEY. on time of VBAT. Not to exceed 1 uF.

  1. Mechanical Specifications

8.1 Dimension: DA16600MOD-AAC

Figure 8. AAC module dimension

8.2 Dimension: DA16600MOD-AAE

Figure 9. AAE module dimension

8.3 Marking

Figure 10. Module shield marking The DA16600MOD-AAC4WA32 only has the NCC logo.

9.1 PCB Land Pattern

Figure 11. PCB land pattern (top view) Figure 12. PCB land pattern (bottom view)

the inner layer except the bottom. Figure 13. 4-layer PCB example

manufacturer should be followed to determine the proper reflow profile. Figure 14. Reflow condition Table 18. Typical reflow profile (lead free): J-STD-020C Average ramp up rate (Tsmax to Tp) 3 °C/s Max.

  • Temperature Min (Tsmin)
  • Temperature Max (Tsmax)
  • Time (Tsmax to Tsmin)
  • 150 °C
  • 200 °C
  • 60 to 180 seconds Time maintained above
  • Temperature (TL)
  • Time (tL)
  • 217 °C
  • 60 to 150 seconds Peak/Classification temperature (Tp) 260 °C Time within 5 °C of peak temperature (tp) 20 to 40 seconds Ramp down rate 6 °C/s Max. Time from 25 °C to peak temperature 8 minutes Max.

11.1 Tape and Reel

Figure 15. Tape and reel

11.2 Labeling

Figure 18. Reel labeling

fi/low-power-wi-fi) or contact your local sales representative. Table 20. Ordering information (Samples) Table 21. Ordering information (Production)

  • [C] Chip antenna, [E] u.FL connector ▪ 4: Flash memory ▪ W: Voltage range ▪ A3: Package No. ▪ 2: T&R packing

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 26 Appendix A Regulatory Approval The DA16600MOD-AAC and DA16600MOD-AAE modules have received regulatory approval for the following countries: ▪ FCC/United States

  • DA16600MOD-AAC4WA32 FCC ID: 2AU49-DA16600MC
  • DA16600MOD-AAE4WA32 FCC ID: 2AU49-DA16600ME ▪ IC/Canada
  • DA16600MOD-AAC4WA32 IC ID: 25650-DA16600MC
  • DA16600MOD-AAE4WA32 IC ID: 25650-DA16600ME ▪ KCC/Korea
  • DA16600MOD-AAC4WA32 KCC ID: R-C-fci-DA16600AAC
  • DA16600MOD-AAE4WA32 KCC ID: R-C-fci-DA16600AAE ▪ TELEC/Japan
  • DA16600MOD-AAC4WA32 TELEC ID:
  • DA16600MOD-AAE4WA32 TELEC ID: ▪ CE/Europe
  • DA16600MOD-AAC4WA32 CE ID: LCS200907037AE
  • DA16600MOD-AAE4WA32 CE ID: LCS200907033AE ▪ SRRC/China
  • DA16600MOD-AAC4WA32 CMIIT ID: 23J9988G3223
  • DA16600MOD-AAE4WA32 CMIIT ID: 23J9988GT642(M) ▪ IMDA/Singapore
  • DA16600MOD-AAC4WA32 IMDA ID: N4512-23 ▪ WPC/India
  • DA16600MOD-AAC4WA32 WPC ID: ETA-SD-20240909185
  • DA16600MOD-AAE4WA32 WPC ID: ETA-SD-20240909181 ▪ NCC/Taiwan
  • DA16600MOD-AAC4WA32 「取得審驗證明之低功率射頻器材，非經核准，公司、商號或使用者均不得擅自變更頻率、加大功率或變 更原設計之特性及功能。低功率射頻器材之使用不得影響飛航安全及干擾合法通信；經發現有干擾現象時 ，應立即停用，並改善至無干擾時方得繼續使用。前述合法通信，指依電信管理法規定作業之無線電通信 。低功率射頻器材須忍受合法通信或工業、科學及醫療用電波輻射性電機設備之干擾。」
  • 此模組於取得認證後將依規定於模組本體標示審驗合格標籤，並要求平台廠商於平台上標示本產品內含發射 器模組 NOTE The NCC ID must be clearly displayed on the exterior of the finished product or mounted board.

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 27 13. Revision History Revision Date Description

3.6 Feb 17, 2025 ● Changed unit mA to µA in Table 12

3.5 Oct 31, 2024 ● Updated Appendix A

  • Added note to pin description table
  • Added measurement plane definition
  • Updated Section 11.1

3.4 Apr 12, 2024 ● Added regulatory certifications in Appendix A: NCC and SRRC

  • Updated Section 8.3

3.3 Oct 05, 2023 ● Removed redundant sections

  • Added Appendix A
  • Added Tape and Reel Information 3.2 Jan 04, 2023 ● Section 3.1 updated coexistence description
  • Updated Table 3 to add storage temperature range and adjusted min max voltages

3.1 June 14, 2022 ● Updated logo, disclaimer, and copyright

  • Section 3.1 updated Pin Multiplexing Table 2
  • Section 6 updated application Schematic Figure 6
  • Updated Pin description Table 1

3.0 Feb 23, 2021 Official release

1.4 Oct 26, 2020 Modified application schematic

1.3 July 15, 2020 Modified application schematic

1.2 May 22, 2020 Added ESD performance, Table 14

1.1 Apr 29, 2020 Preliminary datasheet

Renesas Electronics’ suppliers certify that its products are in compliance with the requirements of Directive 2011/65/EU of the European Parliament on the restriction of the use of certain hazardous substances in electrical and electronic equipment. RoHS certificates from our suppliers are available on request.

Ultra-Low-Power Wi-Fi + Bluetooth® LE Combo Module R19DS0155EK0305 Rev.3.6 Feb 17, 2025 CFR0011-120-00 Page 28 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD-PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers who are designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only to develop an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third-party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising from your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Disclaimer Rev.1.01 Jan 2024) Corporate Headquarters TOYOSU FORESIA, 3-2-24 Toyosu Koto-ku, Tokyo 135-0061, Japan www.renesas.com Contact Information For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit www.renesas.com/contact-us Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2025 Renesas Electronics Corporation. All rights reserved.