D12V0S1U2LP1608 DIODES | Alldatasheet
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Provides ESD Protection per IEC 61000-4-2 Standard: Air ± 30kV, Contact ± 30kV One Channel of ESD Protection Low Channel Input Capacitance Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Mechanical Data Case: U-DFN1608-2 Case Material: Molded Plastic, “Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: NiPdAu. Solderable per MIL-STD-202, Method 208 Weight: 0.003 grams (Approximate) Ordering Information (Note 4) Part Number Compliance Marking Code Reel Size (inches) Tape Width (mm) Quantity Per Reel D12V0S1U2LP1608-7 Commercial 12E 7 8 10,000/Tape & Reel D15V0S1U2LP1608-7 Commercial 15E 7 8 10,000/Tape & Reel D33V0S1U2LP1608-7 Commercial 33E 7 8 10,000/Tape & Reel D40V0S1U2LP1608-7 Commercial 40E 7 8 10,000/Tape & Reel D50V0S1U2LP1608-7 Commercial 50E 7 8 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes -packaging/. Marking Information XXE = Product Type Marking Code Dot Denotes Cathode Side Device Schematic U-DFN1608-2 Pin1 Pin2 Top View XXE
D12V0S1U2LP1608 ~ D50V0S1U2LP1608 Document number: DS41785 Rev. 2 - 2 2 of 5 www.diodes.com September 2021 © Diodes Incorporated D12V0S1U2LP1608 ~ D50V0S1U2LP1608 V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610 D36AP2WF ADVANCED INFORMATION Maximum Ratings (@TA = +25° C, unless otherwise specified.) Characteristic Symbol Value Unit Conditions ESD Protection – Contact Discharge VESD_CONTACT ± 30 kV Standard IEC 61000-4-2 ESD Protection – Air Discharge VESD_AIR ± 30 kV Standard IEC 61000-4-2 Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) PD 300 mW Thermal Resistance, Junction to Ambient TA = +25° C RθJA 417 C/W Operating and Storage Temperature Range TJ, TSTG -55 to +150 C Electrical Characteristics (@TA = +25° C, unless otherwise specified.) Part Number Reverse Standoff Voltage Breakdown Voltage Test Current Maximum Reverse Leakage Current @ VRWM (Note 6) Maximum Clamping Voltage @ IPP (Note 7) Maximum Peak Pulse Current Channel Input Capacitance (Note 8) VR = 0V, f = 1MHz, Any I/O to GND Marking Code VBR @ IT VRWM (V) Min (V) Max (V) IT (mA) IR (µA) VC (V) IPP (A) (pF) D12V0S1U2LP1608-7 12 13 17 1 1 22 55 380 12E D15V0S1U2LP1608-7 15 17 23 1 1 30 35 264 15E D33V0S1U2LP1608-7 33 36 40 1 1 55 19 156 33E D40V0S1U2LP1608-7 40 45 55 1 1 75 14 138 40E D50V0S1U2LP1608-7 50 56 63 1 1 90 15 126 50E Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html. 6. Short duration pulse test used to minimize self-heating effect. 7. Clamping voltage value is based on an 8x20µ s peak pulse current (IPP) waveform. 8. Measured from any I/O to GND.
D12V0S1U2LP1608 ~ D50V0S1U2LP1608 Document number: DS41785 Rev. 2 - 2 4 of 5 www.diodes.com September 2021 © Diodes Incorporated D12V0S1U2LP1608 ~ D50V0S1U2LP1608 V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610 D36AP2WF ADVANCED INFORMATION Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. U-DFN1608-2 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. U-DFN1608-2 A A1 Seating Plane D E L k b( 2x) U-DFN1608-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0.00 0.05 0.02 A3 - - 0.127 b 0.65 0.75 0.70 D 0.75 0.85 0.80 E 1.55 1.65 1.60 k 0.38 BSC k1 0.05 BSC L 0.76 0.86 0.81 L1 0.36 0.46 0.41 All Dimensions in mm Dimensions Value (in mm) X 0.800 Y 0.610 Y1 1.010 Y2 1.900 X Y X
D12V0S1U2LP1608 ~ D50V0S1U2LP1608 Document number: DS41785 Rev. 2 - 2 5 of 5 www.diodes.com September 2021 © Diodes Incorporated D12V0S1U2LP1608 ~ D50V0S1U2LP1608 V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610V0S1U2LP1610 V0S1U2LP1610 D36AP2WF ADVANCED INFORMATION IMPORTANT NOTICE 1. DIODES INCORPORATED AND ITS SUBSIDIARIES (“DIODES”) MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTIC ULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operati on of Diodes products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engi neering customers and users who design with Diodes products. Diodes products may be used to facilitate safety -related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their ap plications, (b) evaluating the suitability of the Diodes products for their intended applications, (c) ensuring their applications, which incorporate Diodes products, comply the applicable legal and regulatory requirements as well as safety and functional -safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality control techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risk s associated with their applications. 3. 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