D4723GS

UPD4723 NEC | Alldatasheet

Document overview

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• PDF pages: 16

Technical content

Features

• Conforms to EIA/TIA-232-E (former name, RS-232C) standards
• Selectable +3.3 V/+5 V single power supply (selected by V CHA pin)
• By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times, the driver output is in a high-impedance state.
• Even in the standby mode, 2 receiver circuits can operate as inverters without hysteresis width. The other circuit is fixed at a high level.

Ordering Information

µPD4723GS-GJG 30-pin plastic SSOP (300 mil)

µPD4723 BLOCK DIAGRAM/PIN CONFIGURATION (Top View) D IN1 D IN2 D IN3 R OUT1 R OUT2 R OUT3 NC NC STBY VCHA EN D OUT1 D OUT2 D OUT3 R IN1 R IN2 R IN3 NC NC V DD C 1+ VCC C 1– C 5+ GND C 5– C 4+ GND C 4– VSS +10 V C 3 C 1 C 5 –10 V C 2 C 4 Note 4 300 Ω 300 Ω 300 Ω 5.5 kΩ 5.5 kΩ +3.3 V or +5 V 5.5 kΩ Note 1. VDD and VSS are output pins stepped up internally. These pins should not be loaded directly. 2. Capacitors C1 to C5 with a breakdown voltage of 20 V or higher are recommended. And it is recommended to insert the capacitor that is 0.1 µF to 1 µF between VCC and GND. 3. If VCHA is kept low level (in 5 V mode), capacitor C5 is not necessary. 4. The pull-up resistors at driver input are active resistors.

µPD4723 Truth Table Driver STBY DIN DOUT Remarks L × Z Standby mode (DC/DC converter is stopped) H L H Space level output H H L Mark level output Receiver STBY EN R IN R OUT Remarks R 2 to R3 R 1 R 2 to R3 R 1 LL ×× H H Standby mode 1 (DC/DC converter is stopped) LHL × H H Standby mode 2 (DC/DC converter is stopped, R 2 and R 3 are operated) LHH × L H Standby mode 2 (DC/DC converter is stopped, R 2 and R 3 are operated) H × L H Mark level input H × H L Space level input

3 V ↔ 5 V switchingNote 5

L 5 V mode (double step-up) H 3 V mode (3 times step-up) H: high-level, L: low-level, Z: high-impedance, ×: H or L Note 5. When switching VCHA , standby mode must be selected (STBY = L).

µPD4723 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Symbol Ratings Unit Supply Voltage (VCHA = L) V CC –0.5 to +7.0 V Supply Voltage (VCHA = H) V CC –0.5 to +4.5 V Driver Input Voltage D IN –0.5 to VCC +0.5 V Receiver Input Voltage R IN –30.0 to +30.0 V Control Input Voltage (STBY, VCHA , EN) V IN –0.5 to VCC +0.5 V Driver Output Voltage D OUT –25.0 to +25.0Note 6 V Receiver Output Voltage R OUT –0.5 to VCC +0.5 V Input Current (DIN, STBY, VCHA , EN) I IN ±20.0 mA Operating Ambient Temperature T A –40 to +85 °C Storage Temperature T stg –55 to + 150 °C Total Power Dissipation P T 0.5 W Note 6. Pulse width = 1 ms, duty = 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (VCHA = L, 5 V mode) V CC 4.5 5.0 5.5 V Supply Voltage (VCHA = H, 3 V mode) V CC 3.0 3.3 3.6 V High-Level Input Voltage (DIN)V IH 2.0 V CC V Low-Level Input Voltage (DIN)V IL 0 0.8 V High Level Input Voltage (STBY, VCHA , EN) V IH 2.4 V CC V Low Level Input Voltage (STBY, VCHA , EN) V IL 0 0.6 V Receiver Input Voltage R IN –30 +30 V Operating Ambient Temperature T A –40 +85 °C Capacitance of External Capacitor Note 7 0.33 4.7 µF Note 7. In low temperature (below 0 °C), the capacitance of electrolytic capacitor becomes lower. Therefore, set higher values when using in low temperature. Concerning the wiring length between the capacitor and the IC, the shorter the better. Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the external capacitors.

µPD4723 ELECTRICAL SPECIFICATIONS (TOTAL) (UNLESS OTHERWISE SPECIFIED, T A = –40 to +85 °C, C1 to C5 = 1 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit VCC = +3.3 V, No load, RIN pin OPEN, 14 mA Circuit Current I CC1 STBY = H VCC = +5.0 V, No load, RIN pin OPEN, 10 mASTBY = H VCC = +3.3 V, RL = 3 kΩ (DOUT ), DIN = GND, 35 mA Circuit Current I CC2 R IN, ROUT pin OPEN, STBY = H VCC = +5.0 V,RL = 3 kΩ (DOUT ), DIN = GND, 28 mAR IN, ROUT pin OPEN, STBY = H VCC = +3.3 V, No load, DIN and RIN pins are 1 3 µA OPEN, STBY = L, EN = L, TA = 25 °C Circuit Current at Standby ICC3 VCC = +3.3 V, No load, DIN and RIN pins are 5 µA (Standby Mode 1) OPEN, STBY = L, EN = L VCC = +5.0 V, No load, DIN and RIN pins are 2 5 µA OPEN, STBY = L, EN = L, TA = 25 °C VCC = +5.0 V, No load, DIN and RIN pins are 10 µA OPEN, STBY = L, EN = L V CC = +3.3 V, No load, DIN and RIN pins are 1 3 µA OPEN, STBY = L, EN = H, TA = 25 °C Circuit Current at Standby ICC4 VCC = +3.3 V, No load, DIN and RIN pins are 5 µA (Standby Mode 2) OPEN, STBY = L, EN = H VCC = +5.0 V, No load, DIN and RIN pins are 2 5 µA OPEN, STBY = L, EN = H, TA = 25 °C VCC = +5.0 V, No load, DIN and RIN pins are 10 µA OPEN, STBY = L, EN = H High-Level Input Voltage V IH VCC = +3.0 to +5.5 V, STBY, VCHA , EN pin 2.4 V Low-Level Input Voltage V IL VCC = +3.0 to +5.5 V, STBY, VCHA , EN pin 0.6 V High-Level Input Current I IH VCC = +5.5 V, VI = 5.5 V, STBY, VCHA , EN pin 1 µA Low-Level Input Current I IL VCC = +5.5 V, VI = 0 V, STBY, VCHA , EN pin –1 µA Driver input and receiver input 10 pF Input Capacitance C IN VCC = +3.3 V, for GND, f = 1 MHz Driver input and receiver input 10 pF VCC = +5.0 V, for GND, f = 1 MHz STBY — V CHA Time t SCH VCC = +3.0 to 5.5 V, STBY ↓ → VCHA ,Note 8 1 µs VCHA — STBY Time t CHS VCC = +3.0 to 5.5 V, VCHA → STBY ↑ ,Note 8 1 µs STBY — V CC Time t SC VCC = +3.0 to 5.5 V, STBY ↓ → VCC ,Note 8 1 µs VCC — STBY Time t CS VCC = +3.0 to 5.5 V, VCC → STBY ↑,Note 8 1 µs * The TYP. values are for reference at TA = 25 °C.

µPD4723 Note 8. Measuring point 3.3 V 0.6 V 2.4 V 0.6 V 0.6 V 0.6 V 2.4 V 0.6 V 4.5 V 3.6 V 4.5 V 3.6 V tSCH tCHS tSCH tCHS tSC tCS tSC tCS 5 V 0.6 V 0 V 3.3 V 5 V 0 V STBY VCHA VCC 3.3 V

µPD4723 ELECTRICAL SPECIFICATIONS (DRIVER) (UNLESS OTHERWISE SPECIFIED, T A = –40 to +85 °C, C1 to C5 = 1 µF) 3 V mode (unless otherwise specified, VCHA = H, VCC = 3.0 to 3.6 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit Low-Level Input Voltage V IL 0.8 V High-Level Input Voltage V IH 2.0 V Low-Level Input Current I IL VCC = +3.6 V, VI = 0 V –25 µA High-Level Input Current I IH VCC = +3.6 V, VI = 3.6 V 1.0 µA VCC = +3.3 V, RL = ∞ , TA = 25 °C ±9.5 V Output Voltage V DO VCC = +3.3 V, RL = 3 kΩ , TA = Topt ±5.0 ±6.0 V VCC = +3.0 V, RL = 3 kΩ , TA = +25 °C ±5.0 V Output Short-Circuit Current I SC VCC = +3.3 V, for GND ±40 mA Slew-RateNote 9 SR C L = 10 pF, RL = 3 to 7 kΩ 3.0 30 V/ µs C L = 2 500 pF, RL = 3 to 7 kΩ 3.0 30 V/ µs Propagation Delay TimeNote 9 tPHL R L = 3 kW, CL = 2 500 pF 2.5 µstPLH Output Resistor R O VCC = VDD = VSS = 0 V 300 ΩVOUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ , CL = 2 500 pF,Note 10 41 0 µs Standby Output Transfer Time t DZA R L = 3 kΩ , CL = 2 500 pF,Note 10 13 m s Power-On Output Transfer Time t PRA R L = 3 kΩ , CL = 2 500 pF,Note 11 13 m s * The TYP. values are for reference at TA = 25 °C.

µPD4723 5 V mode (unless otherwise specified, VCHA = L, VCC = +5.0 V ± 10 %) Parameter Symbol Conditions MIN. TYP. MAX. Unit Low-Level Input Voltage V IL 0.8 V High-Level Input Voltage V IH 2.0 V Low-Level Input Current I IL VCC = +5.5 V, VI = 0 V –40 µA High-Level Input Current I IH VCC = +5.5 V, VI = 5.5 V 1.0 µA VCC = +5.0 V, RL = ∞ , TA = 25 °C ±9.7 V Output Voltage V DO VCC = +5.0 V, RL = 3 kΩ , TA = Topt ±6.0 V VCC = +4.5 V, RL = 3 kΩ , TA = Topt ±5.0 V Output Short-Circuit Current I SC VCC = +5.0 V, for GND ±40 mA Slew-RateNote 9 SR C L = 10 pF, RL = 3 to 7 kΩ 4.0 30 V/ µs C L = 2 500 pF, RL = 3 to 7 kΩ 4.0 30 V/ µs Propagation Delay TimeNote 9 tPHL R L = 3 kΩ , CL = 2 500 pF 2 µstPLH Output Resistor R O VCC = VDD = VSS = 0 V 300 ΩVOUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ , CL = 2 500 pF,Note 10 41 0 µs Standby Output Transfer Time t DZA R L = 3 kΩ , CL = 2 500 pF,Note 10 0.5 1 ms Power-On Output Transfer Time t PRA R L = 3 kΩ , CL = 2 500 pF,Note 12 0.5 1 ms * The TYP. values are for reference at TA = 25 °C. Note 9. Measuring point 0.8 V 2.0 V +5 V +3 V –3 V SR + SR – –3 V +3 V –5 V tPLH tPHL VCC 0 V VDO + VDO – D IN D OUT

µPD4723 Note 10. Measuring point 0.6 V 2.4 V +5 V –5 V +5 V –5 V High-impedance tDAZ tDZA VCC 0 V VDO + VDO – STBY D OUT Driver outputs are indefinite during transition time (tDZA ). Note 11. Measuring point High-impedance 3.0 V 3.3 V 0 V VCC VDO + VDO – D OUT +5 V –5 V tPRA Driver outputs are indefinite during transition time (tPRA ). Note 12. Measuring point High-impedance 4.5 V 5 V 0 V VCC VDO + VDO – D OUT +5 V –5 V tPRA Driver outputs are indefinite during transition time (tPRA ).

µPD4723 ELECTRICAL SPECIFICATIONS (RECEIVER) (UNLESS OTHERWISE SPECIFIED, V CC = 3.0 to 5.5 V, TA = –40 to +85 °C, C1 to C5 = 1 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit Low-Level Output Voltage V OL IOUT = 4 mA, STBY = H 0.4 V High-Level Output Voltage V OH IOUT = –4 mA , STBY = H VCC – 0.4 V Low-Level Output Voltage V OL2 IOUT = 4 mA, STBY = L 0.5 V High-Level Output Voltage V OH2 IOUT = 4 mA, STBY = L VCC – 0.5 V Propagation Delay Time t PHL R IN → ROUT , CL = 150 pF 0.2 µs (STBY = H) t PLH VCC = +3.0 V,Note 13 Propagation Delay Time t PHL R IN → ROUT , CL = 150 pF 0.1 µs (STBY = L) t PLH VCC = +3.0 V,Note 14 Propagation Delay Time t PHA EN → ROUT , CL = 150 pF 100 300 ns (STBY = L) t PAH VCC = +3.0 V,Note 15 Input Resistor R I 3 5.5 7 k Ω Input Pin Open Voltage V IO 0.5 V Input Threshold V IH VCC = +3.0 to +5.5 V, RIN1, RIN2 2.7 1.5 V (STBY = L, EN = H) VIL VCC = +3.0 to +5.5 V, RIN1, RIN2 1.5 0.7 V Standby Output Transfer Time t DAH Note 16 0.2 1 µs Standby Output Transfer Time t DHA VCHA = H (3 V mode)Note 16 0.6 3 ms VCHA = L (5 V mode)Note 16 0.3 1 ms Power-On Reset Release Time t PRA VCHA = H (3 V mode)Note 17 13 m s VCHA = L (5 V mode)Note 18 0.5 1 ms * The TYP. values are for reference at TA = 25 °C.

µPD4723 Note 13. Measuring point 0.7 V 2.7 V 2.0 V 0.8 V tPLH tPHL +3 V 0 V –3 V VOH VOL R IN R OUT Note 14. Measuring point +3 V 0 V –3 V VOH VOL R IN R OUT 2.0 V 0.8 V 0.7 V 2.7 V tPLH tPHL Note 15. Measuring point 2.4 V 0.6 V 0.8 V 2.0 V tPHA tPAH VCC 0 V VOH VOL EN R OUT STBY = L

µPD4723 Note 16. Measuring point 0.6 V 2.4 V 2.0 V 0.8 V tDAH tDHA VCC 0 V VOH VOL STBY R OUT Receiver outputs are indefinite during transition time (tDHA ). Note 17. Measuring point 0 V VOH VOL 3.3 V VCC R OUT 3.0 V 0.8 V tPRA Receiver outputs are indefinite during reset release time (tPRA ). Note 18. Measuring point 0 V VOH VOL 5 V VCC R OUT 4.5 V 0.8 V tPRA Receiver outputs are indefinite during reset release time (tPRA ). REFERENCE MATERIAL

• IC PACKAGE MANUAL (C10943X)
• NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212)

µPD4723 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SMT MANUAL” (C10535E). µPD4723GS-GJG Soldering process Infrared ray reflow VPS Wave soldering Partial heating method Soldring conditions Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None Solder temperature: 260 °C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit*: None Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None Symbol IR30-00-2 VP15-00-2 WS60-00-1 * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”.

µPD4723 PACKAGE DRAWINGS P30GS-65-300B-1 ITEM MILLIMETERS INCHES NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 10.11 MAX. 0.51 MAX. 0.65 (T.P.) 0.30 0.125 ±0.075 2.0 MAX. 1.7 ±0.1 8.1 ±0.2 6.1 ±0.2 1.0 ±0.2 0.15 0.5 ±0.2 0.10 0.10 0.398 MAX. 0.020 MAX. 0.026 (T.P.) 0.012 0.005 ±0.003 0.079 MAX. 0.067 ±0.004 0.319 ±0.008 0.240 ±0.008 0.039 0.006 0.020 0.004 0.004 +0.008 –0.009 A B C D E F G H I J K L M N +0.10 –0.05 +0.10 –0.05 +0.004 –0.002 +0.004 –0.003 +0.009 –0.008

30 PIN PLASTIC SHRINK SOP (300 mil)

I M M D C N K detail of lead end E F G B H L J A +7° –3°

µPD4723 [MEMO]

µPD4723 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5