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Technical content
www.centralsemi.com R2 (4-March 2010) Package Details D2PAK Case Mechanical Drawing Mounting Pad Geometry (Dimensions in mm) Part Marking: Full Part Number Lead Code: Reference individual device datasheet.
www.centralsemi.com R2 (4-March 2010) Package Details D2PAK Case Tape Dimensions and Orientation (Dimensions in mm) Direction of Unreeling Devices are taped in accordance with Electronic Industries Association Standard EIA-481-2-A Tape Width: 24mm Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Lot Number, Date Code and Ship Date.
Ordering Information
- For devices taped and reeled on 13” reels, add TR13 suffix to part number.
- All SMDs are available in small quantities for prototype and manual placement applications. Packaging Base 13” Reel = 800 pcs. Reel Packing Information Reel Size Reels per Box (Maximum) Parts per Box (Maximum) Box Dimensions Shipping Weight (Max.) INCH CM LB KG 13” 2,400 5,600 11,200 15x4x15 15x15x9 15x15x18 38x10x38 38x38x23 38x38x46
Material Composition Specification D2PAK Case www.centralsemi.com R2 (3-June 2011) Component Material Material Substance CAS No. Substance (%wt) (mg) (%wt) (mg) (ppm) active device doped Si 0.44% 6.42 Si 7440-21-3 0.44% 6.42 4,397 leadframe Cu alloy 64.56% 943 Cu 7440-50-8 64.52% 942 645,224 Fe 7439-89-6 0.03% 0.5 342 die attach high temperature solder paste 1.13% 16.5 Pb 7439-92-1 1.04% 15.25 10,446 Sn 7440-31-5 0.06% 0.825 565 Ag 7440-22-4 0.03% 0.412 282 encapsulation* EMC 31.98% 467 silica 7631-86-9 21.75% 317.5 217,472 epoxy resin 29690-82-2 6.4% 93.4 63,974 phenol resin 9003-35-4 3.2% 46.67 31,967 Sb2O3 1309-64-4 0.32% 4.67 3,199 Br 7726-95-6 0.32% 4.67 3,199 EMC GREEN 31.98% 467 silica (fused) 60676-86-0 24.62% 359.5 246,240 epoxy resin 29690-82-2 3.2% 46.73 32,008 phenol resin 9003-35-4 3.1% 45.28 31,015 carbon black 1333-86-4 0.1% 1.4 959 metal hydroxide 1309-42-8 0.96% 14.0 9,589 plating** tin/lead process 1.89% 27.6 Sn 7440-31-5 1.7% 24.88 17,042 Pb 7439-92-1 0.19% 2.76 1,890 matte tin 1.89% 27.6 Sn 7440-31-5 1.89% 27.64 18,932 *EMC GREEN molding compound is Halogen-Free. **For Lead Free plating, add suffix “LEAD FREE” to part number. For Tin/Lead plating, add suffix “TIN/LEAD” to part number. No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability. Disclaimer The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is n o guarantee to completeness or accuracy, as some information is derived from data sources outside the company.