A5G19H605W19N NXP

Document overview

  • Manufacturer or author: Provided By www.digicamel.com(free datasheet download site)
  • PDF pages: 15

Technical content

Datasheet sections

  • 1 General description
  • 2 Features and benefits
  • 3 Typical performance
  • 4 Pinning information
  • 5 Ordering information
  • 6 Product marking
  • 7 Limiting values
  • 8 Recommended operating conditions
  • 9 Thermal characteristics
  • 10 ESD protection characteristics
  • 11 Moisture sensitivity level
  • 12 Electrical characteristics
  • 12.1 DC characteristics — off characteristics
  • 12.2 DC characteristics — on characteristics
  • 12.3 Functional tests
  • 12.4 Wideband ruggedness
  • 12.5 Typical performance
  • 13 Component layout and parts list
  • 13.1 Component layout
  • 13.2 Component designations and values
  • 14 Package information
  • 15 Product documentation, software and tools
  • 16 Revision history

1 General description

requiring very wide instantaneous bandwidth capability covering the frequency range of 1930 to 1995 MHz. This part is characterized and performance is guaranteed for applications operating in the 1930 to 1995 MHz band. There is no guarantee of performance when this part is used in applications designed outside of these frequencies.

2 Features and benefits

  • High terminal impedances for optimal broadband performance
  • Advanced high performance in-package Doherty
  • Improved linearized error vector magnitude with next generation signal
  • Able to withstand extremely high output VSWR and broadband operating conditions
  • Plastic package

3 Typical performance

Table 1. 1900 MHz — Typical Doherty single-carrier W-CDMA production test fixture performance [1] All data measured with device soldered to NXP production test fixture.

4 Pinning information

5 Ordering information

Table 2. Ordering information

6 Product marking

Table 3. Product marking trace code

7 Limiting values

Table 4. Limiting values

8 Recommended operating conditions

Table 5. Recommended operating conditions

9 Thermal characteristics

Table 6. Thermal characteristics

10 ESD protection characteristics

Table 7. ESD protection characteristics

11 Moisture sensitivity level

Table 8. Moisture sensitivity level

12.1 DC characteristics — off characteristics

Table 9. DC characteristics — off characteristics [1] Each side of device measured separately.

12.2 DC characteristics — on characteristics

Table 10. DC characteristics — on characteristics

12.3 Functional tests

Table 11. Functional tests [1] Internally matched part.

12.4 Wideband ruggedness

Table 12. Wideband ruggedness

12.5 Typical performance

Table 13. Typical performance [1] All data measured with device soldered to NXP production test fixture.

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 6 / 15 Correct biasing sequence for GaN depletion mode transistors in a Doherty configuration Bias ON the device 1. Set gate voltage VGSA and VGSB to –5 V. 2. Set drain voltage VDSA and VDSB to nominal supply voltage (+48 V). 3. Increase VGSA (carrier side) until IDQA current is attained. 4. Increase VGSB (peaking side) to target bias voltage. 5. Apply RF input power to desired level. Bias OFF the device 1. Disable RF input power. 2. Adjust gate voltage VGSA and VGSB to –5 V. 3. Adjust drain voltage VDSA and VDSB to 0 V. Allow adequate time for drain voltage to reduce to 0 V from external drain capacitors. 4. Disable VGSA and VGSB.

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 7 / 15

13 Component layout and parts list

13.1 Component layout

A5G19H605W19N production test fixture component layout aaa-054102Note: All data measured with device soldered to NXP production test fixture. VDDA VDDB VGGA VGGB Z1 Q1 C30 C29 C7C5 C3C1 C14 C15 C13 C11 C27 D187245 C28 C26 C24 C25 C22 C23 C21 C12 C10 R1 C2 C20 C18 C19 C16 C17 A5G19H605W19N Rev. 2

13.2 Component designations and values

Table 14. A5G19H605W19N production test fixture component designations and values

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 9 / 15 Package outline (OM-780-4S4S)

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 10 / 15 Package outline (OM-780-4S4S) — bottom view

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 11 / 15 Package outline (OM-780-4S4S) — notes, dimensions

15 Product documentation, software and tools

Refer to the following resources to aid your design process.

  • AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software
  • .s2p file Development tools
  • Printed circuit boards The following table summarizes revisions to this document.

Table 15. Revision history

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 13 / 15 Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied pri or to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life- critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause perman ent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer, No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors A5G19H605W19N Airfast RF Power GaN Transistor Product data sheet Rev. 1 — 20 March 2024 14 / 15 Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors f or any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. Airfast — is a trademark of NXP B.V.