D14D NSC | Alldatasheet
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ores oF? [a] otsenrerion ec nt Tarr [i [REVISE AND REDRAW PER NEW STANDARD.| 10257 | 62.08/94 | 0EG/TP__| [La 355 Masa SORT ET towne [ossaorae oror | ifdt031 u 3 210-.308 (5287-15) eS —— Le we feta 502,005, TP erste 03s 12.16) 008. 0,131 IN 090+, 008 wit Ne Tre 3 oat | IMAI wh ; 225, wn ntgs0°S) o18+,002. TYP =| LK al 0108-902 oe {0630051 40 11.021 was 1 5 wn [0.258298 ] too 2,010. 11 Me 2 ie Sas0! 95) 300,010 itee 0-251 CONTROLLING DIMENSION IS_INCH NoTES VALUES IN C1 ARE MILLIMETERS MIL-M-38510 UNLESS OTHERWISE SPECIFIED. CONFIGURATION CONTROL 1. LEAD FINISH TO BE ONE OF THE FOLLOWING MIL/AERO 0. 200 MICROINCHES/5,08 MICROMETERS MINIMUM SOLDER MEASURED AT THE CREST OF THE MAJOR FLATS: CONFIGURATION CONTROL b. 50 MICROINCHES/1.27 MICROMETERS MINIMUM GOLD OVER 50 [ APPROVALS | DATE | WATIONAL SEMICONDUCTOR CORPORATION Fo Soo MlCHOINCHES/ 1" 21°10. 8.68 MICROMETERS AICREL.UNDERPLATE 2. LEAD FIMISH, HICREL UNDERPLATE AND BASIS ETAL SHALL. CONFORM YO'TWE' REQUIREMENTS. OF AIL "W=385t0 aaa — DIP, SIDEBRAZED 3. DIMENSION 005 1N/0.12nn WEN IMUM SHALL. BE WEASURED FROM a CERAMIC, THE EDGE OF THE FURTHEST EXTENSION OF THE METAL PAD OR LEAD a 14 LEAD 4, REFERENCE JEDEC REGISTRATION MS-015, VARIATION AB, DATED 7/90 ros oe al ae ~ ©} La Tel wt-oran 15