CX77105 SKYWORKS | Alldatasheet
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© 2001, 2002 Skyworks Solutions, Inc., All Rights Reserved. December 10, 2002 CX77105 Power Amplifier Module for CDMA/AMPS (824–849 MHz) The CX77105, a dual-mode, Code Division Multiple Access (CDMA) / Advanced Mobile Phone Service (AMPS) Power Amplifier Module (PAM), is a fully matched, 10-pin surface mount module developed for cellular handsets and wireless local loop applications. This small and efficient power amplifier module packs a full 824–849 MHz bandwidth coverage into a single compact package. The device meets the stringent IS95 CDMA linearity requirements to and exceeding 28 dBm output power, and can be driven to levels beyond 31 dBm for high efficiency in FM mode operation. A low current digital pin (VCONT) provides improved efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. The output match is realized off-chip and within the module package to optimize efficiency and power performance into a Ω load. This device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the CX77105 is supplied directly from a three-cell nickel cadmium, a single-cell lithium ion, or other suitable battery with an output in the 3–4 volt range. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery. Functional Block Diagram MMIC MODULE RF IN (4) (8) RF OUT VCC1 (3, 7, 9, 10) GND (3, 7, 9, 10) GND VCC2VREF DriverDriver Stage BiasStage Bias PowerPower Stage BiasStage Bias InputInput MatchMatch DADA InterInter StageStage MatchMatch PAPA OutputOutput MatchMatch (1) (5) (6) VCONT (2) Distinguishing Features Low voltage positive bias supply (3.2 V to 4.2 V, typical) Good linearity High efficiency Dual mode operation Large dynamic range 10-pin package (4 x 4 x 1.5 mm) Power down control Low power-state control I n G a P IS 95/CDMA2000
Applications
Digital cellular (CDMA) Analog cellular (AMPS) Wireless local loop (WLL)
Table 4. Table 3 lists the electrical performance of the CX77105 Power Amplifier over the recommended operating conditions. Table 1. Absolute Maximum Ratings(1) Table 2. Recommended Operating Conditions Table 3. Power Range Truth Table
Table 4. Electrical Specifications for CDMA / AMPS Nominal Operating Conditions(1)
(1) VCC = +3.4 V, VREF = +3.0 V, Freq = 836.5 MHz, TC = 25 °C, unless otherwise specified. (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB back-off in output power is required. (4) All phases, time = 10 seconds. Table 5. Electrical Specifications for CDMA / AMPS Recommended Operating Conditions(1)
1.25 MHz
1.98 MHz
(1) Per Table 2, unless otherwise specified. (2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB back-off in output power is required. (4) All phases, time = 10 seconds.
both nominal and the full range of recommended operating conditions, including worst case limits. Figure 1. Digital Mode Gain vs. Output Power
Figure 10. Evaluation Board Schematic Figure 11. Evaluation Board Assembly Diagram
3 GND
5 VCC1 VCC2 6
2 VCONT
4 RF IN
1 VREF
Table 6. Pin Descriptions
1 VREF 5 VCC1 (1) 9 GND
3 GND 7 GND GND PAD (2) GND
4 RF IN 8 RF OUT
(1) All supply pins may be connected together at the supply. (2) GROUND PAD is package underside. Figure 13. Typical Case Markings
Power Amplifier Module for CDMA/AMPS (824–849 MHz) 14 Skyworks Solutions, Inc. Proprietary 101787A December 10, 2002 Package and Handling Information Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The CX77105 is capable of withstanding an MSL 3/240 °C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second; maximum temperature should not exceed 240 °C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 °C for more than 10 seconds. For details on both attachment techniques, precautions, and handling procedures recommended by Skyworks, please refer to Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J–STD–020B. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
pins marked > 2000 V pass 2000V ESD stress. fails devices as soon as the pin begins to show any degradation on a curve tracer. test areas follow the Class-1 ESD handling precautions listed in Table 7. Figure 14. ESD Sensitivity Ares (Top View) Table 7. Precautions for GaAs ICs with ESD Thresholds Greater Than 200 V But Less Than 2000 V
© 2001, 2002, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and produc t descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibili ty whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product desc riptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Exce pt as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY , PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT , COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT , GRAPHICS OR OTHER ITEMS CONT AINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS. Skyworks™ products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling Skyworks™ products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: Skyworks ™ , the Skyworks symbol, and "Breakthrough Simplicity" ™ . Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parti es. Third- party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.
Ordering Information
Revision History
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel, Document Number 101568 JEDEC Standard J–STD–020B. Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX77105 CX77105-16P 16 4x4LM-10 –30 °C to +85 °C Revision Level Date Description A December 10, 2002 Initial Release
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