CX6SM-AT RSG | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de SYSTE M C ERTIFICA TION ISO 9001 10117 - Rev B

DESCRIPTION

STATEK’s miniature CX6SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals have a small land pattern and a low profile. They are manufactured using the STATEK-developed photolithographic process, and were designed utilizing the experience acquired by producing millions of crystals for industrial, commercial, military and medical applications.

FEATURES

Ultra low profile (less than 1 mm available) hermetically sealed ceramic package Designed for surface mount applications using infrared, vapor phase, or epoxy mount techniques. Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA

APPLICATIONS

Industrial, Computer & Communications Down-hole Data Recorder Environmental Controls Handheld Inventory Control Telemetry Military & Aerospace Communications Smart Munitions Timing Devices (Fuzes) Surveillance Devices CX6SM AT CRYSTAL

9.6 MHz to 250 MHz

Ultra-Low Profile Miniature Surface Mount AT Quartz Crystal Fundamental Mode: 9.6 MHz - 250 MHz Third Overtone Mode: 48 MHz - 160 MHz A B D D TOP BOTTOM C TYPICAL MAXIMUM DIM inches mm inches mm A 0.265 6.73 0.280 7.11 B 0.103 2.62 0.114 2.90 C - - see below D 0.050 1.27 0.060 1.52 THICKNESS (DIM C) MAXIMUM GLASS LID CERAMIC LID inches mm inches mm SM1 0.039 0.99 0.053 1.35 SM2/SM4 0.041 1.04 0.055 1.40 SM3/SM5 0.044 1.12 0.058 1.47 PACKAGE DIMENSIONS actual size side view SXXXX Pb glass lid ceramic lid

HOW TO ORDER CX6SM AT CRYSTALS CX6 S C SM1 – 32.0M , 100 / 100 / — / I RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de SYSTE M C ERTIFICA TION ISO 9001 0.070 (1.78) 0.215 (5.46) 0.120 (3.05) inches (mm) 10117 - Rev B TERMINATIONS Designation Termination SM1 Gold Plated (Lead Free) SM2 Solder Plated SM3 Solder Dipped SM4 Solder Plated (Lead Free) SM5 Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. PACKAGING

  • Tray Pack
  • Tape and Reel Per EIA 481 (see Tape and Reel data sheet 10109) SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 10 MHz 32 MHz 155.52 MHz Motional Resistance R1 (Ω ) 60 25 10 Motional Capacitance C1 (fF) 2.8 6.2 4.0 Quality Factor Q (k) 95 30 30 Shunt Capacitance C0 (pF) 1.4 2.3 2.3 Calibration Tolerance1 100 ppm, or tighter as required Load Capacitance2 20 pF for f ≤ 50 MHz 10 pF for f > 50 MHz Drive Level 500 µW MAX for f ≤ 50 MHz 200 µW MAX for f > 50 MHz Frequency-Temperature 50 ppm to 10 ppm (Commercial) Stability1,3 100 ppm to 20 ppm (Industrial) 100 ppm to 30 ppm (Military) Aging, first year3 5 ppm MAX (below 1 ppm available) Shock, survival4 3,000 g, 0.3 ms, 1/2 sine Vibration, survival5 20 g, 10-2,000 Hz swept sine Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. 1. Other tolerances available. Contact factory. 2. Unless specified otherwise. 3. Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 5. Higher shock version available. 6. Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. +_+_ +_+_ +_+_ +_ SUGGESTED LAND PATTERN Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified Calibration Tolerance @ 25OC (in ppm) Frequency M = MHz C = Ceramic Lid Blank = Glass Lid SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) O.T. = 3rd Overtone Mode Blank = Fundamental Mode Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified Frequency Stability over Temp. Range (in ppm) “S” if special or custom design. Blank if Std. Total Frequency Tolerance (in ppm) OR Pb C1 R1 21 L1 EQUIVALENT CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance — / — / 200 / I