CX4SM-AT RSG | Alldatasheet
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Technical content
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de SYSTE M C ERTIFICA TION ISO 9001
DESCRIPTION
STATEK’s ultra-miniature CX4SM AT crystals in leadless ceramic packages are designed for surface mounting on printed circuit boards or hybrid substrates. These crystals are low profile and have a very small land pattern.
FEATURES
Designed for surface mount applications using infrared, vapor phase, wave solder or epoxy mount techniques. Low profile (less than 1.2 mm) hermetically sealed ceramic package Excellent aging characteristics Available with glass or ceramic lid High shock and vibration resistance Custom designs available Full military testing available Designed and manufactured in the USA
APPLICATIONS
Industrial, Computer & Communications Instrumentation Process Control Environmental Control Engine Control Handheld Inventory Control Down-hole Data Recorder Telemetry Military & Aerospace Communications Radio Smart Munitions Timing Devices (Fuzes) Surveillance Devices CX4SM AT CRYSTAL
14 MHz to 250 MHz
Ultra-Miniature, Low Profile Surface Mount AT Quartz Crystal TYPICAL MAXIMUM DIM inches mm inches mm A 0.197 5.00 0.210 5.33 B 0.072 1.83 0.085 2.16 C - - see below D 0.036 0.91 0.046 1.16 E 0.020 0.51 - - F 0.025 0.64 - - THICKNESS (DIM C) MAXIMUM GLASS LID CERAMIC LID inches mm inches mm SM1 0.045 1.14 0.050 1.27 SM2/SM4 0.046 1.17 0.051 1.30 SM3/SM5 0.048 1.22 0.053 1.35 10150 - Rev. D A B F D D TOP BOTTOM C E PACKAGE DIMENSIONS SXXXX actual size side view Pb glass lid ceramic lid
HOW TO ORDER CX4SM AT CRYSTALS RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de SYSTE M C ERTIFICA TION ISO 9001 10150 - Rev. D CX4 S C SM1 – 32.0M , 100 / 100 / — / I C1 R1 21 L1 EQUIVALENT CIRCUIT R1 Motional Resistance L1 Motional Inductance C1 Motional Capacitance C0 Shunt Capacitance TERMINATIONS Designation Termination SM1 Gold Plated (Lead Free) SM2 Solder Plated SM3 Solder Dipped SM4 Solder Plated (Lead Free) SM5 Solder Dipped (Lead Free) Max Process Temperature 260OC for 20 sec. “S” if special or custom design. Blank if standard C = Ceramic Lid Blank = Glass Lid SM1 = Gold Plated (Lead Free) SM2 = Solder Plated SM3 = Solder Dipped SM4 = Solder Plated (Lead Free) SM5 = Solder Dipped (Lead Free) Frequency M = MHz Calibration Tolerance @25OC (in ppm) Frequency Stability over Temp. Range Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified Total Frequency Tolerance (in ppm) Operating Temp. Range: C = -10OC to +70OC I = -40OC to +85OC M = -55OC to +125OC S = Customer Specified OR — / — / 200 / I PACKAGING OPTIONS
- Tray Pack
- Tape and Reel Per EIA 481 (see Tape and Reel data sheet 10109) Pb 0.092 (2.3) inches (mm) 0.059 (1.5) 0.160 (4.0) SUGGESTED LAND PATTERN SPECIFICATIONS Specifications are typical at 25OC unless otherwise noted. Specifications are subject to change without notice. Fundamental Frequency 14.7456 MHz 16MHz 20 MHz 32 MHz 40 MHz 80 MHz 160 MHz 200 MHz Motional Resistance R1 (Ω ) 60 75 50 30 30 30 30 40 Quality Factor Q (k) 120 90 110 70 90 40 20 15 Calibration Tolerances1 100 ppm, or tighter as required Load Capacitance 10 pF (unless specified otherwise) Drive Level 200 µW MAX for f ≤ 50 MHz 100 µW MAX for f > 50 MHz Frequency-Temperature 50 ppm to 10 ppm (Commercial) Stability1,3 100 ppm to 20 ppm (Industrial) 100 ppm to 30 ppm (Military) Aging, first year3 5 ppm MAX (better than 1 ppm available) Shock, survival4 5,000 g, 0.3 ms, 1/2 sine Vibration, survival5 20 g, 10-2,000 Hz swept sine Operating Temp. Range -10OC to +70OC (Commercial) -40OC to +85OC (Industrial) -55OC to +125OC (Military) Storage Temp. Range -55OC to +125OC Max Process Temperature 260OC for 20 sec. 1) Other tolerances available. Contact factory. 2) Does not include calibration tolerance. The characteristics of the frequency stability over temperature follow that of the AT thickness-shear mode. 3) 5 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher frequencies contact factory. 4) Higher shock version available. 5) Per MIL-STD-202G, Method 204D, Condition D. Random vibration testing also available. +_+_ +_+_ +_+_