CTX17-18913-R EATON | Alldatasheet

Document overview

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Technical content

Description

  • High current multi-phase inductor
  • 100nH per phase coupled inductor
  • Ferrite core material
  • Patents pending
  • Halogen free, lead free, RoHS compliant

Applications

  • For exclusive use with Volterra® or Maxim® VPR-Devices Environmental Data
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Volterra® is a registered trademark of Volterra Semiconductor, LLC. Maxim® is a registered trademark of Maxim Integrated Devices, Inc. Pb HALOGEN HFFREE CTX17 -18913-R Multi-phase power inductor

Multi-phase power inductor www.eaton.com/elx Product Specifications Part Number5 Inductor phases OCL min1 @ 0.0Adc (nH) OCL min1 @ Isat1 (nH) Isat13 (amps) OCL min2 @ Isat2 (nH) Isat13 (amps) SCL4 (nH) Isat33 (amps) DCR ±10% @ 20°C (mΩ) CTX17-18913-R 2 380 200 30 200 30 100 90 0.3 Packaging information (mm) Supplied in tape and reel packaging, 200 parts per 13” diameter reel. Dimensions (mm) DCR measured from point “a” to point “b” Part marking: Pin 1 dot, 17-18913-R, wwllyy = date code, R = revision level Tolerances are ±0. 25 millimeters unless stated otherwise. All soldering surfaces to be be coplanar within 0.13 millimeters. Do not route traces or vias underneath the inductor 1. Open Circuit Inductance (OCL) Test parameters: 1MHz, 0.1Vrms, +25°C 2. Open Circuit Inductance (OCL) Test parameters: 1MHz, 0.1Vrms, +105°C 3. Isat1: Peak current at which OCL drops to 200nH min @ 25°C Isat2: Peak current at which OCL drops to 200nH min @ 105°C Isat3: Peak current at which SCL drops approximately 20% @ 105°C 4. Short Circuit Inductance (SCL) Test parameters: 1MHz, 0.1Vrms, 0.0Adc @25°C ±20% short pins 1 and 4, measure pins 2 and 3 and divide by 2. 5. This device is licensed for use only when incorporated within a voltage regulator employing power regulating devices manufactured by Volterra Semiconductor, LLC or Maxim Integrated Devices, Inc. No license is granted expressly or by implication to use this device with power regulating devices manufactured by any company other than Volterra or Maxim. 9.0 3.6 3.1 11.3 7.0 9.0±0.253.6±0.1 6.5±0.1 6.5±0.1 10.6±0.1 4.1±0.1 2.5±0.1 a b 10.0 max.11.0±0.5 18.0±0.5 Front view Recomended pad layout Schematic 17-18913-R wwllyy R Pin 1 Bottom viewTop view User direction of feedSection A-A 18.7 10.2 11.6 20.0 2.0 dia. A A 2.0 4.0 1.5 dia. 1.75 14.2 32±0.30

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 10272—BU-MC15056 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 10272 Effective November 2015 CTX17-18913-R Multi-phase power inductor Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C