CTX01-18738-R EATON | Alldatasheet

Document overview

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Technical content

Description

  • High current carrying capacity, low core losses
  • Tight tolerance DCR for sensing circuits
  • 11 x 8.0mm footprint surface mount package in a 7.5mm height
  • Frequency range up to 2MHz
  • Halogen free, lead free, RoHS compliant

Applications

  • Voltage Regulator Module (VRM)
  • Multi-phase and Vcore regulators
  • Point-of-load modules
  • Desktop and server VRMs and EVRDs
  • Base station equipment
  • Battery power systems
  • Graphics cards
  • Data networking and storage systems Environmental Data
  • Storage temperature range: -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE CTX01 -18738-R High current, high frequency power inductors

High current, high frequency power inductors www.eaton.com/elx Product Specifications Part Number6 OCL1 (nH) ±10% FLL2 (nH) minimum Irms (amps) Isat14 (amps) Isat25 (amps) DCR (mΩ) @20°C CTX01-18738-R 210 151 50 55 45 0.29 ± 5% 1.Open Circuit Inductance (OCL) Test Parameters: 300kHz, 0.10Vrms, 0.0Adc @ 25°C. 2. Full Load Inductance (FLL) Test Parameters: 300kHz, 0.10Vrms, Isat1 @ 25°C. 3. Irms: DC current for an approximate temperature rise of 20°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff at +25°C. 5. Isat2: Peak current for approximately 20% rolloff at +125°C. 6. Part Number Definition: CTX01-18738-R - CTX01-18738 = Product code and size - “-R” suffix = RoHS compliant Packaging information (mm) Dimensions (mm) T emperature rise vs. total loss 6.70 typ. Temperature Rise Total Loss (W) (°C) Part marking: CTX01-18738, wwllyy = Date Code, R = Revision Level All soldering surfaces must be coplanar within 0.102 millimeters. Tolerances are ±0.1 millimeters unless stated otherwise. The DCR is measured from point “a” to point “b”

High current, high frequency power inductors www.eaton.com/elx 0.00001 0.0001 0.001 0.01 0.1 001011 Core Loss (W) I( Amps) Core Loss vs. Ip-p 1MHz 500kHz 300kHz 200kHz 100kHz p-p 0.0% 10.0% 20.0% 30.0% 40.0% 50.0% 60.0% 70.0% 80.0% 90.0% 100.0% 01 02 03 04 05 06 07 08 0 % of OCL Isat1 (Amps) % of OCL vs. Isat1 Core loss Inductance characteristics

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4410 BU-SB11507 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4410 Effective November 2015 CTX01-18738-R High current, high frequency power inductors Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C