CSPRC030 CALMIRCO | Alldatasheet

Document overview

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Technical content

Features

  • Minimal Cross-Talk  4 Filter lines per device  Ultra small foot print  Silicon substrate  0.35mm Eutectic Solder Bumps Product Description Many portable applications frequently demand filtering of signals in the 800-2,700MHz band. California Micro Devices’ unique thin film Flip Chip filters provide a minimum of –30dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly

Applications

 Cellular Phones  Cordless Phones  Internet Appliances P D A s  Laptop Computers C1440800 SCHEMATIC DIAGRAM techniques. The pin-out for the device features a signal ‘flow through’ design, allowing optimal signal routing. Ground-bounce and cross-talk are minimized via a die design that provides two solder bump contacts to the common supply connection. The solder bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter. R 100 Ω R 100 Ω R 100 Ω R 100 Ω C 39pF GND A1 B1 C 39pF GND GND C 39pF GND A4 B4 C 39pF GND A5 B5 A2 B2 A3 B3 * Note 1: Calculated with 0Ω Source impedance and infinite Load impedance. * Note 2: Calculated with 50Ω Source impedance and 50Ω Load impedance. SEULAVDRADNATS rotsiseR0 01 Ω RecnareloTetulosbA% 01± roticapaCF p93 CecnareloTetulosbA% 02± srotsiseRfoRCTm pp001± egnaRerutarepmeTgnitarepOC °58otC°04– V6±@tnerruCegakaeLA µ1< rotsiseR/gnitaRrewoPW m52 SCITSIRETCARAHCLACIRTCELE retliF( R ΩΩΩΩΩ)) Fp(C) 1etoN(cF) 2etoN(cF CR0 019 3z HM04z HM901

©2000 California Micro Devices Corp. All rights reserved. Figure 2. CSPRC030 Package Diagram

118.5 MHz

1 GHz

HP85047A S-parameter Test Set.

© 2000 California Micro Devices Corp. All rights reserved. 9/20/2000 3 CSPRC030CALIFORNIA MICRO DEVICES 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com EGAKCAP NOITAMROFNIGNIREDROTRAPDRADNATS-NON seireStraP) XXX(eulaVrotsiseR) YYY(eulaVroticapaC )030CRPSC(elpmaxE0 01=(101 ΩΩΩΩΩ)) FP93=(093 tigiddrihT.eulavtnacifingiserastigid2tsriF .wollofotsorezforebmunstneserper tigiddrihT.eulavtnacifingiserastigid2tsriF .wollofotsorezforebmunstneserper PART NUMBER KEY PACKAGE TYPE APPLICATION Capacitor Value CSP = Chip Scale Package Resistor Capacitor Filter First 2 digits are significant value. 3rd digit represents number of zeros. Resistor Value First 2 digits are significant value. 3rd digit represents number of zeros. CSP RC030 XXX YYY Typical Solder Reflow Thermal Profile (No Clean Flux) 250 225 200 175 150 125 100 0 48 97 145 Time (s) Temperature ( o 194 242 290 339 387 435 EXHRFZ5Z4EXH PH Z2 Z3 CD