CSPESD304 CALMIRCO | Alldatasheet
Document overview
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Technical content
Features
- Four channels of ESD protection +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Chip Scale Package features extremely low lead inductance for optimum ESD protection 5-bump, 0.950mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available
Applications
ESD protection for sensitive electronic equipment I/O port and keypad and button circuitry protection for portable devices Can be used for EMI filtering when combined with external series resistance Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs Product Description The CSPESD 304 is a quad ESD transient voltage supression diode array. Each diode provides a very high level of protection for sensitive electronic compo- nents that may be subjected to electrostatic discharge (ESD). These diodes are designed and characterized to safely dissipate ESD strikes of 15kV, exceeding the maximum requirement of the IEC 61000-4-2 interna- tional standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 30kV. The CSPESD304 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPESD304 is available in a space-saving, low- profile Chip Scale Package with optional lead-free fin- ishing. Electrical Schematic ESD_1 GND C1 C3A1 A3 ESD_2 ESD_3 ESD_4
© 2003 California Micro Devices Corp. All rights reserved. CSPESD304
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a " +" character for the top side orientation mark. PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 ESD1 ESD Channel1 A3 ESD2 ESD Channel 2 B2 GND Device Ground C1 ESD3 ESD Channel 3 C3 ESD4 ESD Channel 4 ESD_1 ESD_2 ESD_3 ESD_4 A1 A3 C3C1 GND Orientation Marking E 231 C B A Orientation Marking (see note 2) PACKAGE / PINOUT DIAGRAMS Notes: CSPESD304 TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 1) These drawings are not to scale. 2) Lead-free devices are specified by using a " +" character for the top side orientation mark. PART NUMBERING INFORMATION Bumps Package Standard Finish Lead-free Finish2 Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking
5 CSP CSPESD304 E CSPESD304G E
© 2003 California Micro Devices Corp. All rights reserved. CSPESD304 Specifications Note 1: T A=-40 to +85°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Unused pins are left open Note 4: These parameters are guaranteed by design and characterization. ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage T emperature Range -65 to +150 °C STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VDIODE Diode Reverse Breakdown Voltage I DIODE = 10µA5 . 5 V ILEAK Diode Leakage Current V IN=3.3V, TA=25°C 100 nA VSIG Signal Voltage Positive Clamp Negative Clamp I DIODE = 10mA 5.6 -0.4 6.8 -0.8 9.0 -1.5 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2, 3 and 4 +30 +15 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2, 3 and 4 +15 V V C DIODE Diode Capacitance At 2.5VDC Reverse Bias, 1MHz, 30mVAC 22 27 32 pF
© 2003 California Micro Devices Corp. All rights reserved. Figure 6. Tape and Reel Mechanical Data P1only including draft.Concentric around B.