CSPESD301 CALMIRCO | Alldatasheet
Document overview
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Technical content
Features
- 1, 2 or 3 channels of ESD protection ±15kV ESD protection (IEC 61000-4-2, contact discharge) ±30kV ESD protection (HBM) Supports both AC and DC signal applications Low leakage current (<100nA) Chip Scale Package features extremely low lead inductance for optimum ESD and filter perfor- mance 4 bump, 1.06 x 0.93mm footprint Chip Scale Pack- age (CSP) Lead-free version available
Applications
I/O port protection EMI filtering for data ports Cellphones, notebook computers, PDAs Wireless Handsets MP3 Players Digital Still Cameras Handheld PCs Product Description The CSPESD301/302/303 is a family of 1, 2, and 3- channel ESD protection arrays, which integrate two, three and four identical avalanche-style diodes. It is intended that one of these diodes is connected to GND and the other diodes provide ESD protection for up to 3 lines depending upon the configuration utilized. The back-to-back diode connections provide ESD protec- tion for nodes that have AC signals up to 5.9V peak. These devices provide a very high level of protection for sensitive electronic components that may be sub- jected to electrostatic discharge (ESD). The diodes are designed and characterized to safely dissipate ESD strikes of ±15kV, well beyond the maximum requirements of the IEC 61000-4-2 international stan- dard. Using the MIL-STD-883 (Method 3015) specifica- tion for Human Body Model (HBM) ESD, these devices protection against contact discharges at greater than ±30kV . The diodes also provide some EMI filtering, when used in combination with a PCB trace or series resistor. These devices are particularly well suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of their small package format and easy-to-use pin assignments. The CSPESD 301/2/3 is available in a space-saving, low-profile, chip-scale package with optional lead-free finishing. Electrical Schematics B1A2 B2B1A2 B2B1A2A1 CSPESD301 CSPESD302 CSPESD303
© 2003 California Micro Devices Corp. All rights reserved. CSPESD301/302/303
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a " +" character for the top side orientation mark. B2 B1 A1A2 Orientation Marking B A Orientation Marking (see note 2) PACKAGE / PINOUT DIAGRAMS Notes: CSPESD301/302/303 TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) * See ordering information for appropriate part marking. 1) These drawings are not to scale. 2) Lead-free devices are specified by using a " +" character for the top side orientation mark. 4-Bump CSP Package 3) All 4 bumps are always present. Unused bumps are electrically unconnected. PART NUMBERING INFORMATION Bumps Package Standard Finish Lead-free Finish2 Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking
4 CSP CSPESD301 F CSPESD301G F
4 CSP CSPESD302 G CSPESD302G G
4 CSP CSPESD303 H CSPESD303G H
© 2003 California Micro Devices Corp. All rights reserved. Note 1: TA=25°C unless otherwise specified. another diode, one at a time. Note 3: Unused pins are left open. Figure 1. Parameter Legend
© 2003 California Micro Devices Corp. All rights reserved. Figure 9. Tape and Reel Mechanical Data