CSPEMI606 CALMIRCO | Alldatasheet
Document overview
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Technical content
Features
- Six and eight channels of EMI filtering +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Better than 30dB of attenuation at 1GHz to 3GHz 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CSPEMI606) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CSPEMI608) Lead-free version available
Applications
LCD data lines in clamshell wireless handsets EMI filtering & ESD protection for high-speed I/O data ports Wireless handsets / cell phones Notebook computers PDAs / Handheld PCs EMI filtering for high-speed data lines Product Description CAMD's CSPEMI 606 and CSPEMI608 are EMI filter arrays with ESD protection, which integrate six and eight Pi- filters (C-R-C), respectively. The CSPEMI60x has component values of 15pF-100 Ω-15pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensi- tive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes con- nected to the filter ports are designed and character- ized to safely dissipate ESD strikes of ±15kV , beyond the maximum requirement of the IEC 61000-4-2 inter- national standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. This device is particularly well suited for portable elec- tronics (e.g. wireless handsets, PDAs, notebook com- puters) because of its small package format and easy- to-use pin assignments. In particular, the CSPEMI60x is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CSPEMI606 and C SPEMI608 are available in space-saving, low-profile chip-scale packages with optional lead-free finishing. Electrical Schematic 100Ω 15pF15pF FILTERn* GND FILTERn* * See Package/Pinout Diagram for expanded pin information. (Pins B1-Bn) 1 of n EMI Filtering + ESD Channels (n=6 for CSPEMI606, 8 for CSPEMI608)
© 2003 California Micro Devices Corp. All rights reserved. CSPEMI606/608 PRELIMINARY
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a " +" character for the top side orientation mark. FILTER5 FILTER6 GND FILTER5 FILTER6 A6A5 Orientation Marking C6C5 FILTER7 FILTER8 GND FILTER7 FILTER8 A8A7 C8C7 FILTER3 FILTER4 GND FILTER3 FILTER4 A4A3 C4C3 FILTER1 FILTER2 GND FILTER1 FILTER2 A2A1 C2C1 EMI608 4326 7 8 51 C B A Orientation Marking (see note 2) FILTER5 FILTER6 GND FILTER5 FILTER6 A6A5 Orientation Marking C6C5 FILTER3 FILTER4 GND FILTER3 FILTER4 A4A3 C4C3 FILTER1 FILTER2 GND FILTER1 FILTER2 A2A1 C2C1 606 4326 51 C B A Orientation Marking (see note 2) PACKAGE / PINOUT DIAGRAMS Notes: BOTTOM VIEW (Bumps Up View) TOP VIEW (Bumps Down View) 1) These drawings are not to scale. 2) Lead-free devices are specified by using a " +" character for the top side orientation mark. PIN DESCRIPTIONS CSPEMI606 CSPEMI608 NAME DESCRIPTION CSPEMI606 CSPEMI608 NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground PART NUMBERING INFORMATION Bumps Package Standard Finish Lead-free Finish2 Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking
15 CSP CSPEMI606 606 CSPEMI606G 606
20 CSP CSPEMI608 EMI608 CSPEMI608G EMI608
© 2003 California Micro Devices Corp. All rights reserved. CSPEMI606/608 PRELIMINARY Specifications Note 1: T A=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pi n A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization. ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage T emperature Range -65 to +150 °C DC Power per Resistor 100 mW STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating T emperature Range -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R Resistance 80 100 120 Ω C Capacitance At 2.5V DC, 1MHz, 30mV AC 12 15 18 pF VDIODE Diode Standoff Voltage I DIODE=10µA5 . 5 V ILEAK Diode Leakage Current (reverse bias) V DIODE=+3.3V 100 nA VSIG Signal Voltage Positive Clamp Negative Clamp I LOAD = 10mA 5.6 -0.4 6.8 -0.8 9.0 -1.5 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2,4 and 5 ±30 ±15 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative T ransients Notes 2,3,4 and 5 +12 V V fC Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω R=100Ω, C=15pF
120 MHz
© 2003 California Micro Devices Corp. All rights reserved. Figure 9. Filter Capacitance vs. Input Voltage over Temperature
© 2003 California Micro Devices Corp. All rights reserved. CSPEMI606/608 PRELIMINARY Mechanical Details CSPEMI606/608 devices are packaged in a custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. CSPEMI606 Mechanical Specifications The package dimensions for the CSPEMI606 are pre- sented below. Package Dimensions for CSPEMI606 Chip Scale Package PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Dim Millimeters Inches Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters Mechanical Package Diagrams A B C 3456 DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW 0.30 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
© 2003 California Micro Devices Corp. All rights reserved. CSPEMI606/608 PRELIMINARY Mechanical Details (cont’d) CSPEMI608 Mechanical Specifications The package dimensions for the CSPEMI608 are pre- sented below. Package Dimensions for CSPEMI608 Chip Scale Package PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Dim Millimeters Inches Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters Mechanical Package Diagrams A C 3456 DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW B A 0.30 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
© 2003 California Micro Devices Corp. All rights reserved. Figure 13. Tape and Reel Mechanical Data