CSPEMI400 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Three channels of EMI filtering, each with ESD protection
  • Two additional channels of ESD-only protection
  • ±10kV ESD protection (IEC 61000-4-2, contact discharge)
  • ±25kV ESD protection (HBM)
  • Greater than 30dB of attenuation at 1GHz
  • 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP)
  • Lead-free version available

Applications

  • SIM Card slot in mobile handsets
  • I/O port protection for mobile handsets, notebook computers, PDAs, etc.
  • EMI filtering for data ports in cell phones, PDAs or notebook computers Product Description The CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R- C) and two additional channels of ESD protection. The CSPEMI400 has component values of 20pF-47 Ω - 20pF, and 20pF-100 Ω -20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensiti ve electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greate r than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portabl e electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, low- profile Chip Scale Package with optional lead-free finishing.

Rev. 2 | Page 2 of 11 | www.onsemi.com Electrical Schematic Lead-free devices are specified by using a " +" character for the top side orientation mark.

Rev. 2 | Page 3 of 11 | www.onsemi.com PIN DESCRIPTIONS TYPE PIN DESCRIPTION A1 EMI Filter with ESD Protection for RST Signal EMI Filter C1 EMI Filter with ESD Protection for RST Signal A2 EMI Filter with ESD Protection for CLK Signal EMI Filter C2 EMI Filter with ESD Protection for CLK Signal B1 Device Ground Device Ground B2 Device Ground A3 DAT EMI Filter with ESD Protection EMI Filter C3 DAT EMI Filter with ESD Protection ESD Channel A4 ESD Proection Channel - V CC Supply ESD Channel C4 ESD Proection Channel

Ordering Information

PART NUMBERING INFORMATION Standard Finish Lead-free Finish Bumps Package Ordering Part Number Part Marking Ordering Part Number Part Marking

10 CSP CSPEMI400 AG CSPEMI400G AG

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a " +" character for the top side orientation mark.

Rev. 2 | Page 4 of 11 | www.onsemi.com Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage Temperature Range -65 to +150 ° C DC Power per Resistor 100 mW STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 ° C

Rev. 2 | Page 5 of 11 | www.onsemi.com ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance of R 1 80 100 120 Ω R2 Resistance of R 2 38 47 56 Ω C Capacitance V IN = 2.5VDC, 1MHz, 30mV ac 16 20 24 pF VSTANDOFF Stand-off Voltage I = 10 µ A 6.0 V ILEAK Diode Leakage Current V BIAS = 3.3V 300 nA VSIG Signal Voltage Positive Clamp Negative Clamp I LOAD = 10mA ILOAD = -10mA 5.6 -1.5 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2 and 4 ±25 ±10 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 +12 V V fC1 Cut-off frequency ZSOURCE = 50 Ω , Z LOAD = 50 Ω R = 100 Ω , C = 20pF 77 MHz fC2 Cut-off frequency ZSOURCE = 50 Ω , Z LOAD = 50 Ω R = 47 Ω , C = 20pF 85 MHz Note 1: T A=25 °C unless otherwise specified. Note 2: ESD applied to input and output pins with r espect to GND, one at a time. Note 3: Clamping voltage is measured at the opposit e side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open.

Rev. 2 | Page 8 of 11 | www.onsemi.com

Application Information

The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface . Note: One channel of the CSPEMI400 with a z ener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface connector in order to improve stability of the SIM card supply rail.

Rev. 2 | Page 10 of 11 | www.onsemi.com CSP Mechanical Specifications The CSPEMI400 is supplied in a custom Chip Scale Pa ckage (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters Inches Dim Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters A B C DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW 3 4 0.30 DIA. 63/37 Sn/Pb (Eutectic) or SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) Chip Scale Package

Figure 9. Tape and Reel Mechanical Data Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.