CSPEMI400 CALMIRCO | Alldatasheet
Document overview
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Technical content
Features
- Three channels of EMI filtering, each with ESD protection
- Two additional channels of ESD-only protection
- ±10kV ESD protection (IEC 61000-4-2, contact discharge)
- ±25kV ESD protection (HBM)
- Greater than 30dB of attenuation at 1GHz
- 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP)
- Lead-free version available
Applications
- SIM Card slot in mobile handsets
- I/O port protection for mobile handsets, notebook computers, PDAs, etc.
- EMI filtering for data port s in cell phones, PDAs or notebook computers Product Description CAMD's CSPEMI400 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CSPEMI400 has componen t values of 20pF-47 Ω- 20pF, and 20pF-100 Ω-20pF. The parts include ava- lanche-type ESD diodes on ev ery pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic dis- charge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±10kV, exceeding the maximum requirement of the IEC 61000-4-2 inter- national standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protecte d for contact discharges at greater than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable elec- tronics (e.g. mobile hand sets, PDAs, notebook com- puters) because of its small package format and easy- to-use pin assignments. In particular, the CSPEMI400 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CSPEMI400 is available in a space-saving, low- profile Chip Scale Package with optional lead-free fin- ishing. Electrical Schematic C C B2,B4 GND C C C2A2 CC C4A4 C C C3A3 R1=100Ω R2=47Ω
© 2005 California Micro Devices Corp. All rights reserved. CSPEMI400
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. PIN DESCRIPTIONS TYPE PIN DESCRIPTION EMI Filter A1 EMI Filter with ESD Protection for RST Signal C1 EMI Filter with ESD Protection for RST Signal EMI Filter A2 EMI Filter with ESD Protection for CLK Signal C2 EMI Filter with ESD Protection for CLK Signal Device Ground B1 Device Ground B2 Device Ground EMI Filter A3 DAT EMI Filter with ESD Protection C3 DAT EMI Filter with ESD Protection ESD Channel A4 ESD Proection Channel - V CC Supply ESD Channel C4 ESD Proection Channel C3C4 Orientation Marking B1B2 A2A3 A1A4 AG 314 2 C B A Orientation Marking (see note 2) PACKAGE / PINOUT DIAGRAMS Notes: TOP VIEW CSPEMI400 BOTTOM VIEW (Bumps Down View) (Bumps Up View) 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. PART NUMBERING INFORMATION Bumps Package Standard Finish Lead-free Finish2 Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking
10 CSP CSPEMI400 AG CSPEMI400G AG
© 2005 California Micro Devices Corp. All rights reserved. CSPEMI400 Specifications Note 1: T A=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EM I filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage Temperature Range -65 to +150 °C DC Power per Resistor 100 mW STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance of R1 80 100 120 Ω R2 Resistance of R2 38 47 56 Ω C Capacitance V IN = 2.5VDC, 1MHz, 30mV ac 16 20 24 pF VSTANDOFF Stand-off Voltage I = 10 μA6 . 0 V ILEAK Diode Leakage Current V BIAS = 3.3V 300 nA VSIG Signal Voltage Positive Clamp Negative Clamp I LOAD = 10mA ILOAD = -10mA 5.6 -1.5 6.8 -0.8 9.0 -0.4 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2,4 and 5 ±25 ±10 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3,4 and 5 +12 V V f C1 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 20pF 77 MHz fC2 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 47Ω, C = 20pF 85 MHz
© 2005 California Micro Devices Corp. All rights reserved. CSPEMI400
Application Information
The CSPEMI400 provides a bidirectional filter and protec- tor for all the signals and the power line on the SIM (sub- scriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other hand- held devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct con- tact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, pre- venting the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Figure 5. Figure 5. Typical Application Diagram for the SIM Card Interface tact factory at 800-325-4966 for technical support. diode is not shown on the diagram.
© 2005 California Micro Devices Corp. All rights reserved. Devices CSP Package Information document. Figure 9. Tape and Reel Mechanical Data