CSPEMI205G ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Three channels of EMI filtering, two for earpiece speakers and one for a microphone
  • Pi-style EMI filters in a capacitor-resistor- capacitor (C-R-C) network
  • Chip Scale Package features extremely low parasitic inductance for optimum filter performance
  • Greater than 30dB relative attenuation in the 800 - 2700MHz range
  • + 8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)
  • + 15kV ESD protection on each channel (HBM)
  • 8-bump, 1.41mm X 1.430mm footprint Chip Scale Package (CSP)
  • RoHS compliant (lead-free) finishing

Applications

  • EMI filtering and ESD protection for headset microphone and speaker
  • Cellular / Mobile Phones
  • Notebooks and Personal Computers
  • Handheld PCs / PDAs / Tablets
  • Wireless Handsets
  • Digital Camcorders Product Description The CSPEMI205G is a low-pass filter array integrating three pi-style filters (C-R-C) that red uce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values . Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi- style filters support bidirectional filtering, cont rolling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabli ng audio signals to pass through without distortion. In addition, the CSPEMI205G provides a very high level of protection for sensitive electronic compon ents that may be subject to electrostatic discharge (ESD ). The input pins safely dissipate ESD strikes of + 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than + 15kV. The CSPEMI205G is particularly well suited for portable electronics (e.g., cellular telephones, PD As, notebook computers) because of its small package format and low weight. The CSPEMI205G is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing.

Rev. 3 | Page 2 of 9 | www.onsemi.com Electrical Schematic

Rev. 3 | Page 3 of 9 | www.onsemi.com PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 EAR1_IN Earpiece Input 1 (from audio circuitry) A3 EAR2_IN Earpiece Input 2 (from audio circuitry) A5 MIC_IN Microphone Input (from microphone) B2 GND Device Ground B4 GND Device Ground C1 EAR1_OUT Earpiece Output 1 (to earpiece) C3 EAR2_OUT Earpiece Output 2 (to earpiece) C5 MIC_OUT Microphone Output (to audio circuitry)

Ordering Information

PART NUMBERING INFORMATION Bumps Package Ordering Part Number Part Marking

8 CSP CSPEMI205G AF

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage Temperature Range -65 to +150 ° C DC Power per Resistor 100 mW

Rev. 3 | Page 4 of 9 | www.onsemi.com STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 ° C ELECTRICAL OPERATING CHARACTERISTICS (NOTE 1) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance 9 10 11 Ω R2 Resistance 54 68 75 Ω C1 Capacitance 80 100 120 pF C2 Capacitance 38 47 57 pF ILEAK Diode Leakage Current V IN =5.0V 1.0 µ A VSIG Signal Voltage Positive Clamp Negative Clamp I LOAD = 10mA -15 -10 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 ±15 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 +15 -19 V V fC1 Cut-off frequency 1; Note 5 R = 10 Ω , C = 100pF 34 MHz fC2 Cut-off frequency 2; Note 5 R = 68 Ω , C = 47pF 63 MHz Note 1: T A=25 °C unless otherwise specified. Note 2: ESD applied to input and output pins with r espect to GND, one at a time. Note 3: Clamping voltage is measured at the opposit e side of the EMI filter to the ESD pin. For exampl e, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Note 5: Z SOURCE =50 Ω , Z LOAD =50 Ω

Figure 3. Microphone Circuit (A5-C5) EMI Filter Pe rformance

Rev. 3 | Page 8 of 9 | www.onsemi.com Mechanical Details CSP Mechanical Specifications The CSPEMI205G is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s chip scale packaging, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 8 Millimeters Inches Dim Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters A B C 1 3 5 DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW 2 4 0.30 DIA. SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) Chip Scale Package

Figure 6. Tape and Reel Mechanical Data Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.