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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Features

  • Two Channels of EMI Filtering
  • ±30 kV ESD Protection (IEC 61000−4−2, Contact Discharge)
  • ±30 kV ESD Protection (IEC 61000−4−2, Air Discharge)
  • Greater than 45 dB of Attenuation at 900 MHz
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

Applications

  • Mobile Phones MAXIMUM RATINGS (TA = 25°C) Rating Symbol Value Unit ESD Discharge IEC61000−4−2 Contact Discharge Air Discharge Vpp kV RMS Current per Line ILine 350 mA Operating Temperature Range TJ −40 to +125 °C Storage Temperature Range Tstg −55 to +150 °C Lead Solder Temperature (10 second duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. MARKING DIAGRAM Device Package Shipping †

ORDERING INFORMATION

www.onsemi.com CSPEMI204FCTAG WLCSP5 (Pb−Free) 5000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. WLCSP5 FC SUFFIX CASE 567MA BLOCK DIAGRAM AT = Specific Device Code M = Date Code ATM A1 C1 GND B1 A3 C3 GND B1 Filter#1 Filter#2

Table 1. PIN DESCRIPTIONS Table 2. ELECTRICAL OPERATING CHARACTERISTICS (TA = 25°C unless otherwise noted)

2.0 MHz

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Standard IEC61000−4−2 with C Discharge = 150 pF, RDischarge = 330, GND grounded.
  2. These measurements performed with no external capacitor .
  3. TVS devices are normally sele cted according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC

or continuous peak operating voltage level.

  1. V BR is measured at pulse test current IT.

Figure 6. Positive TLP I−V Curve (Preliminary) Figure 7. Negative TLP I−V Curve (Preliminary) voltage over a range of current levels. Figure 8. Simplified Schematic of a Typical TLP

10 M/C0087

Figure 9. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms

www.onsemi.com PACKAGE DIMENSIONS WLCSP5, 1.26x0.89 CASE 567MA ISSUE O SEATING PLANE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 4. DIMENSION b IS MEASURED AT THE MAXIMUM BALL DIAMETER PARALLEL TO DATUM C. DIM A MIN MAX −−− MILLIMETERS D 1.26 BSC E b 0.235 0.295 e 0.50 BSC 0.50 È E D A B PIN A1 REFERENCE e A0.10 BC 0.05 C 0.05 C 5X b 123 C B A 0.10 C A C 0.18 0.22

0.89 BSC

e1 0.435 BSC 0.50 0.275X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.87

0.10 C2X

A2 0.255 REF RECOMMENDED PACKAGE OUTLINE e/2 PITCH PITCH ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidia ries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 CSPEMI204/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative