CSPEMI202AG ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Two channels of EMI filtering  Pi-style EMI filters in a capacitor-resistor- capacitor (C-R-C) network  Greater than 40dB attenuation at 1GHz  ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)  ±15kV ESD protection on each channel (HBM)  Supports bipolar signals—ideal for audio applications  Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance  5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP)  RoHS compliant (lead-free) finishing

Applications

 EMI filtering and ESD protection for headset microphone ports  Wireless Handsets  Handheld PCs / PDAs  MP3 Players  Digital Camcorders  Notebooks  Desktop PCs Product Description The CSPEMI202AG is a dual low-pass filter array integrating two pi-style f ilters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a microphone element. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CSPEMI202AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The diodes safely dissipate ESD strikes of ±8kV, the maximum requirement of the IEC 61000-4- 2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15kV. The CSPEMI202AG is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) becaus e of its small package format and low weight. The CSPEMI202AG is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing.

Rev. 3 | Page 2 of 9 | www.onsemi.com

Rev. 3 | Page 3 of 9 | www.onsemi.com PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 MIC_IN1 Microphone Input 1 (from microphone) A3 MIC_IN2 Microphone Input 2 (from microphone) B2 GND Device Ground C1 MIC_OUT1 Microphone Output 1 (to audio circuitry) C3 MIC_OUT2 Microphone Output 2 (to audio circuitry)

Ordering Information

PART NUMBERING INFORMATION Bumps Package Ordering Part Number Part Marking

5 CSP CSPEMI202AGG AD

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Rev. 3 | Page 4 of 9 | www.onsemi.com Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage Temperature Range -65 to +150 °C DC Power per Resistor 100 mW STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 °C

Rev. 3 | Page 5 of 9 | www.onsemi.com ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance 61 68 75 Ω C1 Capacitance 38 47 56 pF ILEAK Diode Leakage Current V IN=5.0V 1.0 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA -15 -10 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 ±15 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 and 3 +15 -19 V V fC Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 68Ω, C = 47pF 60 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI f ilter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.

Rev. 3 | Page 8 of 9 | www.onsemi.com Mechanical Details CSP Mechanical Specifications The CSPEMI202AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 5 Millimeters Inches Dim Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters A B C DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW 0.30 DIA. SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) Package Dimensions for CSPEMI202AG Chip Scale Package

Figure 5. Tape and Reel Mechanical Data Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.