CSPEMI201AG ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Two channels of EMI filtering  Pi-style EMI filters in a capacitor-resistor- capacitor (C-R-C) network  Greater than 40dB attenuation at 1GHz  +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge)  +15kV ESD protection in each channel (HBM)  Supports AC signals—ideal for audio applications  Extremely low lead inductance for optimum filter and ESD performance  5-bump, 0.930mm X 1.410mm footprint Chip Scale Package (CSP)  RoHS compliant (lead-free) finishing

Applications

 EMI filtering and ESD protection for headset speaker ports  Wireless Handsets  Handheld PCs / PDAs  MP3 Players  Digital Camcorders  Notebooks  Desktop PCs Product Description The CSPEMI201AG is a dual low-pass filter array integrating two pi-style f ilters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support bipolar signals with a cutoff frequency of 31MHz, enabling audio signals to pass through without distortion. In addition, the CSPEMI201AG provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CSPEMI201AG can safely dissipate ESD strikes of + 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The CSPEMI201AG is particularly well-suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) becaus e of its small package and low weight. The CSPEMI 201AG is available in a space-saving, low-profile Chip Scale Package with RoHS compliant lead-free finishing.

Rev. 3 | Page 2 of 9 | www.onsemi.com Electrical Schematic

Rev. 3 | Page 3 of 9 | www.onsemi.com PIN DESCRIPTIONS PIN NAME DESCRIPTION A1 SPKR_IN1 Speaker Input 1 (from audio circuitry) A3 SPKR_IN2 Speaker Input 2 (from audio circuitry) B2 GND Device Ground C1 SPKR_OUT1 Speaker Output 1 (to speaker) C3 SPKR_OUT2 Speaker Output 2 (to speaker)

Ordering Information

PART NUMBERING INFORMATION Pins Package Ordering Part Number Part Marking

5 CSP CSPEMI201AGG AB

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Rev. 3 | Page 4 of 9 | www.onsemi.com Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS Storage Temperature Range -65 to +150 °C DC Power per Resistor 100 mW STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS Operating Temperature Range -40 to +85 °C

Rev. 3 | Page 5 of 9 | www.onsemi.com ELECTRICAL OPERATING CHARACTERISTICS SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R Resistance 9 10 11 Ω C Capacitance 80 100 120 pF ILEAK Diode Leakage Current V IN=5.0V 1.0 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA -15 -10 V V VESD In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 ±15 kV kV VCL Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 and 3 +15 -19 V V fC Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 10Ω, C = 100pF 31 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI f ilter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.

Rev. 3 | Page 8 of 9 | www.onsemi.com Mechanical Details CSP Mechanical Specifications The CSPEMI201AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 5 Millimeters Inches Dim Min Nom Max Min Nom Max # per tape and reel 3500 pieces Controlling dimension: millimeters A B C DIMENSIONS IN MILLIMETERS BOTTOM VIEW SIDE VIEW 0.30 DIA. SOLDER BUMPS 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) Package Dimensions for CSPEMI201AG Chip Scale Package

Figure 5. Tape and Reel Mechanical Data Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.