CSD95420RCBT

CSD95420RCB TI | Alldatasheet

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SLPS735,*]
• PDF pages: 15

Technical content

CSD95420RCB Synchronous Buck NexFET™ Smart Power Stage

1 Features

• 50-A peak continuous current
• Over 94% system efficiency at 15-A
• High-frequency operation (up to 1.75 MHz)
• Diode emulation function
• Temperature compensated bi-directional current sense
• Analog temperature output
• Fault monitoring
• 3.3-V and 5-V PWM signal compatible
• Tri-state PWM input
• Integrated bootstrap switch
• Optimized deadtime for shoot-through protection
• QFN package – High-density – 4 mm × 5 mm – Ultra-low-inductance – System-optimized PCB footprint – Thermally enhanced tooling – RoHS compliant – Lead-free terminal plating – Halogen Free

2 Applications

• Multiphase synchronous buck converters – High-frequency applications – High-current, low-duty cycle applications
• Point-of-load DC-DC converters
• Memory and graphic cards
• Desktop and server VR13.x / VR14.x V-Core synchronous buck converters

3 Description

The CSD95420RCB NexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design. Device Information DEVICE(1) MEDIUM QTY PACKAGE SHIP CSD95420RCBRC B 13-inch reel 2500 QFN 4.00 mm × 5.00 mm Tape and reel (1) For all available packages, see the orderable addendum at the end of the data sheet. Controller PWM1 CSD59920 PMBus CSP1 PWM2 CSD59920 CSP2 CSD59920 PWM8 CSP8 Figure 3-1. Simplified Application CSD95420RCB SLPS735 – NOVEMBER 2020 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

6 Mechanical, Packaging, and Orderable Information....3

6.5 Alternate Industry Standard Compatible PCB

6.6 Alternate Industry Standard Compatible Stencil

4 Revision History

November 2020 * Initial release. CSD95420RCB SLPS735 – NOVEMBER 2020 www.ti.com

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5 Device and Documentation Support

5.1 Documentation Support

5.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

5.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

5.4 Trademarks

NexFET™ and TI E2E™ are trademarks of Texas Instruments. All trademarks are the property of their respective owners.

5.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

5.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

6 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com CSD95420RCB SLPS735 – NOVEMBER 2020 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

6.1 Package Option Addendum

6.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking(4) (5) CSD95420RCBRCB Active QFN RCB 27 2500 PB-Free (RoHS Exempt) CU NIPDAU Level-2-260CUNLIM –55 to 150 59920RB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space (5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. CSD95420RCB SLPS735 – NOVEMBER 2020 www.ti.com

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6.1.2 Tape and Reel Information

Reel Width (W1) REEL DIMENSIONS W Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Dimension designed to accommodate the component width TAPE DIMENSIONS B0 W A0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket Quadrants Sprocket Holes Q1 Q1Q2 Q2 Q3 Q3Q4 Q4 Reel Diameter User Direction of Feed Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant www.ti.com CSD95420RCB SLPS735 – NOVEMBER 2020 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5

6.2 Mechanical Drawing

www.ti.com PACKAGE OUTLINE C1.05 MAX 5X 0.3 0.2 15X 0.3 0.2 15X 0.4 0.3 1.84 0.1 .000 PKG 00.174 0.1 2.15 0.1 .000 PKG 3X 0.5 1.86 1.58 1.48 1.58 1.65 R0.1 TYP 0.05 0.00 12X 0.5 1.39 0.1 1.35 0.1 0.9 0.1 0.47 0.1 0.395 0.1 4X 0.5 5X 0.3 0.2 0.91 0.1 1.75 0.1 0.23 0.1 0.53 0.1 0.21 0.1 (0.1) TYP A 5.1 4.9 B 4.1 3.9 (0.203) TYP 4224521/A 09/2018 VQFN-CLIP - 1.05 mm max height RCB0027A PLASTIC QUAD FLATPACK - NO LEAD PIN 1 INDEX AREA SEATING PLANE 7 13 8 12 X0.3) (45 PIN 1 ID

0.1 C A B

0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance. 0.08 C

• All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
• This drawing is subject to change without notice.
• The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance. CSD95420RCB SLPS735 – NOVEMBER 2020 www.ti.com

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6.3 Recommended PCB Land Pattern

www.ti.com EXAMPLE BOARD LAYOUT .000 PKG 0 .000 PKG 0 ( )0.203 ( ) TYP2.2 ( )1.75 ( )1.55 ( )0.57 2X ( )0.49 2X ( )1.55 ( ) TYP1.75 ( )0.47 ( ) TYP2.2 ( )0.21 2X ( )1.48 3X ( )1.007 ( )0.23 ( )0.91 2X ( )1.33 ( )1.75 15X (0.55) (0.05) MIN TYP ( )1.607 ( 0.2) VIA TYP ( )0.407 ( )1.925 ( )1.39 ( ) 1.2 3X ( )0.498 ( )2.425 2X ( )0.48 ( )2.15 ( ) TYP2.7 ( )0.53 ( )0.174 ( )1.84 15X (0.25) 12X (0.5) ( )1.35 ( ) 0.9 ( ) 1 (0.1) TYP ( )1.925 ( )1.65 ( )1.86 ( )1.58 10X (0.25) 4224521/A 09/2018 VQFN-CLIP - 1.05 mm max height RCB0027A PLASTIC QUAD FLATPACK - NO LEAD NOTES: (continued) 4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE: 20X METAL UNDER SOLDER MASK TYP SOLDER MASK OPENING, TYP 8 12 19 25

• All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
• This drawing is subject to change without notice.
• This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON PCB Attachment (SLUA271). www.ti.com CSD95420RCB SLPS735 – NOVEMBER 2020 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7

6.4 Recommended Stencil Opening

www.ti.com EXAMPLE STENCIL DESIGN .000 PKG .000 PKG 0 ( )1.767 ( )1.107 ( )1.729 ( )1.86 ( )1.35 ( )1.39 ( )0.598 ( ) TYP2.25 ( ) TYP2.7 ( )0.47 ( )0.39 ( )0.59 ( )1.45 ( )0.247 ( )0.907 ( )0.398 ( )0.395 20X (0.25) 15X (0.5) ( )1.925 ( )1.925 2X ( )0.27 2X ( )1.69 ( )2.15 ( )0.48 ( )0.23 ( )0.53 ( )0.932 ( )1.08 ( )0.67 ( )1.45 5X (0.25) 4X (0.5) ( ) 1 (R0.05) TYP ( )1.35 ( ) 0.9 20X (0.55) ( )0.58 ( )2.425 4224521/A 09/2018 VQFN-CLIP - 1.05 mm max height RCB0027A PLASTIC QUAD FLATPACK - NO LEAD NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PAST EXAMPLE ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE S 6-7 & 13-15: 70% 26: 70% SCALE: 20X EXPOSED METAL SOLDER MASK OPENING TYP EXPOSED METAL 19 25 METAL UNDER SOLDER MASK TYP

• All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
• This drawing is subject to change without notice.
• Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. CSD95420RCB SLPS735 – NOVEMBER 2020 www.ti.com

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6.5 Alternate Industry Standard Compatible PCB Land Pattern

www.ti.com EXAMPLE BOARD LAYOUT .000 PKG 0 .000 PKG 0 ( )0.203 ( )1.05 2X ( )1.55 ( ) TYP 1.75 ( ) TYP 2.2 ( ) TYP 2.2 ( )1.75 ( )1.55 ( )0.57 2X ( )0.49 2X ( )1.55 ( )1.75 ( )0.47 ( ) TYP 2.2 ( )1.843 ( )1.08 ( )0.58 ( )0.318 ( )0.21 2X ( )1.48 3X ( )1.007 ( )0.23 ( )0.91 2X ( )1.33 ( )1.75 12 (0.55) (0.05) MIN. TYP ( )1.607 ( 0.2) VIA TYP ( )0.407 .000 PKG 0 ( )1.925 ( )1.39 ( ) 1.2 3X ( )0.498 .000 PKG 0 ( )2.425 ( )1.58 2X ( )0.48 ( )2.15 ( ) TYP 2.7 ( )0.53 ( )0.174 ( )1.84 12X (0.25) 14X (0.5) ( )1.35 ( ) 0.9 ( ) 1 ( ) TYP 2.25 4223993/B 09/2019 VQFN-CLIP - 1.05 mm max height RWX0027A PLASTIC QUAD FLATPACK - NO LEAD NOTES: (continued) 4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE: 20X PKG METAL UNDER SOLDER MASK TYP SOLDER MASK OPENING, TYP 8 12 19 25 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for optimal themral and mechanical performance. 4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com CSD95420RCB SLPS735 – NOVEMBER 2020 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9

6.6 Alternate Industry Standard Compatible Stencil Opening

www.ti.com EXAMPLE STENCIL DESIGN .000 PKG .000 PKG 0 ( )1.767 ( )1.107 ( )1.729 ( )1.86 ( )1.35 ( )1.39 ( )0.598 ( )0.745 ( )1.45 ( )1.783 ( )0.377 ( ) TYP 2.25 ( ) TYP 2.7 ( )0.47 ( )0.39 ( )0.59 ( )1.45 ( )0.247 ( )0.907 ( )0.398 ( )0.395 29X (0.25) 24X (0.5) .000 PKG ( ) TYP 1.925 ( ) TYP 1.925 2X ( )0.27 2X ( )1.69 ( )2.15 ( )0.48 ( )0.23 ( )0.53 ( )0.932 ( )1.08 ( )0.67 ( )1.45 10X (0.25) 9X (0.5) ( ) 1 (R0.05) TYP ( )1.35 ( ) 0.9 .000 PKG 0 4223993/B 09/2019 VQFN-CLIP - 1.05 mm max height RWX0027A PLASTIC QUAD FLATPACK - NO LEAD NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE PADS 6-7 & 13-15: 70% PADS 16-18: 70% PAD 26: 70% SCALE: 20X EXPOSED METAL METAL UNDER SOLDER MASK TYP SOLDER MASK OPENING TYP EXPOSED METAL 1 19 25 CSD95420RCB SLPS735 – NOVEMBER 2020 www.ti.com

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www.ti.com 20-Oct-2022 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead finish/ Ball material (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CSD95420RCB ACTIVE VQFN-CLIP RCB 27 2500 RoHS-Exempt & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 95420RB Samples CSD95420RCBT ACTIVE VQFN-CLIP RCB 27 250 RoHS-Exempt & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 95420RB Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1

www.ti.com 20-Oct-2022 Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 21-Oct-2022 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant CSD95420RCB VQFN- CLIP CSD95420RCBT VQFN- CLIP Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 21-Oct-2022 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CSD95420RCB VQFN-CLIP RCB 27 2500 367.0 367.0 38.0 CSD95420RCBT VQFN-CLIP RCB 27 250 213.0 191.0 35.0 Pack Materials-Page 2

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