CSD25310Q2_18 TI1 | Alldatasheet
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Technical content
− VGS - Gate-to- Source Voltage (V) R DS (on) - On-State Resistance (mΩ ) TC = 25°C, ID = −5A TC = 125°C, ID = −5A G001 0.5 1.5 2.5 3.5 4.5 Q g - Gate Charge (nC) − VGS - Gate-to-Source Voltage (V) ID = −5A VDS = −10V G001 S S S S 5 G DD P01 12-01 Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community CSD25310Q2 SLPS459A –JANUARY 2014–REVISED JUNE 2014 CSD25310Q220VP-ChannelNexFET™ PowerMOSFETs
1 Features
1• Ultra-Low Qg and Qgd TA = 25°C TYPICAL VALUE UNIT
- Low On Resistance VDS Drain-to-Source Voltage –20 V
- Low Thermal Resistance Qg Gate Charge Total (–4.5 V) 3.6 nC Qgd Gate Charge Gate to Drain 0.5 nC• Pb-Free VGS = –1.8 V 59.0 mΩ• RoHS Compliant RDS(on) Drain-to-Source On Resistance VGS = –2.5 V 27.0 mΩ• Halogen Free VGS = –4.5 V 19.9 mΩ
- SON 2-mm × 2-mm Plastic Package VGS(th) Threshold Voltage -0.85 V 2 Applications .
- Battery Management Ordering Information(1) Device Media Qty Package Ship• Load Management CSD25310Q2 7-Inch Reel 3000 SON 2 x 2 mm Tape and• Battery Protection Plastic Package ReelCSD25310Q2T 7-Inch Reel 250
3 Description (1) For all available packages, see the orderable addendum at
the end of the data sheet.This 19.9 mΩ, –20 V P-Channel device is designed to deliver the lowest on resistance and gate charge in Absolute Maximum Ratingsthe smallest outline possible with excellent thermal TA = 25°C VALUE UNITcharacteristics in an ultra-low profile. Its low on VDS Drain-to-Source Voltage –20 Vresistance coupled with an extremely small footprint in a SON 2 mm × 2 mm plastic package make the VGS Gate-to-Source Voltage ±8 V device ideal for battery operated space constrained Continuous Drain Current (Package Limit) –20 A IDoperations. Continuous Drain Current(1) –9.6 A IDM Pulsed Drain Current(2) 48 A Top View PD Power Dissipation(1) 2.9 W TJ, Operating Junction and Storage –55 to 150 °CTstg Temperature Range (1) RθJA = 43°C/W on 1 in² Cu (2 oz.) on .060-inch thick FR4 PCB. (2) Pulse duration 10 μs, duty cycle ≤2% RDS(on) vs VGS Gate Charge An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
SLPS459A –JANUARY 2014–REVISED JUNE 2014 www.ti.com Table of Contents
4 Revision History
Changes from Original (January 2014) to Revision A Page
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Product Folder Links: CSD25310Q2
www.ti.com SLPS459A –JANUARY 2014–REVISED JUNE 2014
5 Specifications
5.1 Electrical Characteristics
TA = 25°C, unless otherwise specified PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-Source Voltage VGS = 0 V, ID = –250 μA –20 V IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = –16 V –1 μA IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = –8 V –100 nA VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, IDS = –250 μA –0.55 –0.85 –1.10 V VGS = –1.8 V, IDS = –5 A 59.0 89.0 mΩ RDS(on) Drain-to-Source On Resistance VGS = –2.5 V, IDS = –5 A 27.0 32.5 mΩ VGS = –4.5 V, IDS = –5 A 19.9 23.9 mΩ gfs Transconductance VDS = –16 V, IDS = –5 A 34 S DYNAMIC CHARACTERISTICS CISS Input Capacitance 504 655 pF COSS Output Capacitance VGS = 0 V, VDS = –10 V, f = 1 MHz 281 365 pF CRSS Reverse Transfer Capacitance 16.7 21.7 pF Rg Series Gate Resistance 1.9 Ω Qg Gate Charge Total (–4.5 V) 3.6 4.7 nC Qgd Gate Charge Gate to Drain 0.5 nC VDS = –10 V, IDS = –5 A Qgs Gate Charge Gate to Source 1.1 nC Qg(th) Gate Charge at Vth 0.6 nC QOSS Output Charge VDS = –10 V, VGS = 0 V 5.0 nC td(on) Turn On Delay Time 8 ns tr Rise Time 15 nsVDS = –10 V, VGS = –4.5 V, IDS = –5 A RG = 2 Ωtd(off) Turn Off Delay Time 15 ns tf Fall Time 5 ns DIODE CHARACTERISTICS VSD Diode Forward Voltage IDS = –5 A, VGS = 0 V –0.8 –1.0 V Qrr Reverse Recovery Charge 9.2 nC VDD = –10 V, IF = –5 A, di/dt = 200 A/μs trr Reverse Recovery Time 13 ns
5.2 Thermal Information
(TA = 25°C unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT RθJC Thermal Resistance Junction to Case(1) 4.5 °C/W RθJA Thermal Resistance Junction to Ambient(1)(2) 55 (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CSD25310Q2
(6.45 cm2) of 2-oz. pad area of 2-oz.
5.3 Typical MOSFET Characteristics
Figure 1. Transient Thermal Impedance
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Figure 8. Normalized On-State Resistance vs Temperature Figure 9. Typical Diode Forward Voltage Figure 10. Maximum Safe Operating Area Figure 11. Maximum Drain Current vs Temperature
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6 Device and Documentation Support
6.1 Trademarks
NexFET is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
6.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
6.3 Glossary
SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms and definitions. Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: CSD25310Q2
SLPS459A –JANUARY 2014–REVISED JUNE 2014 www.ti.com
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: CSD25310Q2
D 1 13 3 4 46 6 b K L C Top□View Bottom□View Front□View E Pin□1□Dot Pin□1□IDe K3K1 A CSD25310Q2 www.ti.com SLPS459A –JANUARY 2014–REVISED JUNE 2014
7.1 Q2 Package Dimensions
A1 0.000 0.050 0.000 0.002 C 0.203 TYP 0.008 TYP D 2.000 TYP 0.080 TYP D2 0.300 TYP 0.012 TYP E 2.000 TYP 0.080 TYP E2 0.280 TYP 0.0112 TYP E3 0.470 TYP 0.0188 TYP e 0.650 TYP 0.026 TYP K 0.280 TYP 0.0112 TYP K1 0.350 TYP 0.014 TYP K2 0.200 TYP 0.008 TYP K3 0.200 TYP 0.008 TYP K4 0.470 TYP 0.0188 TYP Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 9 Product Folder Links: CSD25310Q2
SLPS459A –JANUARY 2014–REVISED JUNE 2014 www.ti.com
7.2 Recommended PCB Pattern
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.
7.3 Recommended Stencil Pattern
Note: All dimensions are in mm, unless otherwise specified.
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Product Folder Links: CSD25310Q2
1.75□±0.10 Ø□1.00□±0.25 M0168-01 8.00 +0.30 –0.10 4.00□±0.10 4.00□±0.10 3.50□±0.05 10°□Max 10°□Max 2.30□±0.05 2.30□±0.05 CSD25310Q2 www.ti.com SLPS459A –JANUARY 2014–REVISED JUNE 2014
7.4 Q2 Tape and Reel Information
Notes: 1. Measured from centerline of sprocket hole to centerline of pocket 2. Cumulative tolerance of 10 sprocket holes is ±0.20 3. Other material available 4. Typical SR of form tape Max 109 OHM/SQ 5. All dimensions are in mm, unless otherwise specified. Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: CSD25310Q2
www.ti.com 24-Aug-2018 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples CSD25310Q2 ACTIVE WSON DQK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -55 to 150 2530 CSD25310Q2T ACTIVE WSON DQK 6 250 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -55 to 150 2530 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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