CSD23280F3 TI | Alldatasheet
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Technical content
CSD23280F3 –12-V P-Channel FemtoFET™ MOSFET
1 Features
- Low On-Resistance
- Ultra-Low Qg and Qgd
- High-operating drain current
- Ultra-small footprint – 0.73 mm × 0.64 mm
- Ultra-low profile – 0.36-mm max height
- Integrated ESD protection diode – Rated > 4-kV HBM – Rated > 2-kV CDM
- Lead and halogen free
- RoHS compliant
2 Applications
- Optimized for load switch applications
- Optimized for general purpose switching
applications
- Battery applications
- Handheld and mobile applications
3 Description
This –12-V, 97-mΩ, P-Channel FemtoFET™ MOSFET is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing a substantial reduction in footprint size. 0.64 mm 0.73 mm 0.36 mm Typical Part Dimensions Product Summary TA = 25°C TYPICAL VALUE UNIT VDS Drain-to-Source Voltage –12 V Qg Gate Charge Total (4.5 V) 0.95 nC Qgd Gate Charge Gate-to-Drain 0.068 nC RDS(on) Drain-to-Source On-Resistance VGS = –1.5 V 230 mΩ VGS = –1.8 V 180 VGS = –2.5 V 129 VGS = –4.5 V 97 VGS(th) Threshold Voltage –0.65 V Device Information(1) DEVICE QTY MEDIA PACKAGE SHIP CSD23280F3 3000 7-Inch Reel Femto 0.73-mm × 0.64-mm Land Grid Array (LGA) Tape and ReelCSD23280F3T 250 (1) For all available packages, see the orderable addendum at the end of the data sheet. Absolute Maximum Ratings TA = 25°C VALUE UNIT VDS Drain-to-Source Voltage –12 V VGS Gate-to-Source Voltage –6 V ID Continuous Drain Current(1) 2.9 A Continuous Drain Current(2) 1.8 IDM Pulsed Drain Current(1) (3) 11.4 A PD Power Dissipation(1) 1.4 W Power Dissipation(2) 0.5 V(ESD) Human-Body Model (HBM) 4000 V Charged-Device Model (CDM) 2000 TJ, Tstg Operating Junction, Storage Temperature –55 to 150 °C (1) Typical RθJA = 90°C/W on 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 0.06-in (1.52-mm) thick FR4 PCB (2) Typical RθJA = 255°C/W on min Cu board (3) Pulse duration ≤ 100 μs, duty cycle ≤ 1%. D G S Top View CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
7 Mechanical, Packaging, and Orderable Information....8
4 Revision History
Changes from Revision A (August 2017) to Revision B (February 2022) Page Changes from Revision * (April 2016) to Revision A (August 2017) Page CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 www.ti.com
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5 Specifications
5.1 Electrical Characteristics
TA = 25°C (unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT STATIC CHARACTERISTICS BVDSS Drain-to-source voltage VGS = 0 V, IDS = –250 μA –12 V IDSS Drain-to-source leakage current VGS = 0 V, VDS = –9.6 V –50 nA IGSS Gate-to-source leakage current VDS = 0 V, VGS = –5 V –25 nA VGS(th) Gate-to-source threshold voltage VDS = VGS, IDS = –250 μA –0.40 –0.65 –0.95 V RDS(on) Drain-to-source on-resistance VGS = –1.5 V, IDS = –0.1 A 230 399 mΩ VGS = –1.8 V, IDS = –0.4 A 180 250 VGS = –2.5 V, IDS = –0.4 A 129 165 VGS = –4.5 V, IDS = –0.4 A 97 116 gfs Transconductance VDS = –1.2 V, IDS = –0.4 A 3 S DYNAMIC CHARACTERISTICS Ciss Input capacitance VGS = 0 V, VDS = –6 V, ƒ = 1 MHz 180 234 pF Coss Output capacitance 73 95 pF Crss Reverse transfer Capacitance 8.5 11.1 pF RG Series gate resistance 9 Ω Qg Gate charge total (4.5 V) VDS = –6 V, IDS = –0.4 A 0.95 1.23 nC Qgd Gate charge gate-to-drain 0.068 nC Qgs Gate charge gate-to-source 0.30 nC Qg(th) Gate charge at Vth 0.15 nC Qoss Output charge VDS = –6 V, VGS = 0 V 1.07 nC td(on) Turnon delay time VDS = –6 V, VGS = –4.5 V, IDS = –0.4 A, RG = 0 Ω 8 ns tr Rise time 4 ns td(off) Turnoff delay time 21 ns tf Fall time 8 ns DIODE CHARACTERISTICS VSD Diode forward voltage ISD = –0.4 A, VGS = 0 V –0.73 –1.0 V
5.2 Thermal Information
TA = 25°C (unless otherwise stated) THERMAL METRIC TYPICAL VALUES UNIT RθJA Junction-to-ambient thermal resistance(1) 90 °C/W Junction-to-ambient thermal resistance(2) 255 (1) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz. (0.071-mm) thick Cu. (2) Device mounted on FR4 material with minimum Cu mounting area. www.ti.com CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3
5.3 Typical MOSFET Characteristics
TA = 25°C (unless otherwise stated) -VDS - Drain-to-Source Voltage (V) -IDS - Drain-to-Source Current (A) D002 VGS = -1.5 V VGS = -1.8 V VGS = -2.5 V VGS = -4.5 V Figure 5-1. Saturation Characteristics -VGS - Gate-To-Source Voltage (V) -IDS - Drain-To-Source Current (A) 0.5 1.5 2.5 3.5 4.5 D003 TC = 125° C TC = 25° C TC = -55° C VDS = –5 V Figure 5-2. Transfer Characteristics Figure 5-3. Transient Thermal Impedance CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 www.ti.com
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-VDS - Drain-To-Source Voltage (V) -IDS - Drain-To-Source Current (A) 0.1 1 10 100 0.01 0.1 100 D010 100 ms 10 ms 1 ms 100 µs Single pulse, max RθJA = 255°C/W Figure 5-10. Maximum Safe Operating Area TA - Ambient Temperature (qC) -IDS - Drain-to-Source Current (A) -50 -25 0 25 50 75 100 125 150 175 0.5 1.5 2.5 D011 Figure 5-11. Maximum Drain Current vs Temperature CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 www.ti.com
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6 Device and Documentation Support
6.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
6.2 Trademarks
FemtoFET™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. www.ti.com CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
7.1 Mechanical Dimensions
C 0.35 2X 0.16 0.14 2X 0.26 0.24
0.36 MAX
0.225 0.16 0.14 0.51 0.49 0.175 0.4 A 0.73 0.65 B 0.64 0.56 PIN 1 INDEX AREA SEATING PLANE
0.015 C B A
0.015 C A B
A. All linear dimensions are in millimeters (dimensions and tolerancing per AME T14.5M-1994). B. This drawing is subject to change without notice. C. This package is a lead-free solder land design. Table 7-1. Pin Configuration POSITION DESIGNATION Pin 1 Gate Pin 2 Source Pin 3 Drain CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 www.ti.com
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7.2 Recommended Minimum PCB Layout
www.ti.com EXAMPLE BOARD LAYOUT 2X (0.25) 2X (0.15)
0.05 MIN
(0.4) (0.35) (0.15) (0.5) (0.175) (R ) TYP 0.05 4222304/A 09/2015 PicoStar - 0.35 mm max height YJM0003A PicoStar PKG SYMM LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:50X SOLDER MASK OPENING TYP METAL UNDER SOLDER MASK TYP NOTES: (continued) 4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). TM TM A. All dimensions are in millimeters. B. For more information, see FemtoFET Surface Mount Guide (SLRA003D).
7.3 Recommended Stencil Pattern
www.ti.com EXAMPLE STENCIL DESIGN 2X (0.15) (0.4) 2X (0.25) 2X (0.2) (0.4) (0.5) (0.15) (R ) TYP 0.05 (0.175) 4222304/A 09/2015 PicoStar - 0.35 mm max height YJM0003A PicoStar NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. TM TM SOLDER PASTE EXAMPLE ON 0.075 - 0.1 mm THICK STENCIL SCALE:50X PKG SYMM 2X SOLDER MASK EDGE A. All dimensions are in millimeters. www.ti.com CSD23280F3 SLPS601B – APRIL 2016 – REVISED FEBRUARY 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9
www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) CSD23280F3 Active Production PICOSTAR (YJM) | 3 3000 | LARGE T&R Yes NIAU Level-1-260C-UNLIM -55 to 150 5 CSD23280F3.B Active Production PICOSTAR (YJM) | 3 3000 | LARGE T&R Yes NIAU Level-1-260C-UNLIM -55 to 150 5 CSD23280F3T Active Production PICOSTAR (YJM) | 3 250 | SMALL T&R Yes NIAU Level-1-260C-UNLIM -55 to 150 5 CSD23280F3T.B Active Production PICOSTAR (YJM) | 3 250 | SMALL T&R Yes NIAU Level-1-260C-UNLIM -55 to 150 5 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 8-Jun-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 8-Jun-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CSD23280F3 PICOSTAR YJM 3 3000 182.0 182.0 20.0 CSD23280F3T PICOSTAR YJM 3 250 182.0 182.0 20.0 Pack Materials-Page 2
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