CSC2690 MULTICOMP | Alldatasheet
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Page <1> V1.023/02/24 Single Bipolar Transistor Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Absolute Maximum Ratings (Ta = 25°C Unless otherwise specified) Parameter Symbol CSC 2690 CSC 2690A Unit Collector-base voltage (open emitter) VCBO 120 160 VCollector-emitter voltage (open base) VCEO Emitter Base Voltage (open collector) VEBO 5 Collector current (DC) IC 1.2 ACollector Current (Pulse)1 2.5 Base current (DC) IB 0.3 Total power dissipation up to TA = 25°C Ptot 1.2 W Total power dissipation up to TC = 25°C 20 Junction Temperature Tj 150 Storage temperature Tstg -65 to +150 Application
- Audio frequency, High Frequency and Power Amplifier Features: 1. Complementary PNP Transistors CSA1220, CSA1220A 2. This product is available in AEC-Q101 Compliant and PPAP Capable also. Note: For AEC-Q101 compliant products, please use suffix -AQ in the part number while ordering. Parameter Symbol Test Condition Min./Min CSB649 CSD669 CSB649A Unit Collector Cut off Current ICBO IE = 0; VCB = 120V Max μA Emitter Cut off Current IEBO IC = 0; VEB = 3V 1 Breakdown voltages VCEO IC = 1mA; IB = 0 120 160 V VCBO IC = 1mA; IE = 0 VEBO IE = 1mA; IC = 0 5 Saturation voltage VCEsat1 IC = 1A; IB = 0.2A 0.7 Base-emitter voltage VBE (sat)1 1.3 DC Current Gain hFE1 IC=5mA, VCE=5V Min 35 IC=0.3mA, VCE=5V2 60 ~ 320 Output capacitance Cob VCB=10V, IE=0 Typ 19 pF Transition frequency fT IC = 0.2A; VCE = 5V 155 MHz Electrical Characteristics at (Ta = 25°C Unless otherwise specified) Note: 1. Pulse test tp ≤300μs, Duty cycle ≤2%
Page <3> V1.023/02/24 Single Bipolar Transistor Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro The Recommended solder Profile For Devices with Pb-free terminal plating where a Pb-free solder is used The Recommended solder Profile For Devices with Pb-free terminal plating used with leaded solder, or for devices with leaded terminal plating used with leaded solder Wave Profiles in Tabular Form Profile Feature Sn-Pb System Pb-Free System Average Ramp-Up Rate ~200°C/second ~200°C/second Heating rate during preheat Typical 1-2, Max 4°C/sec Typical 1-2, Max 4°C/Sec Final preheat Temperature Within 125°C of Solder Temp Within 125°C of Solder Temp Peak Temperature 235°C 260°C max. Time within +0 -5°C of actual Peak 10 seconds 10 seconds Ramp-Down Rate 5°C/second max. 5°C/second max. Recommended Wave Solder Profiles Typical Characteristics Curves
Page <4> V1.023/02/24 Single Bipolar Transistor Newark.com/multicomp-pro Farnell.com/multicomp-pro sg.element14.com/b/multicomp-pro Important Notice : This data sheet and its contents (the “Information”) belong to the members of the AVNET group of companies (the “Group”) or are licensed to it. No licence is granted for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence. Multicomp Pro is the registered trademark of Premier Farnell Limited 2019. Part Number Table Description Part Number Single Bipolar Transistor, NPN, 120V, 1200mA, 20W, TO-126 CSC2690 Single Bipolar Transistor, NPN, 160V, 1200mA, 20W, TO-126 CSC2690ADimensions : Millimetres Typical Characteristics Curves TO-126 Leaded Plastic Package DIM MIN MAX A 7.4 7.8 B 10.5 10.8 C 2.4 2.7 D 0.7 0.9 E 2.25 TYP. F 0.49 G 4.5 TYP. L 15.7 TYP. M 1.27 TYP. N 3.75 TYP. P 3 3.2 S 2.5 TYP.