CS9202_06 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • NOCAP
  • Low Quiescent Current (450 /C0109Α typ @ 100 /C0109A load)
  • 3.3 V , ±2% Output
  • 100 mA Output Current Capability
  • Fault Protection − 74 V Peak Transient V oltage − −15 V Reverse V oltage − Short Circuit − Thermal Shutdown − Overvoltage Shutdown
  • Internally Fused Leads
  • Pb−Free Packages are Available Current Source (Circuit Bias) Voltage Shutdown Over NOCAP Current Limit Sense Thermal Shutdown Bandgap Reference VOUT Sense* GND VIN + − Error Amplifier *Contact factory for optional Sense lead.

Figure 1. Block Diagram

ORDERING INFORMATION

CS9202YDF8 SOIC−8 98 Units/Rail CS9202YDFR8 2500 Tape & ReelSOIC−8 SOIC−8 DF SUFFIX CASE 751 NCNC GNDGND GNDGND VINVOUT PIN CONNECTIONS AND MARKING DIAGRAM http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. CS920 ALYW2 /C0071 CS9202 = Device Code A = Assembly Location L = Wafer Lot Y = Year W = Work Week /C0071 = Pb−Free Package CS9202YDFR8G 2500 Tape & ReelSOIC−8 (Pb−Free) CS9202YDF8G SOIC−8 (Pb−Free)

98 Units/Rail

http://onsemi.com MAXIMUM RATINGS Parameter Value Unit Power Dissipation Internally Limited − Input Voltage (VIN): DC Peak Transient Voltage (60 V Load Dump @ V IN = 14 V) −15 to 36 V V Output Current Internally Limited − ESD Susceptibility (Human Body Model) 4.0 kV Package Thermal Resistance: Junction−to−Case, R /C0113JC Junction−to−Ambient, R /C0113JA 110 °C/W °C/W Junction Temperature −40 to +150 °C Storage Temperature −55 to +150 °C Lead Temperature Soldering: Reflow (SMD styles only) (Note 1) 230 Peak °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above t he Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. 60 second maximum above 183 °C. ELECTRICAL CHARACTERISTICS (4.5 V ≤ VIN ≤ 26 V, IOUT = 1.0 mA, −40°C ≤ TJ ≤ 125°C; unless otherwise stated.) Parameter Test Conditions Min Typ Max Unit OUTPUT STAGE Output Voltage, VOUT 9.0 V < VIN < 16 V, 100 /C0109A ≤ IOUT ≤ 100 mA

4.5 V < VIN < 26 V, 100 /C0109A ≤ IOUT ≤ 100 mA

3.234 3.201 3.300 3.300 3.366 3.399 V V Load Regulation VIN = 14 V, 100 /C0109A ≤ IOUT ≤ 100 mA − 5 50 mV Line Regulation 4.5 V < V < 26 V, IOUT = 1.0 mA − 5 50 mV Quiescent Current, (IQ) IOUT = 100 /C0109A, VIN = 12 V IOUT ≤ 50 mA IOUT ≤ 100 mA − 450 750 /C0109A mA mA Ripple Rejection 7.0 V ≤ VIN ≤ 17 V, IOUT = 100 mA, f = 120 Hz 60 75 − dB Current Limit − 105 200 − mA Short Circuit Output Current VOUT = 0 V 25 125 − mA Thermal Shutdown (Note 2) − 150 180 − °C Overvoltage Shutdown VOUT ≤ 1.0 V 28 32 36 V 2. This parameter is guaranteed by design, but not parametrically tested in production. PACKAGE LEAD DESCRIPTION Package Lead Number SOIC−8 Lead Symbol Function 1 VOUT 3.3 V, ± 2%, 100 mA output. 2, 3, 6, 7 GND Ground. 4, 5 NC No connection. 8 VIN Input voltage.

Figure 10. Single output regulator with key performance parameters labeled. the die temperature below 150°C. R/C0113SA = the heatsink−to−ambient thermal resistance.

http://onsemi.com PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 CS9202/D NOCAP is a trademark of Semiconductor Components Industries, LLC. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative