CS8363 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- 2 Regulated Outputs − Standby Output 3.3 V ± 2%; 100 mA − Adjustable Tracking Output; 250 mA
- Low Dropout V oltage
- RESET for VSTBY
- ENABLE for V TRK
- Low Quiescent Current
- Protection Features − Independent Thermal Shutdown − Short Circuit − 60 V Load Dump − Reverse Battery A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week *Contact your local sales representative for SO−16L package option. D 2PAK−7 DPS SUFFIX CASE 936AC MARKING DIAGRAM CS8363 AWLYWW Pin 1. VSTBY 2. VIN 3. VTRK 4. GND 5. Adj 6. ENABLE 7. RESET Device Package Shipping † ORDERING INFORMATION* CS8363YDPS7 D 2PAK−7 50 Units/Rail CS8363YDPSR7 D 2PAK−7 750 Tape & Reel http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Figure 1. Block Diagram. Consult Your Local Sales Representative for Positive ENABLE Option
- 60 seconds max above 183°C
*The maximum package power dissipation must be observed.
http://onsemi.com ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT1 = IOUT2 = 100 A, −40°C ≤ TA ≤ +125°C; unless otherwise stated.) Characteristic Test Conditions Min Typ Max Unit Tracking Output (VTRK ) VTRK Tracking Error (VSTBY − VTRK ) 6.0 V ≤ VIN ≤ 26 V, 100 A ≤ ITRK ≤ 250 mA. Note 3 −25 − +25 mV Adjust Pin Current, IAdj Loop in Regulation − 1.5 5.0 A Line Regulation 6.0 V ≤ VIN ≤ 26 V. Note 3 − 5.0 50 mV Load Regulation 100 A ≤ ITRK ≤ 250 mA. Note 3 − 5.0 50 mV Dropout Voltage (VIN − VTRK ) ITRK = 100 A. ITRK = 250 mA 100 400 150 700 mV mV Current Limit VIN = 12 V, VTRK = 3.0 V 275 500 − mA Quiescent Current VIN = 12 V, ITRK = 250 mA, No Load on VSTBY VIN = 12 V, ITRK = 500 A, ISTBY = 100 A 145 220 mA A Reverse Current VTRK = 3.3 V, VIN = 0 V − 200 1500 A Ripple Rejection f = 120 Hz, ITRK = 250 mA, 7.0 V ≤ VIN ≤ 17 V 60 70 − dB Standby Output (VSTBY ) Line Regulation 6.0 V ≤ VIN ≤ 26 V. − 5.0 50 mV Load Regulation 100 A ≤ ISTBY ≤ 100 mA. − 5.0 50 mV Dropout Voltage (VIN − VSTBY ) ISTBY = 100 A, VIN = 4.2 V ISTBY = 100 mA, VIN = 4.2 V 1.0 1.0 V V Current Limit VIN = 12 V, VSTBY = 3.0 V 125 200 − mA Short Circuit Current VIN = 12 V, VSTBY = 0 V 10 100 − mA Quiescent Current VIN = 12 V, ISTBY = 100 mA, ITRK = 0 mA VIN = 12 V, ISTBY = 300 A, ITRK = 0 mA 140 200 mA A Reverse Current VSTBY = 3.3 V, VIN = 0 V − 100 200 A Ripple Rejection f = 120 Hz, ISTBY = 100 mA, 7.0 V ≤ VIN ≤ 17 V 60 70 − dB RESET ENABLE Functions ENABLE Input Threshold − 0.8 1.2 2.0 V ENABLE Input Bias Current VENABLE = 0 V to 10 V −10 0 10 A RESET Hysteresis − 10 50 100 mV RESET Threshold Low (VRL ) VSTBY Decreasing, VIN > 4.5 V 92.5 95 97.5 %V STBY RESET Leakage − − − 25 A Output Voltage, Low (VRLO ) 1.0 V ≤ VSTBY ≤ VRL , RRST = 10 k − 0.1 0.4 V Output Voltage, Low (VRPEAK ) VSTBY , Power Up, Power Down − 0.6 1.0 V VIN (VRST Low) VSTBY = 3.3 V − 4.0 4.5 V Protection Circuitry (Both Outputs) Independent Thermal Shutdown VSTBY VTRK 150 150 180 165 Overvoltage Shutdown − 30 34 38 V 3. VTRK connected to Adj lead. VTRK can be set to higher values by using an external resistor divider.
1 VSTBY Standby output voltage delivering 100 mA. 3 VTRK Tracking output voltage controlled by ENABLE delivering 250 mA. 4 GND Reference ground connection. VTRK , VTRK will track VSTBY . 6 ENABLE Provides on/off control of the tracking output, active LOW.
7 RESET CMOS compatible output lead that goes low whenever VSTBY falls out of
during power−up or power−down. microprocessor−based systems. lead to the VTRK output lead.
3.3 V, 100 mA
*C1 is required if regulator is located far from power supply filter. **C2 and C3 are required for stability. Figure 2. Test and Application Circuit, 3.3 V, 5.0 V Regulator
http://onsemi.com C1* 0.1 F GND CS8363 MCU B+ VIN VTRK Adj ENABLE RESET VSTBY VDD C2** 10 F ESR < 8.0 C3** 10 F ESR < 8.0 SW 3.3 V, 250 mA GND *C1 is required if regulator is located far from power supply filter. **C2 and C3 are required for stability. Figure 3. Test and Application Circuit, Dual 3.3 V Regulator stability. Without them, the regulator outputs will oscillate. series resistance (ESR) is also a factor in the IC stability. temperature and maximum load expected. characteristic of a particular system. to −40°C, capacitors rated at that temperature must be used. the die temperature below 150°C. Figure 4. Dual Output Regulator With Key Performance Parameters Labeled.
http://onsemi.com Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of R JA: R JA R JC R CS R SA (3) where: R JC = the junction−to−case thermal resistance, R CS = the case−to−heatsink thermal resistance, and R SA = the heatsink−to−ambient thermal resistance. R JC appears in the package section of the data sheet. Like R JA, it too is a function of package type. RCS and RSA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers.
http://onsemi.com PACKAGE DIMENSIONS D 2PAK−7 DPS SUFFIX CASE 936AB−01 ISSUE O For D2PAK Outline and Dimensions − Contact Factory PACKAGE THERMAL DATA Parameter D 2PAK−7 Unit R JC Typical 3.5 °C/W R JA Typical 10−50* °C/W *Depending on thermal properties of substrate. RJA = RJC + RCA .
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