CS8361 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- 2 Regulated Outputs − Standby Output 5.0 V ± 2%; 100 mA − Tracking Output 5.0 V; 250 mA
- Low Dropout V oltage (0.4 V at Rated Current)
- RESET Option
- ENABLE Option
- Low Quiescent Current
- Protection Features − Independent Thermal Shutdown − Short Circuit − 60 V Load Dump − Reverse Battery
- Internally Fused Leads in SO−16L Package
- These are Pb−Free Devices CS8361 = Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb −Free Package SO−16L DW SUFFIX CASE 751G RESETENABLE 1 16 NCNC NCAdj GNDGND GNDGND NCVTRK NCNC VSTBYVIN D2PAK−7 DPS SUFFIX CASE 936AB PIN CONNECTIONS AND MARKING DIAGRAM SO−16L Pin 1. V STBY 2. VIN 3. VTRK 4. GND 5. Adj 6. ENABLE 7. RESET D2PAK−7 CS8361 AWLYYWWG http://onsemi.com CS 8361 AWLYWWG See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Figure 1. Block Diagram. Consult Your Local Sales Representative for Positive ENABLE Option damage may occur and reliability may be affected.
- 60 seconds max above 183 °C
*The maximum package power dissipation must be observed.
http://onsemi.com ELECTRICAL CHARACTERISTICS (6.0 V ≤ VIN ≤ 26 V, IOUT1 = IOUT2 = 100 /C0109A, −40°C ≤ TA ≤ +125°C, −40°C ≤ TJ ≤ +150°C; unless otherwise stated.) Characteristic Test Conditions Min Typ Max Unit Tracking Output (VTRK) VTRK Tracking Error (VSTBY − VTRK) 6.0 V ≤ VIN ≤ 26 V, 100 /C0109A ≤ ITRK ≤ 250 mA. Note 3 −25 − +25 mV Adjust Pin Current, IAdj Loop in Regulation − 1.5 5.0 /C0109A Line Regulation 6.0 V ≤ VIN ≤ 26 V. Note 3 − 5.0 50 mV Load Regulation 100 /C0109A ≤ ITRK ≤ 250 mA. Note 3 − 5.0 50 mV Dropout Voltage (VIN − VTRK) ITRK = 100 /C0109A. ITRK = 250 mA 100 400 150 700 mV mV Current Limit VIN = 12 V, VTRK = 4.5 V 275 500 − mA Quiescent Current VIN = 12 V, ITRK = 250 mA, No Load on VSTBY − 25 50 mA Reverse Current VTRK = 5.0 V, VIN = 0 V − 200 1500 /C0109A Ripple Rejection f = 120 Hz, ITRK = 250 mA, 7.0 V ≤ VIN ≤ 17 V 60 70 − dB Standby Output (VSTBY) Line Regulation 6.0 V ≤ VIN ≤ 26 V. − 5.0 50 mV Load Regulation 100 /C0109A ≤ ISTBY ≤ 100 mA. − 5.0 50 mV Dropout Voltage (VIN − VSTBY) ISTBY = 100 /C0109A. ISTBY = 100 mA 100 400 150 600 mV mV Current Limit VIN = 12 V, VSTBY = 4.5 V 125 200 − mA Short Circuit Current VIN = 12 V, VSTBY = 0 V 10 100 − mA Quiescent Current VIN = 12 V, ISTBY = 100 mA, ITRK = 0 mA VIN = 12 V, ISTBY = 300 /C0109A, ITRK = 0 mA 140 200 mA /C0109A Reverse Current VSTBY = 5.0 V, VIN = 0 V − 100 200 /C0109A Ripple Rejection f = 120 Hz, ISTBY = 100 mA, 7.0 V ≤ VIN ≤ 17 V 60 70 − dB RESET ENABLE Functions ENABLE Input Threshold − 0.8 1.2 2.0 V ENABLE Input Bias Current VENABLE = 0 V to 10 V −10 0 10 /C0109A RESET Threshold High (VRH) VSTBY Increasing 4.59 4.87 VSTBY − 0.02 V RESET Hysteresis − 60 120 180 mV RESET Threshold Low (VRL) VSTBY Decreasing 4.53 4.75 VSTBY − 0.08 V RESET Leakage − − − 25 /C0109A Output Voltage, Low (VRLO) 1.0 V ≤ VSTBY ≤ VRL, RRST = 10 k/C0087 − 0.1 0.4 V Output Voltage, Low (VRPEAK) VSTBY, Power Up, Power Down − 0.6 1.0 V Protection Circuitry (Both Outputs) Independent Thermal Shutdown VSTBY VTRK 150 150 180 165 Overvoltage Shutdown − 30 34 38 V 3. V TRK connected to Adj lead. VTRK can be set to higher values by using an external resistor divider.
1 16 VSTBY Standby output voltage delivering 100 mA. 3 3 VTRK Tracking output voltage controlled by ENABLE delivering 250 mA. 4 4, 5, 12, 13 GND Reference ground connection. VTRK. If tied to VTRK, VTRK will track VSTBY. 6 8 ENABLE Provides on/off control of the tracking output, active LOW. during power−up or power−down. microprocessor− based systems. lead to the VTRK output lead.
5.0 V, 100 mA
*C1 is required if regulator is located far from power supply filter. **C2 and C3 are required for stability. Figure 2. Test and Application Circuit, 5.0 V, 8.0 V Regulator
http://onsemi.com C1* 0.1 /C0109F GND CS8361 MCU B+ VIN VTRK Adj ENABLE RESET VSTBY VDD C2** 10 /C0109F ESR < 8.0 /C0087 C3** 10 /C0109F ESR < 8.0 /C0087 SW 5.0 V, 250 mA GND *C1 is required if regulator is located far from power supply filter. **C2 and C3 are required for stability. Figure 3. Test and Application Circuit, Dual 5.0 V Regulator stability. Without them, the regulator outputs will oscillate. series resistance (ESR) is also a factor in the IC stability. temperature and maximum load expected. characteristic of a particular system. to −40°C, capacitors rated at that temperature must be used. the die temperature below 150°C. Figure 4. Dual Output Regulator With Key Performance Parameters Labeled.
http://onsemi.com Heat Sinks A heat sink effectively increases the surface area of the package to improve the flow of heat away from the IC and into the surrounding air. Each material in the heat flow path between the IC and the outside environment will have a thermal resistance. Like series electrical resistances, these resistances are summed to determine the value of R /C0113JA: R/C0081JA /C0043R/C0081JC /C0041R/C0081CS /C0041R/C0081SA (3) where: R/C0113JC = the junction−to−case thermal resistance, R/C0113CS = the case−to−heatsink thermal resistance, and R/C0113SA = the heatsink−to−ambient thermal resistance. R/C0113JC appears in the package section of the data sheet. Like R/C0113JA, it too is a function of package type. R/C0113CS and R/C0113SA are functions of the package type, heatsink and the interface between them. These values appear in heat sink data sheets of heat sink manufacturers. ORDERING INFORMATION* Device Package Shipping† CS8361YDPS7G D2PAK−7 (Pb−Free)
50 Units/Rail
CS8361YDPSR7G D2PAK−7 (Pb−Free) 750 / Tape & Reel CS8361YDWF16G SO−16L (Pb−Free)
46 Units/Rail
CS8361YDWFR16G SO−16L (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Spe- cifications Brochure, BRD8011/D. *Contact your local sales representative for other package options including PSOP−20, TO−220−7, DIP−16, and SO−20L.
http://onsemi.com PACKAGE DIMENSIONS SO−16L DWF SUFFIX CASE 751G−03 ISSUE C D 14X B16X SEATING PLANE SAM0.25 B ST 16 9 h X 45/C0095 MBM0.25 H8X E B A e T A L C /C0113 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 /C0113 0 7 /C0095/C0095 PACKAGE THERMAL DATA Parameter SO−16L D2PAK, 7−Pin Unit R/C0113JC Typical 18 3.5 °C/W R/C0113JA Typical 75 10−50* °C/W *Depending on thermal properties of substrate. R/C0113JA = R/C0113JC + R/C0113CA.
http://onsemi.com PACKAGE DIMENSIONS D2PAK−7 (SHORT LEAD) DPS SUFFIX CASE 936AB−01 ISSUE B 0.539 DIM MIN MAX MIN MAX MILLIMETERSINCHES E 0.380 0.420 9.65 10.67 D 0.325 0.368 8.25 9.53 A 0.170 0.180 4.32 4.57 b 0.026 0.036 0.66 0.91 c2 0.045 0.055 1.14 1.40 e 0.050 BSC 1.27 BSC H 0.579 13.69 14.71 A1 0.000 0.010 0.00 0.25 c 0.017 0.026 0.43 0.66 E D cb e H L 0.058 0.078 1.47 1.98 M L3 0.010 BSC 0.25 BSC 0 8 °° 0 8 °° *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. RECOMMENDED NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH AND GATE PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO EXCEED 0.005 MAXIMUM PER SIDE. THESE DIMENSIONS TO BE MEASURED AT DATUM H. 4. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS E, L1, D1, AND E1. DIMENSIONS D1 AND E1 ESTABLISH A MINIMUM MOUNTING SURFACE FOR THE THERMAL PAD. A DIMENSIONS: MILLIMETERS 0.424 0.584 0.310 0.136 0.040 0.050 PITCH SOLDERING FOOTPRINT* B H L M DETAIL C SEATING PLANE GAUGE PLANE A MAM0.13 B E/2 B SEATING PLANE A A DETAIL C VIEW A−A MAM0.10 B ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. CS8361/D SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative