CS8321 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • 5.0 V ± 2% Output
  • Low 140 /C0109A (typ) Quiescent Current
  • 150 mA Output Current Capability
  • Fault Protection ♦ −15 V Reverse V oltage Output Current Limit
  • Low Reverse Current (Output to Input)
  • Pb−Free Packages are Available*

Figure 1. Block Diagram Reference Manual, SOLDERRM/D. dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com ABSOLUTE MAXIMUM RATINGS Rating Value Unit Transient Input Voltage −15, 45 V Output Current Internally Limited − ESD Susceptibility (Human Body Model) 2.0 kV Junction Temperature −40 to 150 °C Storage Temperature −65 to 150 °C Lead Temperature Soldering Wave Solder (through hole styles only) Note 1 Reflow (SMD styles only) Note 2 260 peak 230 peak Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 10 seconds max 2. 60 seconds max above 183 °C ELECTRICAL CHARACTERISTICS (6.0 V < VIN < 26 V, IOUT = 1.0 mA, −40°C ≤ TA ≤ 125°C, −40°C ≤ TJ ≤ 150°C; unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit Output Stage Output Voltage, VOUT 9.0 V < VIN 16 V, 100 mA ≤ IOUT ≤ 150 mA 4.9 5.0 5.1 V Dropout Voltage (VIN − VOUT) IOUT = 150 mA, −40°C ≤ TA ≤ 85°C IOUT = 150 mA, TA = 125°C 0.3 0.5 0.6 V V Quiescent Current, (IQ) IOUT = 1.0 mA @ VIN = 13 V IOUT < 50 mA @ VIN = 13 V IOUT < 150 mA @ VIN = 13 V 4.0 200 6.0 /C0109A mA mA Load Regulation VIN = 14 V, 100 /C0109A < IOUT < 150 mA − 5.0 50 mV Line Regulation 6.0 V ≤ V ≤ 26 V, IOUT = 1.0 mA − 5.0 50 mV Ripple Rejection 7.0 ≤ VIN ≤ 17 V, IOUT = 150 mA, f = 120 Hz 60 75 − dB Current Limit − 175 250 − mA Short Circuit Output Current VOUT = 0 V 60 200 − mA Reverse Current VOUT = 5.0 V, VIN = 0 V − 140 200 /C0109A PACKAGE PIN DESCRIPTION PACKAGE PIN # PIN SYMBOL FUNCTIONTO−220−3 D2PAK−3 1 1 VIN Input voltage. 2 2 GND Ground. All GND leads must be connected to ground. 3 3 VOUT 5.0 V, ±2%, 150 mA Output. ORDERING INFORMATION* Device Package Shipping† CS8321YT3 TO−220−3 50 Units / Rail CS8321YT3G TO−220−3 (Pb−Free)

50 Units / Rail

CS8321YDP3 D2PAK−3 50 Units / Rail CS8321YDP3G D2PAK−3 (Pb−Free) CS8321YDPR3 D2PAK−3 750 Units / Tape & Reel CS8321YDPR3G D2PAK−3 (Pb−Free)

750 Units / Tape & Reel

*Contact your local sales representative for SO−16, DIP−16, SO−8, and DIP−8 package options. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

design under steady state conditions. conditions for the regulator at low temperature. 3 and vary the input voltage until the oscillations increase. working environment. Vary the ESR to reduce ringing. step 5 to test for any oscillations. 50% of the maximum allowable ESR found in step 3 above. the die temperature below 150°C. Figure 5. Single Output Regulator with Key R/C0113SA = the heatsink−to−ambient thermal resistance.

http://onsemi.com PACKAGE DIMENSIONS TO−220−3 T SUFFIX CASE 221A−08 ISSUE AA NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. A K L G D N H Q F 123 −T− SEATING PLANE S R J U T C 3 PL −B− −Y− MBM0.25 (0.010) Y DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.560 0.625 14.23 15.87 B 0.380 0.420 9.66 10.66 C 0.140 0.190 3.56 4.82 D 0.025 0.035 0.64 0.89 F 0.139 0.155 3.53 3.93 G 0.100 BSC 2.54 BSC J 0.012 0.045 0.31 1.14 K 0.500 0.580 12.70 14.73 L 0.045 0.060 1.15 1.52 N 0.200 BSC 5.08 BSC Q 0.100 0.135 2.54 3.42 R 0.080 0.115 2.04 2.92 S 0.020 0.055 0.51 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 V PACKAGE THERMAL DATA Parameter TO−220−3 D2PAK−3 Unit R/C0113JC Typical 3.5 1.0* °C/W R/C0113JA Typical 50 10−50† °C/W *Depending on die area. †Depending on thermal properties of substrate. R/C0113JA = R/C0113JC + R/C0113CA.

http://onsemi.com PACKAGE DIMENSIONS D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURRS. 4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS. 5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE. A C B S K E M P ND G H W R −A− U V TERMINAL 4 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.396 0.406 10.05 10.31 B 0.330 0.340 8.38 8.64 C 0.170 0.180 4.31 4.57 D 0.026 0.036 0.66 0.91 E 0.045 0.055 1.14 1.40 G 0.100 REF 2.54 REF H 0.580 0.620 14.73 15.75 K 0.055 0.066 1.40 1.68 L 0.000 0.010 0.00 0.25 M 0.098 0.108 2.49 2.74 N 0.017 0.023 0.43 0.58 P 0.090 0.110 2.29 2.79 R 0 8 S 0.095 0.105 2.41 2.67 U 0.30 REF 7.62 REF V 0.305 REF 7.75 REF W 0.010 0.25 °° 0 8 °° L ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 CS8321/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.