CS8221 ONSEMI | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 7

Technical content

Features

  • Low Quiescent Current (60 /C0109A @ 100 /C0109A Load)
  • 5.0 V ±2.0% Output
  • 100 mA Output Current Capability
  • Internally Fused Leads in SO−8 Package
  • Fault Protection − +74 V Peak Transient V oltage − −15 V Reverse V oltage − Short Circuit − Thermal Shutdown
  • Pb−Free Package is Available PIN CONNECTIONS AND MARKING INDIAGRAM Device Package Shipping † ORDERING INFORMATION* CS8221YDF8 SO−8 95 Units/Rail CS8221YDFR8 D2PAK−3 2500/Tape & Reel CS8221YDP3 50 Units/Rail CS8221 = Specific Device Code A = Assembly Location WL, L = Wafer Lot Y = Year WW, W = Work Week G or /C0071= Pb−Free Package SO−8 DF SUFFIX CASE 7511 NCNC CS822 ALYW1 /C0071 GNDGND GNDGND VINVOUT CS 8221 AWLYWWG Tab = GND Pin 1. V IN 2. GND 3. V OUT D2PAK−3 SO−8 CS8221YDPR3 SO−8 D2PAK−3 750/Tape & Ree l *Contact your local sales representative for TO−92 package option. http://onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. D2PAK−3 DP SUFFIX CASE 418AB1 2 3 CS8221YDFR8G 2500/Tape & Ree lSO−8 (Pb−Free)

Figure 1. Block Diagram

  1. 60 seconds maximum above 183 °.

*The maximum package power dissipation must be observed.

6.0 V ≤ VIN ≤ 26 V, 100 /C0109A ≤ IOUT ≤ 100 mA

  1. This parameter is guaranteed by design, but not parametrically tested in production.

Figure 2. CS8221 Output Stability

50% of the maximum allowable ESR found in step 3 above. the die temperature below 150°C. Figure 5. Single Output Regulator With Key RΘSA = the heatsink−to−ambient thermal resistance.

http://onsemi.com PACKAGE DIMENSIONS SO−8 DF SUFFIX CASE 751−07 ISSUE AG SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*

http://onsemi.com PACKAGE DIMENSIONS D2PAK−3 DP SUFFIX CASE 418AB−01 ISSUE O NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. PACKAGE OUTLINE EXCLUSIVE OF MOLD FLASH AND METAL BURRS. 4. PACKAGE OUTLINE INCLUSIVE OF PLATING THICKNESS. 5. FOOT LENGTH MEASURED AT INTERCEPT POINT BETWEEN DATUM A AND LEAD SURFACE. A B S K E M P ND G H W R −A− U V TERMINAL 4 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.396 0.406 10.05 10.31 B 0.330 0.340 8.38 8.64 C 0.170 0.180 4.31 4.57 D 0.026 0.036 0.66 0.91 E 0.045 0.055 1.14 1.40 G 0.100 REF 2.54 REF H 0.580 0.620 14.73 15.75 K 0.055 0.066 1.40 1.68 L 0.000 0.010 0.00 0.25 M 0.098 0.108 2.49 2.74 N 0.017 0.023 0.43 0.58 P 0.090 0.110 2.29 2.79 R 0 8 S 0.095 0.105 2.41 2.67 U 0.30 REF 7.62 REF V 0.305 REF 7.75 REF W 0.010 0.25 °° 0 8 °° L PACKAGE THERMAL DATA Parameter SO−8 D2PAK−3 Unit RΘJC Typical 25 4.2 °C/W RΘJA Typical 110 10−50* °C/W * Depending on thermal properties of substrate. RθJA = RθJC = RθCA ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 CS8221/D SMART REGULATOR is a registered trademark of Semiconductor Components Industries, LLC (SCILLC). LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.