CS3341_05 ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 8

Technical content

Features

  • Drives NPN Darlington
  • Short Circuit Protection
  • 80 V Load Dump
  • Temperature Compensated Regulation V oltage
  • Shorted Field Protection Duty Cycle, Self Clearing
  • Pb−Free Packages are Available* MAXIMUM RATINGS Rating Value Unit Storage Temperature Range, TS −55 to +165 °C Junction Temperature Range −40 to 150 °C Continuous Supply 27 V ICC Load Dump 400 mA Lead Temperature Soldering: Reflow: (SMD styles only) (Note 1) 230 peak °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. 60 second maximum above 183 °C. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. CS33x1 = Specific Device Code x 4 or 5 A = Assembly Location WL = Wafer Lot Y = Year WW = Work Week G = Pb−Free Package SOIC−14 D SUFFIX CASE 751A IGNNC NCNC STATORLamp SenseOSC 11 4 VCCNC NCGND SCDD PIN CONNECTIONS SOIC−14 MARKING DIAGRAM VCC Sense Stator IGN GND NC OSC Lamp DD SC Flip Chip, Bump Side Up http://onsemi.com CS33x1G AWLYWW See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

Figure 1. Block Diagram

CS3341, CS3351, CS387 http://onsemi.com ELECTRICAL CHARACTERISTICS (−40°C < TA < 125°C, −40°C < TJ < 150°C, 9.0 V ≤ VCC ≤ 17 V; unless otherwise specified.) Characteristic Test Conditions Min Typ Max Unit Supply Supply Current Enabled − − 12 25 mA Supply Current Disabled − − − 50 /C0109A Driver Stage Output High Current VDD = 1.2 V −10 −6.0 −4.0 mA Output Low Voltage IOL = 25 /C0109A − − 0.35 V Minimum ON Time − 200 − − /C0109s Minimum Duty Cycle − − 6.0 10 % Short Circuit Duty Cycle − 1.0 − 5.0 % Field Switch Turn On Rise Time − 30 − 90 /C0109s Field Switch Turn On Fall Time − 30 − 90 /C0109s Stator Input High Voltage − 10 − − V Input Low Voltage − − − 6.0 V Stator Time Out High to Low 6.0 100 600 ms Stator Power−Up Input High CS3351 only 10 − − V Stator Power−Up Input Low CS3351 only − − 6.0 V Lamp Output High Current VLAMP @ 3.0 V − − 50 /C0109A Output Low Voltage ILAMP @ 30 mA − − 0.35 V Ignition Input High Voltage ICC > 1.0 mA 1.8 − − V Input Low Voltage ICC < 100 /C0109A − − 0.5 V Oscillator Oscillator Frequency COSC = 0.22 /C0109F 65 − 325 Hz Rise Time/Fall Time COSC = 0.22 /C0109F − 17 − − Oscillator High Threshold COSC = 0.22 /C0109F − − 6.0 V Battery Sense Input Current − −10 − +10 /C0109A Regulation Voltage @25°C, R1 = 100 k/C0087, R2 = 50 k/C0087 13.5 − 16 V Proportional Control − 0.050 − 0.400 V High Voltage Threshold Ratio VHigh Voltage @ LampOn VRegulation @ 50%Duty Cycle 1.083 − 1.190 − High Voltage Hysteresis − 0.020 − 0.600 V

CS3341, CS3351, CS387 http://onsemi.com PACKAGE PIN DESCRIPTION PACKAGE PIN # PIN SYMBOL FUNCTIONSOIC−14 Flip Chip 1 1 Driver Output driver for external power switch−Darlington 2 2 GND Ground 3, 6, 7, 9, 13 3 NC No Connection 4 4 OSC Timing capacitor for oscillator 5 5 Lamp Base driver for lamp driver indicates no stator signal or overvoltage condition 8 6 IGN Switched ignition powerup 10 7 Stator Stator signal input for stator timer (CS3351 also powerup) 11 8 Sense Battery sense voltage regulator comparator input and protection 12 9 VCC Supply for IC 14 10 SC Short circuit sensing Device Package Shipping† CS3341YD14 SOIC−14 55 Units/Rail CS3341YD14G SOIC−14 (Pb−Free)

55 Units/Rail

CS3341YDR14 SOIC−14 2500 Tape & Reel CS3341YDR14G SOIC−14 (Pb−Free)

2500 Tape & Reel

CS3351YD14 SOIC−14 55 Units/Rail CS3351YD14G SOIC−14 (Pb−Free) CS3351YDR14 SOIC−14 2500 Tape & Reel CS3351YDR14G SOIC−14 (Pb−Free) CS387H Flip Chip Contact Sales †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Figure 8. Flip Chip Dimensions and Solder Bump Locations, Bump Side Up

CS3341, CS3351, CS387 http://onsemi.com PACKAGE DIMENSIONS SOIC−14 D SUFFIX CASE 751A−03 ISSUE G −A− −B− G P7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST −T− FRX 45 SEATING PLANE D14 PL K C JM /C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 PACKAGE THERMAL DATA Parameter SOIC−14 Unit R/C0113JC Typical 30 °C/W R/C0113JA Typical 125 °C/W ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 CS3341/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.