CS2844 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Optimized for Off–Line Control
  • Temp. Compensated Oscillator
  • 50% Max Duty–Cycle Clamp
  • V REF Stabilized Before Output Stage Is Enabled
  • Low Start–Up Current
  • Pulse–By–Pulse Current Limiting
  • Improved Undervoltage Lockout
  • Double Pulse Suppression
  • 1.0% Trimmed Bandgap Reference
  • High Current Totem Pole Output http://onsemi.com x = 2 or 3 y = 4 or 5 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week DIP–8 N SUFFIX CASE 626 SO–8 D SUFFIX CASE 7511 SO–14 D SUFFIX CASE 751A1 CSx84yN AWL YYWW MARKING DIAGRAMS 384yD ALYW CSx84yD14 AWLYWW See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

SO–16L DW SUFFIX CASE 751G CSx84yDW AWLYYWW

Figure 1. Block Diagram

16 V/10 V

CS2844, CS3844, CS2845, CS3845 http://onsemi.com MAXIMUM RATINGS* Rating Value Unit Supply Voltage (ICC < 30 mA) Self Limiting – Supply Voltage (Low Impedance Source) 30 V Output Current ±1.0 A Output Energy (Capacitive Load) 5.0 µJ Analog Inputs (VFB , Sense) –0.3 to + 5.5 V Error Amp Output Sink Current 10 mA Package Thermal Resistance, PDIP–8 Junction–to–Case, RθJC Junction–to–Ambient, RθJA 100 °CW °CW Package Thermal Resistance, SO–8 Junction–to–Case, RθJC Junction–to–Ambient, RθJA 165 °CW °CW Package Thermal Resistance, SO–14 Junction–to–Case, RθJC Junction–to–Ambient, RθJA 125 °CW °CW Package Thermal Resistance, SO–16L Junction–to–Case, RθJC Junction–to–Ambient, RθJA 105 °CW °CW Lead Temperature Soldering: Wave Solder (through hole styles only) (Note 1) Reflow (SMD styles only) (Note 2) 260 peak 230 peak 1. 10 second maximum. 2. 60 second maximum above 183°C. *The maximum package power dissipation must be observed. ELECTRICAL CHARACTERISTICS (–25° ≤ TA ≤ 85° for CS2844/2845, 0° ≤ TA ≤ 70° for CS3844/CS3845. VCC = 15 V*; RT = 10 kΩ , CT = 3.3 nF for sawtooth mode; unless otherwise stated.) CS2844/CS2845 CS3844/CS3845 Characteristic Test Conditions Min Typ Max Min Typ Max Unit Reference Section Line Regulation 12 ≤ VCC ≤ 25 V – 6.0 20 – 6.0 20 mV Load Regulation 1.0 ≤ IREF ≤ 20 mA – 6.0 25 – 6.0 25 mV Output Noise Voltage 10 Hz ≤ f ≤ 10 kHz, TJ = 25°C. Note 3. – 50 – – 50 – µV Long Term Stability TA = 125°C, 1000 Hrs. Note 3. – 5.0 25 – 5.0 25 mV Output Short Circuit TA = 25°C –30 –100 –180 –30 –100 –180 mA Oscillator Section Initial Accuracy Sawtooth Mode, TJ = 25°C 47 52 57 47 52 57 kHz Voltage Stability 12 ≤ VCC ≤ 25 V – 0.2 1.0 – 0.2 1.0 % Temperature Stability Sawtooth Mode TMIN ≤ TA ≤ TMAX . Note 3. – 5.0 – – 5.0 – % Amplitude VOSC (peak to peak) – 1.7 – – 1.7 – V 3. These parameters, although guaranteed, are not 100% tested in production. *Adjust VCC above the start threshold before setting at 15 V.

CS2844, CS3844, CS2845, CS3845 http://onsemi.com ELECTRICAL CHARACTERISTICS (continued) (–25° ≤ TA ≤ 85° for CS2844/2845, 0° ≤ TA ≤ 70° for CS3844/CS3845. VCC = 15 V*; RT = 10 kΩ , CT = 3.3 nF for sawtooth mode; unless otherwise stated.) CS2842A/CS2843A CS3842A/CS3843A Characteristic Test Conditions Min Typ Max Min Typ Max Unit Error Amp Section Input Bias Current VFB = 0 – –0.3 –1.0 – –0.3 –2.0 µA AVOL 2.0 ≤ VOUT ≤ 4.0 V 65 90 – 65 90 – dB PSRR 12 ≤ VCC ≤ 25 V 60 70 – 60 70 – dB Current Sense Section PSRR 12 ≤ VCC ≤ 25 V. Note 5. – 70 – – 70 – dB Input Bias Current VSENSE = 0 – –2.0 –10 – –2.0 –10 µA Delay to Output TJ = 25°C. Note 4. – 150 300 – 150 300 ns Output Section Output Low Level ISINK = 20 mA ISINK = 200 mA 0.1 1.5 0.4 2.2 0.1 1.5 0.4 2.2 V V Output High Level ISOURCE = 20 mA ISOURCE = 200 mA 13.5 13.5 13.5 13.5 V V Rise Time TJ = 25°C, CL = 1.0 nF. Note 4. – 50 150 – 50 150 ns Fall Time TJ = 25°C, CL = 1.0 nF. Note 4. – 50 150 – 50 150 ns Total Standby Current Startup Current – – 0.5 1.0 – 0.5 1.0 mA Operating Supply Current VFB = VSENSE = 0 V, R T = 10 kΩ , CT = 3.3 nF – 11 17 – 11 17 mA VCC Zener Voltage ICC = 25 mA – 34 – – 34 – V PWM Section Maximum Duty Cycle – 46 48 50 46 48 50 % Minimum Duty Cycle – – – 0 – – 0 % 4. These parameters, although guaranteed, are not 100% tested in production. 5. Parameters measured at trip point of latch with VFB = 0. 6. Gain defined as: A = ΔVCOMP /ΔVSENSE ; 0 ≤ VSENSE ≤ 0.8 V. *Adjust VCC above the start threshold before setting at 15 V.

ELECTRICAL CHARACTERISTICS (continued) (–25° ≤ TA ≤ 85° for CS2844/2845, 0° ≤ TA ≤ 70° for CS3844/CS3845. *Adjust VCC above the start threshold before setting at 15 V. 1 1 3 COMP Error amp output, used to compensate error amplifier. 2 3 4 VFB Error amp inverting input. 3 5 5 Sense Noninverting input to Current Sense Comparator. 4 7 6 OSC Oscillator timing network with capacitor to ground, resistor to VREF. – 8 10 Pwr GND Output driver ground. 6 10 12 VOUT Output drive pin. – 11 13 VCC Pwr Output driver positive supply. 7 12 14 VCC Positive power supply. 8 14 15 VREF Output of 5.0 V internal reference. Figure 2. Test Circuit Open Loop Laboratory Test Fixture

CS2844, CS3844, CS2845, CS3845 http://onsemi.com Device Temperature Range Package Shipping CS2844LN8 DIP–8 50 Units/Rail CS2844LD14 SO–14 55 Units/Rail CS2844LDR14 SO–14 2500 Tape & Reel CS2844LDW16 25°Ct o8 5°C SO–16L 48 Units/Rail CS2844LDWR16 –25°C to 85°C SO–16L 2500 Tape & Reel CS2845LN8 DIP–8 50 Units/Rail CS2845LDW16 SO–16L 48 Units/Rail CS2845LDWR16 SO–16L 2500 Tape & Reel CS3844GN8 DIP–8 50 Units/Rail CS3844GD8 SO–8 98 Units/Rail CS3844GDR8 SO–8 2500 Tape & Reel CS3844GD14 SO–14 55 Units/Rail CS3844GDR14 SO–14 2500 Tape & Reel CS3844GDW16 SO–16 48 Units/Rail CS3844GDWR16 0°Ct o7 0°C SO–16 2500 Tape & Reel CS3845GN8 0°C to 70°C DIP–8 50 Units/Rail CS3845GD8 SO–8 98 Units/Rail CS3845GDR8 SO–8 2500 Tape & Reel CS3845GD14 SO–14 55 Units/Rail CS3845GDR14 SO–14 2500 Tape & Reel CS3845GDW16 SO–16L 48 Units/Rail CS3845GDWR16 SO–16L 2500 Tape & Reel

CS2844, CS3844, CS2845, CS3845 http://onsemi.com PACKAGE DIMENSIONS DIP–8 N SUFFIX CASE 626–05 ISSUE L NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. F NOTE 2 –A– –B– –T– SEATING PLANE H J G D K N C L M MAM0.13 (0.005) B MT DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M --- 10 --- 10 N 0.76 1.01 0.030 0.040 SO–8 D SUFFIX CASE 751–07 ISSUE W SEATING PLANE N J X 45 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 –X– –Y– G MYM0.25 (0.010) –Z– YM0.25 (0.010) Z S X S M

CS2844, CS3844, CS2845, CS3845 http://onsemi.com PACKAGE DIMENSIONS SO–14 D SUFFIX CASE 751A–03 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. –A– –B– G P 7 PL 14 8 M0.25 (0.010) B M SBM0.25 (0.010) A ST –T– FR X 45 SEATING PLANE D 14 PL K C JM DIM MIN MAX MIN MAX INCHESMILLIMETERS A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.228 0.244 R 0.25 0.50 0.010 0.019 SO–16L DW SUFFIX CASE 751G–03 ISSUE B D 14X B16X SEATING PLANE SAM0.25 B ST 16 9 h X 45 MBM0.25 H8X E B A e T A L C NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 0 7

CS2844, CS3844, CS2845, CS3845 http://onsemi.com Notes

CS2844, CS3844, CS2845, CS3845 http://onsemi.com Notes

CS2844, CS3844, CS2845, CS3845 http://onsemi.com ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATION JAPAN : ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone : 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative. CS2844/D Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone : 303–675–2175 or 800–344–3860 Toll Free USA/Canada Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada