CRGP TEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Key Features Small size and light weight Suitable for both wave and reflow soldering techniques Supplied on tape Pulse Rated 7 different package sizes Terminal finish matte Sn over Ni Type CRGP Series TE Connectivity is pleased to introduce this SMD Pulse withstand thick film Chip resistor, suitable for auto placement in volume and for most applications. Available in five different packages and supplied on tape and reel for automatic insertion processes. Standard values – E24 Series Characteristics – Electrical Type CRGP0402 CRGP0603 CRGP0805 CRGP1206 Power Rating @ 70°C 0.125W 0.25W 0.33W 0.5W Max. Working Voltage 50V 50V 150V 200V Max. Overload Voltage 100V 100V 300V 400V Dielectric Withstand 100V 300V 500V 500V Temperature Range -55°C ~ +155°C Ambient Temperature 70°C Type CRGP1210 CRGP2010 CRGP2512 Power Rating @ 70°C 0.75W 1.25W 2W Max. Working Voltage 200V 400V 500V Max. Overload Voltage 500V 800V 1000V Dielectric Withstand 500V 500V 500V Temperature Range -55°C ~ +155°C Ambient Temperature 70°C
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Power derating curve Power rating based on continuous load operation in ambient temperature of 70°C. For resistors operated in ambient temperatures above 70°C, power rating must be derated in accordance with this curve. Dimensions: Type Dimension (mm) L W H ℓϭ ℓϮ CRGP0805 2.00±0.15 1.25+0.15 -0.10 CRGP1206 3.10±0.15 1.55+0.15 -0.10
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Construction: Power Rating and Resistance Range: Type Power Rating @ 70°C Tolerance Resistance Range Standard Series CRGP0402 0.125W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP0603 0.25W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP0805 0.33W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP1206 0.5W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP1210 0.75W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP2010 1.25W ±1% 1R0 – 10M E24 E96 by negotiation ±5% CRGP2512 2W ±1% 1R0 – 10M E24 E96 by negotiation ±5% Marking: E24 series 0603 – 2512 3 Digits – first two digits denote significant figures of resistance and third digit denotes number of zeros thereafter. EG 222 = 2K2
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Marking for E96 Series 0805 – 2512 4 digits – First three digits denote significant figures of resistance and fourth digit denotes number of zeros thereafter. EG. 1000 = 100R For ohŵiĐ ǀalues ďeloǁ ϭϬϬR letter ͞R͟ deŶotes deĐiŵal poiŶt. EG 1R80 = ϭR8 / ϭ.8Ω 0402 size chips are not marked 0603 E96 3 digit marking.
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Marking for E96 series 0603 size with no marking code marked as per E24 values. Pulse withstand capacity The single impulse graph is the result of 50 impulses of rectangular shape applied at one-minute intervals. The limit of acceptance was a shift in resistance of less than 1% from the initial value. The power applied was subject to the restrictions of the maximum permissible impulse voltage graph shown.
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Performance Specification: Characteristic Limits Test Methods (JIS C 5201-1) Temperature Coefficient ±100PPM/°C *0402: ϭΩ-ϭϬΩ : ± ϰϬϬ PPM/℃ ϭϭΩ-ϭϬϬΩ : ± 200 PPM/℃ >ϭϬϬΩ : ± ϭϬϬ PPM/℃ Natural resistance change per temp. degree centigrade R1-R2 R1(t2-t1) R1 resistance value at room temperature (t1) R2 Resistance value at room temperature +100°C (t2) (Sub-clause 4.8) Short term overload Resistance change rate is ±ϱ% : ±;Ϯ.Ϭ% ±Ϭ.ϭΩͿ Max. ±ϭ% : ±;ϭ.Ϭ% ±Ϭ.ϭΩͿ Max. Permanent resistance change after the application of a potential of 2.5 times RCWV for 5 seconds Sub-clause 4.13 Terminal Bending ± ;ϭ.Ϭ% ±Ϭ.ϬϱΩͿ Max. Twist of Test Board : Y/X = 5/90 mm for 10 seconds (Sub-clause 4.33) Insulation Resistance ϭ,ϬϬϬMΩ or ŵore Apply 500V DC between protective coating and termination for 1 min, then measure (Sub-clause 5.6) Dielectric Withstand Voltage No evidence of flashover, mechanical damage, arcing or insulation breakdown. Apply 500V AC between protective coating and termination for 1 minute (Sub-clause 4.7) Soldering Heat Resistance change rate is ±;ϭ.Ϭ%+Ϭ.ϬϱΩͿ Max. Dip the resistor into a solder bath having a temperature of 260°C±3°C and hold it for 10±1 seconds (Sub-clause 4.18) Solderability 95% coverage Min. Test temperature of solder : 245 ± 3 ℃ Dwell time in solder : 2 ~ 3 seconds (Sub-clause 4.17) Solder Temp. Reference
Electrical characteristics
shall be satisfied without distinct deformation in appearance. (95% coverage Min.) Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Hand Soldering 300°C 5 seconds
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Performance Specification (continued) Characteristic Limits Test Methods (JIS C 5201-1) Temperature Cycling Resistance change rate is: ±5%: ±;ϯ%±Ϭ.ϭΩͿ Max. ±ϭ%: ±;Ϭ.ϱ%±Ϭ.ϭΩͿ Max. Resistance change after continuous 5 cycles for duty specified below: Step Temperature Time 1 -55°C±3°C 30 mins. 2 Room Temp. 10~15 mins. 3 +155°C±2°C 30 mins. 4 Room Temp. 10~15 mins. (Sub-clause 4.19) Humidity Resistance change rate is: ± ;ϯ.Ϭ% + Ϭ.ϭΩͿ Max. Temporary resistance change after 240 hours exposure in a humidity test chamber controlled at 40±2°C and 90- 95% relative humidity (Sub-clause 4.24) Load Life In Humidity Resistance change rate is: ±ϱ% : ±;ϯ.Ϭ% ±Ϭ.ϭΩͿ Max. ±ϭ% : ±;ϭ.Ϭ% ±Ϭ.ϭΩͿ Max. Resistance change after 1,000 hours (1.5 hours "on", 0.5 hour "off") at RCWV in a humidity chamber controlled at 40℃ ± 2℃ and 90 to 95 % relative humidity. (Sub-clause 4.24.2.1) Load Life Resistance change rate is: ±ϱ% : ±;ϯ.Ϭ% ±Ϭ.ϭΩͿ Max. ±ϭ% : ±;ϭ.Ϭ% ±Ϭ.ϭΩͿ Max. Permanent resistance change after 1,000 hours operating at RCWV, with duty cycle of (1.5 hours "on", 0.5 hour "off") at 70℃ ± 2℃ ambient (Sub-clause 4.25.1 Packaging Specification Paper taping Type A ± 0.2 B ± 0.2 C ± 0.05 ØD +0.1 E ± 0.1 F ± 0.05 G ± 0.1 W ± 0.2 T ± 0.1
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Embossed Taping Type A ±0.2 B ±0.2 C ±0.05 ØD +0.1 ØD1 +0.1 E ±0.1 F ±0.05 G ±0.1 W ±0.2 T ± 0.1 Peeling strength of cover tape: Test condition: 0.1 to 0.7 N at a peel off speed of 300mm / min. Reel Dimensions (mm): Type Tape Reel Qty A ± 0.5 B ± 0.5 C ± 0.5 D ± 1 M ± 2 W ± 1
0402 Paper 10,000 2 13 21 60 178 10
0603 Paper 5,000 2 13 21 60 178 10
0805 Paper 5,000 2 13 21 60 178 10
1206 Paper 5,000 2 13 21 60 178 10
1210 Paper 5,000 2 13 21 60 178 10
2010 Embossed 4,000 2 13 21 60 178 13.8 2512 Embossed 4,000 2 13 21 60 178 13.8
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Label: A. TE Product Number B. Product Description C. Quantity D. Lot Number E. RoHS Statement Example: Environment Related Substance This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and Halogen free. Ozone layer depleting substances. Ozone depleting substances are not used in our manufacturing process of this product. This product is not manufactured using Chloro fluorocarbons (CFCs), Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other ozone depleting substances in any phase of the manufacturing process. Storage Condition The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 25°C ± 10°C and a relative humidity of 60%RH ± 10%RH, chemical and dust free atmosphere Even within the above guarantee periods, do not store these products in the following conditions otherwise, their electrical performance and/or sold erability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight
SMD Precision Pulse Thick Film Chip Resistor 9-1773463-9 CIS WR 03/2018 Dimensions in millimetres unless otherwise specified Dimensions Shown for reference purposes only. Specifications subject to change For Email, phone or live chat, go to: www.te.com/help Solder Profile Wave soldering condition: (2 cycles Max.) Pre-heat : 100 ~ 120 ℃, 30 ± 5 sec. Peak temp.: 260 ℃ Reflow soldering condition: (2 cycles Max.) Pre-heat : 150 ~ 180 ℃, 90 ~ 120 sec. Suggestion solder temp.: 235 ~ 255 ℃, 20 ~ 40 sec. Peak temp.: 260 ℃ Hand Soldering condition: The Soldering iron tip should be less than 300°C and maximum contact time should be 5 seconds How To Order CRGP 0603 J 10K Common Part Size Tolerance Resistance Value CRGP – Pulse Withstand Thick Film Chip Resistor 0402 0603 0805 1206 1210 2010 2512 F - ±1% J - ±5% ϭ ohŵ ;ϭΩͿ ϭRϬ ϭK ohŵ ;ϭϬϬϬΩͿ ϭKϬ ϭϬϬK ohŵ ;ϭϬϬϬϬϬΩͿ 100K ϭM ohŵ ;ϭϬϬϬϬϬϬΩͿ ϭMϬ