CRGB1314ASE-500-TR

CRGB1314ASE-500-TR STANLEY | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 32

Technical content

Features

Page : 1 2017.9.28

Unit ：mm Weight ：10mg Tolerance ：±0.1 Recommended pad Unit：mm No. PART NAME REMARKS QTY. ① LED die AlGaInP, InGaN 3 ② Protection diode Silicone 2 ③ Encapsulant Silicone resin 1 ④ Substrate (Electrode:Au plating) Glass fabrics 1 Page : 2 2017.9.28

LED Die (3)LED Die (1) LED Die (2) Reverse Current IR － 70 70 mA ΔIFRM －40 ～ ＋120 － VVR 5 － 2.52.5 2.5 Current Derate Linearly Pd DC (1 LED emitted) ΔIF 100 ITEM Power Dissipation Total Value of Power Dissipation Tstg Pulse (1 LED emitted) DC (2 or 3 LEDs emitted) Derate Linearly From 80℃ IF LED Die (2) Green LED Die (3) Blue －40 ～ ＋100Operating Temperature Forward Current (1 LED emitted) IF 105 100 mA 260 30 25 105 0.75 Storage Temperature Topr Reverse Voltage mA/℃ LED Die (1) Red mA/℃ mW mA/℃0.65 25 20 Pd SYMBOL mA mW mA 100IFRM UNITS Junction Temperature Tj 120 ℃ Forward Current (2 or 3 LEDs emitted) Repetitive Peak Forward Current (1 LED emitted) 0.75 0.65 0.50 0.65 【 Absolute maximum ratings 】 ※1. All LEDs emitted , forward current should not exceed Max. total value of power dissipation. Total value of power dissipation at Ta=80℃ or more, please refer to technical data. Notes ※2. IFRM Conditions ： Pulse width ≦ 1ms, Duty ≦ 1/20 Specifications 【 Product overview 】 (Ta=25℃) Page : 3 ℃/W ※3 【 Thermal characteristics 】 ITEM SYMBOL TYP. UNITS Thermal resistance 【Junction - Ambient】(2 or 3 LEDs emitted) Rth(j-a) Thermal resistance 【Junction - Ambient】(One LED emitted) Rth(j-a) ※4℃/W Thermal resistance 【Junction - Solder point 】(One LED emitted) Rth(j-s) 350 ℃/W ・Substrate:FR4 ( t=1.6mm ) ・ Pattern size : 16mm2 Thermal resistance 【Junction - Solder point 】(2 or 3 LEDs emitted) Rth(j-s) 400 ℃/W ※3,4 Rth(j-a) Measurement conditions 450 5002017.9.28

【 Electro-Optical characteristics 】 μAReverse Current IR VR = 5V － IF = 22mA ITEM SYMBOL 2.8 IF = 22mA CONDITIONS MIN. IF = 22mA 622 TYP. MAX. UNITS 2.1 820 V 1,000 1.6 560 Forward Voltage Luminous Intensity Dominant Wavelength VF IV 614λd 632 nm mcd LED die (1) Red (Ta=25℃) 2,700 540 nm mcd 2.6 1,500 Forward Voltage Luminous Intensity Dominant Wavelength VF IV 515λd 3.9 532 TYP. MAX. UNITS 3.2 2,080 V IF = 23mA IF = 23mA CONDITIONS MIN. IF = 23mA ITEM SYMBOL LED die (2) Green LED die (3) Blue (Ta=25℃) (Ta=25℃) UNITSMAX.TYP.MIN.CONDITIONSSYMBOLITEM Total Luminous Intensity Chromaticity Coordinates IV 2,060 3,100 mcd4,070 RED : IF=22mA GREEN : IF=23mA BLUE : IF=14mA － 0.30 －y － 0.32 All LED emitted Please refer to chromaticity coordinate rank chart. (Ta=25℃) ※1. IF = 14mA ITEM IF = 14mA CONDITIONS MIN.SYMBOL TYP. MAX. UNITS 3.1 300 V3.7 469 2.4 100 Forward Voltage Luminous Intensity Dominant Wavelength VF IV 460λd 470 480 nm mcd IF = 14mA Page : 4 2017.9.28

0.20 0.25 0.30 0.35 0.40 0.45 y x Above chromaticity coordinates sorting values are values measured on Stanley’s production line. （Tolerance : ±0.02） Notes Chromaticity coordinates is sorted out into the following chart. 【Sorting chart for chromaticity coordinates】 Specifications Page : 5 B1 A2 Rank Left down Left upper Right upper Right down CONDITIONS x y x y x y x y 0.390 0.290 0.365 Red IF=22mA Green IF=23mA Blue IF=14mA 0.365 0.290 0.340 0.385 0.340 0.360 0.340 0.290 0.315 0.335 0.340 0.310 0.290 0.265 0.275 2017.9.28

0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 100 -100 -50 0 50 100 -30 -60 -90 Spatial distribution Conditions : Ta = 25℃ , IF = 20mA Wavelength vs. Relative intensity Conditions : Ta=25℃, IF = 20mA Wavelength: (nm) Relative intensity Technical data (LED die 1: Red) x y x direction y direction Page : 6 50 100 2017.9.28

0.1 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 0 10 20 30 CI 100 1 10 100 100 1.3 1.8 2.3 2.8 －40℃ 100℃ Ambient temperature vs. Relative intensity Condition : IF = 20mA Ambient temperature : Ta (℃) Forward current vs. Relative intensity Condition : Ta = 25℃ Forward current: IF (mA) Forward voltage vs. Forward current Condition : Ta = -40 to 100℃ Forward voltage: VF (V) Forward current: IF (mA) Technical data (LED die 1: Red) Relative intensity Relative intensity Duty cycle vs. Maximum forward current Duty: (%) Maximum forward current : IF MAX. (mA) Page : 7 2017.9.28

-40 -20 0 20 40 60 80 100 610 615 620 625 630 635 640 0 10 20 30 100 120 -20 0 20 40 60 80 100 120 DC Duty 50% Duty 20% Duty 10% Duty 5% 1.3 1.8 2.3 2.8 -40 -20 0 20 40 60 80 100 IF=10mA IF=15mA IF= 5mA IF=20mA IF= 25mA IF= 30mA Maximum Forward current vs. Ambient temperature Repetition frequency : f ≧ 50Hz Ambient temperature : Ta (℃) Dominant wavelength vs. Forward current Condition : Ta = 25℃ Forward current : IF (mA) Forward voltage vs. Ambient temperature Condition : IF = 5 to 30mA Ambient temperature : Ta (℃) Technical data (LED die 1: Red) Dominant wavelength : λd (nm) Ambient temperature vs. Dominant wavelength Condition : IF = 20mA Ambient temperature : Ta (℃) IF peak Max./IF DC Max. (mA) Maximum Forward Current : IF MAX. (mA) Forward voltage : VF (V) Page : 8 2017.9.28

0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 100 -100 -50 0 50 100 -30 -60 -90 Spatial distribution Conditions : Ta = 25℃, IF=20mA Wavelength vs. Relative intensity Conditions : IF=20mA , Ta=25℃ Wavelength: (nm) Relative intensity Technical data (LED die 2: Green) x y Page : 9 x direction y direction 50 100 2017.9.28

0.1 -40 -20 0 20 40 60 80 1000.0 0.5 1.0 1.5 0 10 20 30 CI 100 1 10 100 100 2.4 2.9 3.4 3.9 -40℃ 100℃ Page : 10 Technical data (LED die 2: Green) Ambient temperature vs. Relative intensity Condition : IF = 20mA Ambient temperature : Ta (℃) Forward current vs. Relative intensity Condition : Ta = 25℃ Forward current: IF (mA) Forward voltage vs. Forward current Condition : Ta = -40 to 100℃ Forward voltage: VF (V) Forward current: IF (mA) Relative intensity Relative intensity Duty cycle vs. Maximum forward current Duty: (%) Maximum forward current : IF MAX. (mA) 2017.9.28

-20 0 20 40 60 80 100 120 DC Duty 50% Duty 20% Duty 10% Duty 5% 2.4 2.9 3.4 3.9 -40 -20 0 20 40 60 80 100 IF=10mA IF=15mA IF= 5mA IF=20mA IF= 25mA 515 520 525 530 535 540 545 0 10 20 30 515 520 525 530 535 540 545 -40 -20 0 20 40 60 80 100 Page : 11 Technical data (LED die 2: Green) Maximum Forward current vs. Ambient temperature Repetition frequency : f ≧ 50Hz Ambient temperature : Ta (℃) Dominant wavelength vs. Forward current Condition : Ta = 25℃ Forward current : IF (mA) Forward voltage vs. Ambient temperature Condition : IF = 5 to 25mA Ambient temperature : Ta (℃) Dominant wavelength : λd (nm) Ambient temperature vs. Dominant wavelength Condition : IF = 20mA Ambient temperature : Ta (℃) IF peak Max./IF DC Max. (mA) Maximum Forward Current : IF MAX. (mA) Forward voltage : VF (V) 2017.9.28

0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 100 -100 -50 0 50 100 -30 -60 -90 Spatial distribution Condition: Ta = 25℃, IF=20mA Wavelength vs. Relative intensity Conditions : IF=20mA , Ta=25℃ Wavelength: (nm) Relative intensity Technical data (LED die 3: Blue) x y Page : 12 x direction y direction 50 100 2017.9.28

2.4 2.9 3.4 3.9 85℃ 25℃ 60℃ -20℃ -40℃ 100℃ 0.0 0.5 1.0 1.5 0 10 20 30 CI 0.1 -40 -20 0 20 40 60 80 100 Page : 13 Technical data (LED die 3: Blue) Ambient temperature vs. Relative intensity Condition : IF = 20mA Ambient temperature : Ta (℃) Forward current vs. Relative intensity Condition : Ta = 25℃ Forward current: IF (mA) Forward voltage vs. Forward current Condition : Ta = -40 to 100℃ Forward voltage: VF (V) Forward current: IF (mA) Relative intensity Relative intensity Duty cycle vs. Maximum forward current Duty: (%) Maximum forward current : IF MAX. (mA) 2017.9.28

-40 -20 0 20 40 60 80 100460 465 470 475 480 485 0 10 20 30 2.4 2.9 3.4 3.9 -40 -20 0 20 40 60 80 100 IF=10mA IF=15mA IF= 5mA IF=20mA IF= 25mA 100 120 -20 0 20 40 60 80 100 120 DC Duty 50% Duty 20% Duty 10% Duty 5% Page : 14 Technical data (LED die 3: Blue) Maximum Forward current vs. Ambient temperature Repetition frequency : f ≧ 50Hz Ambient temperature : Ta (℃) Dominant wavelength vs. Forward current Condition : Ta = 25℃ Forward current : IF (mA) Forward voltage vs. Ambient temperature Condition : IF = 5 to 25mA Ambient temperature : Ta (℃) Dominant wavelength : λd (nm) Ambient temperature vs. Dominant wavelength Condition : IF = 20mA Ambient temperature : Ta (℃) IF peak Max./IF DC Max. (mA) Maximum Forward Current : IF MAX. (mA) Forward voltage : VF (V) 2017.9.28

0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 100 -100 -50 0 50 100 -30 -60 -90 Spatial distribution Conditions: Ta = 25℃, IF=Red : 22mA, Green : 23mA, Blue : 14mA Wavelength vs. Relative intensity Conditions : Ta=25℃ IF=Red : 22mA, Green : 23mA, Blue : 14mA Wavelength: (nm) Relative intensity x y Page : 15 x direction y direction Technical data (3 LEDs emitted : White) 100 50 0 50 100 2017.9.28

-40 -20 0 20 40 60 80 100 120 100 120 -40 -20 0 20 40 60 80 100 120 100 120 -40 -20 0 20 40 60 80 100 120 100 120 140 160 180 200 220 240 260 280 -40 -20 0 20 40 60 80 100 120 Page : 16 Technical data (3 LEDs emitted : White) Power dissipation vs. Ambient temperature [ Red ] Ambient temperature : Ta (℃) Power dissipation vs. Ambient temperature [ Green ] Ambient temperature : Ta (℃) Total value of power dissipation vs. Ambient temp. [ 3 LEDs emitted ] Ambient temperature : Ta (℃) Power dissipation vs. Ambient temperature [ Blue ] Ambient temperature : Ta (℃) Power dissipation : Pd (mW) Power dissipation : Pd (mW) Power dissipation : Pd (mW) Power dissipation : Pd (mW) 2017.9.28

【Soldering precaution】 (acc.to EIAJ-4701/300) 【Recommended reflow soldering condition.】 40sec MAX. 150℃～180℃ +1.5～+5℃/s 260℃ MAX. -1.5～-5℃/s 90～120sec （Pre-heating） (Soldering） 230℃ MAX. Peak temperature 1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary with heating method. Also, if components with different shapes need to be mounted together, it is recommended to set the soldering pad temperature according to the component most vulnerable to heat stress (ex. SMT LED). (Recommended Condition: Soldering Pad temp. > Package temp.) 2. LED parts including the resin are not stable immediately after soldering ( when they are not at room temperature), any mechanical stress may cause damage to the product. Please avoid such stress after soldering, especially stacking of the boards which may cause the boards to warp and any other types of friction with hard materials.). 3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface. Temperature distribution varies on heating method, PCB material, other components in the assembly, and mounting density . Please do not repeat the heating process in Reflow process more than twice. Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface. This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating time is very effective in achieving higher reliability. Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is performed, interval between first and second process should be as short as possible to prevent absorption of moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room temperature (by nature-cooling) after first soldering process. Page : 17 2017.9.28

【Recommended manual soldering condition.】 Temperature of iron tip 350℃MAX. Soldering duration, Time 3sec.Max.,1 time 4. If soldering manually, Stanley recommends using a soldering iron equipped with temperature control. During the actual soldering process, make sure that the soldering iron never touches the LED itself, and avoid the LED's electrode heating temperature reaching above the heating temperature of the solder pad. All repairs must be performed only once in the same spot, and please avoid reusing components. 5. In soldering process, immediately after iron tip is cleaned, please make sure that the soldering iron reaches the appropriate temperature, before using. Also, please avoid applying any types of pressure to the soldered components before the solder has been cooled and hardened, as it may deteriorate solder performance and solder quality. 6. When using adhesive material for tentative fixatives, thermosetting resin or Ultraviolet radiation (UV) setting resin with heat shall be recommended. 《The curing condition, Temperature:150℃Max./Time:120sec.Max.》 7. Flow soldering (dip soldering) is not recommended for this product. 8. Isopropyl alcohol is recommended for cleaning. Some chemicals, including Freon substitute detergent could corrode the lens or the casing surface, which cause discoloration, cloud, crack and so on. Please review the reference chart below for cleaning. If water is used to clean (including the final cleaning process), please use pure water (not tap water), and completely dry the component before using. Page : 18 Cleaning agents Recommended / Not recommended Isopropyl alcohol Recommended Trichloroethylene x Not recommended Chlorothene x Not recommended Acetone x Not recommended Thinner x Not recommended2017.9.28

This kind of LED lamp is highly sensitive to surge voltage generated by the On/Off status change and discharges of static electricity through frictions with synthetic materials, which may cause severe damage to the die or undermine its reliability. Damaged products may experience conditions such as extremely high reverse voltage, or a decrease of forward rise voltage, deteriorating its optical characteristic. Stanley products are designed to withstand up to 1,000V under the EIAJ ED-4701/300 Test ♯304 (HBM), and are packed with anti-static components. However, the following precautions and measures are vital in ensuring product quality during shipment. EIAJ ED-4701/300（304/HBM） Electrification model: C=100pF, R2=1.5KΩ ①Do not place electrified non-conductive materials near the LED product. Avoid LED products from coming into contact with metallic materials.( Should the metallic material be electrified , the sudden surge voltage will most likely damage the product .) ②Avoid a working process which may cause the LED product to rub against other materials . ③Install ground wires for any equipment, where they can be installed, with measures to avoid static electricity surges. ④Prepare a ESD protective area by placing a conductive mattress (1MΩ MAX.) and ionizer to remove any static electricity. ⑤Operators should wear a protective wrist-strap. ⑥Operators should wear conductive work-clothes and shoes. ⑦To handle the products directly, Stanley recommends the use of ceramic, and not metallic, tweezers. 2. Working environment ①A dry environment is more likely to cause static electricity. Although a dry environment is ideal for storage state of LED products, Stanley recommends an environment with approximately 50% humidity after the soldering process. ②Recommended static electricity level in the working environment is less than 150V, which is the same value as integrated circuits (which are sensitive to static electricity). 【 For electric static discharge ( ESD) 】 1. Electrification/Static electricity protection Stanley recommends the following precautions in order to avoid product (die) damage from static electricity , when an operator and other materials electrified by friction coming in contact with the product. Page : 19 2017.9.28

1. Stanley LEDs have semiconductor characteristics and are designed to ensure high reliability. However, the performance may vary depending on usage conditions 2. Absolute maximum ratings are set to prevent LEDs from failing due to excess stress ( temperature, current, voltage, etc.). Usage conditions must not exceed the ratings for a moment, nor do reach one item of absolute maximum ratings simultaneously. 3. In order to ensure high reliability from LEDs, variable factors that arise in actual usage conditions should be taken into account for designing. ( Derating of Typ., Max. forward voltage, etc.) 4. Please insert straight protective resistors into the circuit in order to stabilize LED operation and to prevent the device from igniting due to excess current. 5. Please avoid the stick of foreign material because molding resin in the products have adhesiveness. And please don't touch lens portion. 6. Please check the actual performance in the assembly because the specification sheets are described for LED device only. 7. Please refrain from looking directly at the light source of LED at high output, as it may harm your vision. 8. The products are designed to operate without failure in recommended usage conditions. However, please take the necessary precautions to prevent fire, injury, and other damages should any malfunction or failure arise . 9. The products are manufactured to be used for ordinary electronic equipment. Please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on ). 10. The formal specification sheets shall be valid only by exchange of documents signed by both parties 【 Other precautions 】 Page : 20 Handling precaution 2017.9.28

1. Pick up point : Lamp housing of the product ( area) (Shown below) ＜Recommendation＞ 【 Handling precautions for product mounting 】 Pick up point. (Lamp housing portion) Non allowed pick up area (Lens portion) Please adjust the load, the pick up point, the nozzle diameter etc. before mounting, because lamp housing might get destroyed due to overload and improper shape of nozzle. Please set up vacuum breaker or air blower to make sure that product being putted down on soldering pad after it being picked up by nozzle. 2. Load : Less than 5N The picking up point should be within lamp housing portion, because the silicone resin used for the lens is soft. (If the nozzle makes contact with the lens, the products might be destroyed) Load：Less than 5N （to avoid the product breaking） Page : 21 Handling precaution 2017.9.28

This product is baked (moisture removal) before packaging, and is shipped in moisture -proof packaging (as shown below) to minimize moisture absorption during transportation and storage. However, with regard to storing the products, Stanley recommends the use of dry-box under the following conditions is recommended. Moisture -proof bag as the packaging is made of anti-static material but packaging box is not. The package should not be opened until immediately prior to its use, and please keep the time frame between package opening and soldering which is 【maximum 672h】. If the device needs to be soldered twice, both soldering operations must be completed within the 672h. If any components should remain unused, please reseal the package and store them under the conditions described in the 【 Recommended Storage Condition 】 above. This product must be required to perform baking process (moisture removal) for at 48h( MIN.). to 72h(MAX.) at 60±5 degrees Celsius if following conditions apply. 1. In the case of silica gel (blue) which indicates the moisture level within the package , changes or loses its blue color. 2. In the case of time passes for 672h after the package is opened once. Baking process should be performed after LED having been taken out of the package . Baking may be performed in the tape-reel form , however if it is performed with the reel stacked over one another, it may cause deformation of the reels and taping materials and later obstruct mounting. Please handle only once it has returned to room temperature. Provided that, baking process shall be 2 times max. 【Time elapsed after package opening.】 In the case of the package unopened , 6 months under 【 Recommended Storage Condition 】. Please avoid rapid transition from low temp. condition to high temp. condition and storage in corroding and dusty environment. 【Recommended storage condition / Products warranty period 】 Temperature +5～30℃ Humidity Under 70% Page : 22 2017.9.28

after opening bag. Customer's opening position. Product Label A NO. PART NAME MATERIALS REMARKS ① Moisture-proof bag with Aluminum layer PET+Al+PE with ESD protection Heat sealing position (after product being put in) Yes No Yes No Yes No Baking LED under recommended condition Product Mounting Unused-product remained Return to moisture-proof package and seal Finished Reopen the moisture-proof package Flow chart：Package Opening to Mounting Stored under recommended condition Moisture-proof package first time opening Allowable leaving time exceeded (*) Discoloration of silica gel Allowable leaving time means the maximum allowable leaving time after opening package, which depends on each LED type. The allowable leaving time should be calculated form the first opening of package to the time when soldering process is finished. When judging if the allowable leaving time has exceeded or not, please subtract the soldering time. The allowable leaving time after reopening should be calculated form the first opening of package, or from the time when baking process is finished. 【 Flow chart-package opening to mounting 】 【 Moisture-proof packaging specification 】 Page : 23 (Desiccant with indicator for moisture level is enclosed.) Packaging specifications 2017.9.28

【 Packing box 】 (RoHS・ELV Compliant) The above measure is all the reference value. The box is selected out of the above table, by shipping quantity. Type A Material / box ： Cardboard C5BF Type B,C Material / box ： Cardboard K5AF Partition ： Cardboard K5BF Box type Outline dimension L × W × H (mm) Capacity of the box Type A 280 × 265 × 45 3 reels Type B 310 × 235 × 265 15 reels Type C 440 × 310 × 265 30 reels Page : 24 Packaging specifications NO. PART NAME MATERIAL REMARKS ② Packing box Corrugated cardboard without ESD protection 2017.9.28

【Label specification】 ( acc.to JIS-X0503(Code-39)) Product Label A. Parts number B. Bar-code for parts number C. Parts code (In-house identification code for each parts number) D. Packed parts quantity E. Bar-Code for packed parts quantity F. Lot number & Rank (refer to Lot Number Notational System for details) G. Bar-Code for Lot number & Rank Opto Device Label A. Customer Name B. Parts Type C. Parts Code D. Parts Number E. Packed Parts Quantity F. Carton Number G. Shipping Date H. Bar-Code for In-house identification Number <Remark> Bar-code font : acc.to Code-39(JIS-X0503) B A Page : 25 Packaging specifications 2017.9.28

Taping and reel specifications (acc.to JIS-C0806-03） 【Appearance】 Note "-TR" means Cathode Side of LEDs should be placed on the sprocket -hole side. Items Specifications Remarks Leader area Cover-tape Cover-tape shall be longer than 300mm without carrier-tape The end of cover-tape shall be held with adhesive tape. Carrier-tape Empty pocket shall be more than 25pieces. Please refer to the above figure for Taping & reel orientation. Trailer area Empty pocket shall be more than 40pieces. The end of taping shall be inserted into a slit of the hub. Page : 26 2017.9.28

【Qty. per reel】 【 Mechanical strength】 【Others】 Qty./reel Max. qty. of empty pocket Remarks 500 1 - 1,000 1 - 1,500 1 - 2,000 2 No continuance 2,500 2 No continuance 3,000 3 No continuance 3,500 3 No continuance 4,000 4 No continuance 4,000 parts/reel （Note1) Note1 Minimum Qty. per reel might be 500 parts when getting less than 4,000 parts. In such case, parts of 500-unit-qty. shall be packed in a reel and the qty. shall be identified on the label. Cover-tape adhesive strength shall be 0.1～1.0N ( An angle between carrier-tape and cover-tape shall be170 deg. ) Both tapes shall be so sealed that the contained parts will not come out from the tape when it is bent at a radius of 15mm. Reversed-orientation, Up-side down placing, side placing and out of spec. parts mix shall not be held. Max qty. of empty pocket per reel shall be defined as follows. Page : 27 Taping and reel specifications 2017.9.28

【Taping dimensions】 【Reel dimensions】 (acc.to JIS-C0806-03） ① ② Carrier-tape with ESD protection with ESD protectionCover-tape Carrier-reel with ESD protection NO. PART NAME REMARKS Unit :mm Page : 28 Taping and reel specifications 2017.9.28

Lot number notational system ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ① - 1digit ： Production location (Mark identify alphabet) ② - 1digit ： Production year (Last digit of production year 2020→0, 2021→1, 2022→2, 2023→3, 2024→4 ･･･) ③ - 2digits ： Production month (Jan. to Sep. , shall be indicated as 01,02,03,･････) ④ - 2digits ： Production date ⑤ - 3digits ： Serial number ⑥ - 2digits ： Tape and Reel following number ⑦ - 2digits ： Luminous intensity rank. (If luminous intensity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no l identified intensity rank, "- -" is used to indicate.) ⑧ - 2digits ： Chromaticity rank (If chromaticity rank is 1 digit, "-" shall be dashed on the place for the second digit. If there is no identified intensity rank, "- -" is used to indicate.) ⑨ - 1digit ： Optional rank (Stanley normally indicates "-" .) Page : 29 2017.9.28

Correspondence to ELV ・ RoHS instruction This product is in compliance with RoHS・ELV . Prohibition substance and it's criteria value of RoHS・ELV are as follows. ・RoHS instruction …… Refer to following (1)～(6). ・ELV instruction ………. Refer to following (1)～(4). Substance group name Criteria value (1) Lead and its compounds 1,000ppm Max (2) Cadmium and its compounds 100ppm Max (3) Mercury and its compounds 1,000ppm Max (4) Hexavalent chromium 1,000ppm Max (5) PBB 1,000ppm Max (6) PBDE 1,000ppm Max Page : 30 2017.9.28

/400(403)Vibration, Variable frequency 98.1m/s2(10G) 100～2,000Hz 20min sweep XYZ direction Ta=85℃ IF (Red)=26.25mA, (Green)=21.75mA, (Blue)=17.5mA 1,000h 0 / 20 0 / 201,000 cycles cycles Ta=60℃ Rh=90% IF (Red)=30mA, (Green)=25mA, (Blue)=20mA 1,000h Ta=-40℃ IF (Red)=30mA, (Green)=25mA, (Blue)=20mA EIAJ ED-4701 /200(203) EIAJ ED-4701 /100(105) Ta=-40℃ ～120℃ (each 15min) Electrostatic discharge (ESD) ※ EIAJ ED-4701 /300(304) C=100pF R2=1.5kΩ ±2,000V 3 times of each polarity DurationTest ConditionStandard EIAJ ED-4701 /100(101) Ta=25℃ IF (Red)=30mA, (Green)=25mA, (Blue)=20mA Ta=-40℃(Off) ～85℃(On ※) ※On : IF (Red)=26.25mA, (Green)=21.75mA, (Blue)=17.5mA (each 15min) EIAJ ED-4701 /200(202) Ta=120℃ Cycled temperature humidity operating life Thermal shock operating Wet high temperature storage kife High temperature storage life Wet high temperature operating life Thermal shock Test Item Failure EIAJ ED-4701 /200(201) EIAJ ED-4701 /100(105) 1,000h 1,000hTa=60℃ Rh=90% 1,000h 1,000h 1,000h EIAJ ED-4701 /100(102) Resistance to reflow oldering EIAJ ED-4701 /300(301) Moisture soak ： 30℃ 70% 672h Preheating ： 150～180℃ 90-120sec Soldering ： 260℃ peak 2times Room temperature operating life EIAJ ED-4701 /100(101) Ta=-30℃(2h) ～ 80℃ 95%(2h) 8h/cycle IF (Red)=26.25mA, (Green)=21.75mA, (Blue)=17.5mA 5min on-off Low temperature storage life High temperature operating life 1,000 cycles EIAJ ED-4701 /100(101) Low temperature operating life EIAJ ED-4701 /100(101) 0 / 20Ta=-40℃ Reliability test results Failure criteria ※ Reference test Page : 31 External Appearance IF : Value of each emitted color's luminous intensity Item Condition Notable discoloration, deformation and cracking Failure criteriaSymbol Testing Max. Value ≧ Standard Max. Value × 1.2IF : Value of each emitted color's luminous intensityForward voltage VF

Special notice to customers using the products and technical information shown in this data sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com/en Page : 32 2017.9.28