CRF_V01 BOURNS | Alldatasheet

Document overview

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Technical content

Features

n Resistance value as low as 0.0003 ohm n High power density n Inductance less than 5 nH n Low thermal EMF: <3 µV/°C (0805~2010); <40 µV/°C (2512) n RoHS compliant* n AEC-Q200 compliant

Applications

CRF Series - High Po wer Current Sense Chip Resistor *RoHS Directive 2015/863, Mar 31, 2015 and Annex. Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf

Electrical Characteristics

@70 ℃ (W) Resistance Range (Ω) TCR Tolerance Insulation Resistance Max. Working Voltage CRF0805 0.5 0.001~0.25 ±50 ppm°C ±1 % ±5 % >100 MΩ V = √(PxR) CRF1206 1.5 0.0005~0.001 1 0.002~0.050 CRF2010 1.5 0.002~0.050 2 0.001~0.005 CRF2512 1 0.011~0.050 2 0.001~0.010 3 0.0003~0.00075 *RoHS and *RoHS COMPLIANT *RoHS COMPLIANT& AEC APPROVED *RoHS COMPLIANT, **HALOGEN FREE & AEC COMPLIANT LEAD FREE *RoHS COMPLIANTVERSIONS AVAILABLE LEAD FREE VERSIONS ARE RoHS COMPLIANT* Additional Information Click these links for more information: PRODUCT SELECTOR TECHNICAL LIBRARY INVENTORY SAMPLES CONTACT Construction Overcoat Metal Alloy Plate Ni / Sn Plating Current Rating Thermal Derating Ambient Temperature (°C) 70 170 100 -55 Power Ratio (%) WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov Environmental Characteristics Operating Temperature -55 °C to +170 °C Storage Conditions Temperature +5 °C to +35 °C Humidity 40 % to 75 % Moisture Sensitivity Level 1 ESD Classification (per AEC-Q200-2, HBM) 1B How to Order CRF 0805 - F Z - R020 E LF Model (CRF = Precision Chip Resistor) Size 0805 = 0805 (2012) 1206 = 1206 (3216) 2010 = 2010 (5025) 2512 = 2512 (6432) Resistance T olerance

  • F = ±1 %
  • J = ±5 % TCR (PPM/°C)
  • Z = ±50 PPM/°C Resistance Value Code (See Resistance Value Table)
  • 0.001 to 0.050 Ω: “R” Represents Decimal Point in Ω (Example: R005 = 0.005 Ω)
  • 0.0003 to 0.00075 Ω: “L” Represents Decimal Point in mΩ (Example: L500 = 0.0005 Ω) Packaging
  • E = 5,000 pcs./180 mm (7-inch) reel (CRF0805 & CRF1206) or 4,000 pcs./180 mm (7-inch) reel (CRF2010 & CRF2512) Termination
  • LF = T in-plated (RoHS compliant) Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com Europe: Tel: +36 88 885 877 • Email: eurocus@bourns.com Mexico: Tel: +52 614 478 0400 • Email: mexicus@bourns.com The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com www.bourns.com *RoHS and AEC-Q200 COMPLIANTR010 AUTOMOTIVE GRADE

3312 - 2 mm SMD Trimming Potentiometer CRF Series - High Power Current Sense Chip Resistor Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. Performance Characteristics Test Conditions Specification Reference Limit Temperature Coefficient of Resistance +25 ~ 125 ℃ IEC 60115-1 4.8 Refer to TCR Short Time Overload 5x Rated Power for 5 Seconds IEC 60115-1 4.13 ΔR < ±0.5 % Low Temperature Storage -55 °C for 1000 Hours IEC 60115-1-4.23.4 High Temperature Exposure 1000 Hours @ +170 ˚C AEC-Q200-REV E-Test 3 MIL-STD202 Method 108 ΔR < ±1 % Temperature Cycling 1000 Cycles (-55 ℃ to +155 ℃) AEC-Q200-REV E-Test 4 JESD22 Method JA-104 ΔR < ±0.5 % Bias Humidity + 85 °C, 85 % RH, 10 % Bias, 1000 Hours AEC-Q200-REV E-Test 7 MIL-STD-202 Method 103 ΔR < ±1 % Mechanical Shock 100 g for 6 ms, Half Sine Shock Pulse AEC-Q200-REV E-Test 13 MIL-STD-202 Method 213 ΔR < ±0.5 % Vibration 5 g for 20 Min, 10-2 kHz

12 Cycles

MIL-STD-202 Method 204 ΔR < ±0.5 % Load Life

1000 Hours at Rated Power at

+70 ˚C, 1.5 Hours On, 0.5 Hours Off AEC-Q200-REV E-Test 8 MIL-STD-202 Method 108 ΔR < ±1 % Resistance to Solder Heat +260 ±5 ˚C, 10±1 Second Dwell AEC-Q200-REV E-Test 15 MIL-STD-202 Method 210 ΔR < ±0.5 % ESD Human body model, 500 V AEC-Q200-REV E-Test 17 AEC-Q200-002 ISO/DIS 10605 ΔR < ±0.5 % Solderability 235 ±3 °C Dipping Time: 3±0.5 Seconds AEC-Q200-REV E-Test 18 J-STD-002 >95 % Tin Coverage Board Flex (SMD) 2 mm deflection for 60 Sec. AEC-Q200-REV E-Test 21 AEC-Q200-005 ΔR < ±0.5 % Shear (SMD) Force of 1.8 kg for 60 Sec. AEC-Q200-REV E-Test 22 AEC-Q200-006 ΔR < ±0.5 % Resistance Value Codes Code R Value (Ω) Code R Value (Ω) Code R Value (Ω) Code R Value (Ω) L500 0.0005 R004 0.004 R011 0.011 R022 0.022 L750 0.0008 R005 0.005 R012 0.012 R025 0.025 R001 0.001 R006 0.006 R014 0.014 R030 0.03 1L50 0.0015 R007 0.007 R015 0.015 R033 0.033 R002 0.002 R008 0.008 R016 0.016 R035 0.035 R003 0.003 R009 0.009 R018 0.018 R040 0.04 3L50 0.0035 R010 0.01 R020 0.02 R050 0.05 This table lists common resistance values. For resistance values not shown, please contact Bourns Customer Service/Inside Sales.

3312 - 2 mm SMD T rimming Potentiometer Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf CRF Series - High Po wer Current Sense Chip Resistor DIMENSIONS: MM (INCHES) Product Dimensions A B C CC T C A B C CC T C Dim. CRF0805 CRF1206 CRF2010 CRF2512 A 1.4 ± 0.10 (0.055 ± 0.004) 1.8 ± 0.10 (0.070 ± 0.004) 1.8 ± 0.10 (0.070 ± 0.004) 0.4 ± 0.20 (0.134 ± 0.008) 4.0 ± 0.10 (0.157 ± 0.004) B 1.15 ± 0.10 (0.045 ± 0.004) 2.3 ± 0.10 (0.090 ± 0.004) 1.7 ± 0.10 (0.066 ± 0.004) 3.5 ± 0.20 (0.138 ± 0.008) 1.5 ± 0.20 (0.060 ± 0.008) 3.1 ± 0.10 (0.122 ± 0.004) 2.1 ± 0.10 (0.083 ± 0.004) L 0.7 ± 0.10 (0.028 ± 0.004) R = 1 & 1.5 mΩ 1.2 ± 0.10 (0.047 ± 0.004) 2 mΩ<=R<=25 mΩ 1.0 ± 0.10 (0.039 ± 0.004) 1.6 ± 0.10 (0.062 ± 0.004) 2.0 ± 0.20 (0.080 ± 0.008) 3.5 ± 0.20 (0.138 ± 0.008) 1.3 ± 0.10 (0.051 ± 0.004) 4.1 ± 0.10 (0.161 ± 0.004) Recommended Solder Pad Layout A B SENSING TRACE Cu TRACE L DIMENSIONS: MM (INCHES) Dim. CRF0805 CRF1206 CRF2010 CRF2512 A 2.0 ± 0.10 (0.079 ± 0.004) 3.20 ± 0.20 (0.126 ± 0.008) 5.00 ± 0.20 (0.197 ± 0.008) 6.40 ± 0.20 (0.252 ± 0.008) B 1.25 ± 0.10 (0.049 ± 0.004) 1.65 ± 0.20 (0.064 ± 0.008) 2.50 ± 0.20 (0.098 ± 0.008) 3.20 ± 0.20 (0.126 ± 0.008) C 0.65 ± 0.20 (0.026 ± 0.008) R = 1 & 1.5 mΩ 0.40 ± 0.20 (0.016 ± 0.008) 2 mΩ<=R<=25 mΩ 0.50 ± 0.30 (0.0197 ± 0.012) 1.50 ± 0.30 (0.060 ± 0.012) R<=0.003 Ω 0.60 ± 0.30 (0.024 ± 0.012) R>=0.003 Ω 2.60 ± 0.30 (0.102 ± 0.012) 2.20 ± 0.30 (0.087 ± 0.012) 0.95 ± 0.30 (0.037 ± 0.012) T 0.60 ± 0.20 (0.024 ± 0.008) 0.60 ± 0.20 (0.024 ± 0.008) 0.60 ± 0.20 (0.024 ± 0.008) 1.10 ± 0.20 (0.043 ± 0.008) 0.60 ± 0.20 (0.024 ± 0.008)

3312 - 2 mm SMD Trimming P otentiometerCRF Series - High Power Current Sense Chip Resistor Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. REV. 08/25 D0 DIA. 1.5 (0.059) DIA. MIN. t A P1 P2 P0 B E F W TOP TAPE EMBOSSED TAPE RESISTOR USER DIRECTION OF FEED 60.0 (2.362) MIN. DIA. DIA. 180 +0/-3 (7.09 +0/-0.118) 13.0 ± 1.0 (0.512 ± 0.039) DIA. 15.4 ± 2.0 (0.606 ± 0.079) 13.0 ± 1.0 (0.512 ± 0.039) Packaging Dimensions (Conforms to EIA RS-481A) 3.60 ± 0.20 (0.079 ± 0.002) 4.0 ± 0.05 (0.157 ± 0.004) 1.5 +0.1/-0 (0.059) DIA. MIN. 0.85 ± 0.15 (0.033 ± 0.006) 6.9 ± 0.2 (0.272 ± 0.008) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.1 (0.069 ± 0.004) 12.0 ± 0.2 (0.472 ± 0.008) TOP TAPE EMBOSSED TAPE RESISTOR USER DIRECTION OF FEED 60.0 (2.362) MIN. DIA. DIA. 180 +0/-3 (7.09 +0/-0.118) 13.0 ± 1.0 (0.512 ± 0.039) DIA. 15.4 ± 2.0 (0.606 ± 0.079) 13.0 ± 1.0 (0.512 ± 0.039) DIMENSIONS: MM (INCHES) Packing Model A B W F E P1 P2 P0 D0 t Paper Tape CRF0805 1.6 ± 0.15 (0.063 ± 0.006) 2.4 ± 0.20 (0.094 ± 0.008) 8.0 ± 0.20 (0.315 ± 0.008) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.1 (0.079 ± 0.004) 4.0 ± 0.1 (0.157 ± 0.004) 1.5+0.1/-0 (0.059+0.004/-0) 0.84 ± 0.10 (0.033 ± 0.004) Paper Tape CRF1206 2.0 ± 0.15 (0.079 ± 0.006) 3.6 ± 0.20 (0.142 ± 0.008) 8.0 ± 0.20 (0.315 ± 0.008) 3.5 ± 0.05 (0.138 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.05 (0.157 ± 0.002) 1.5+0.1/-0 (0.059+0.004/-0) 0.85 ± 0.15 (0.033 ± 0.006) Embossed Tape CR2010 2.80 ± 0.20 (0.110 ± 0.008) 5.3 ± 0.20 (0.209 ± 0.008) 12.0 ± 0.20 (0.472 ± 0.008) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.05 (0.157 ± 0.002) 1.5+0.1/-0 (0.059+0.004/-0) 0.85 ± 0.15 (0.033 ± 0.006) Embossed Tape CRF2512 3.60 ± 0.20 (0.142 ± 0.008) 6.9 ± 0.20 (0.272 ± 0.008) 12.0 ± 0.20 (0.472 ± 0.008) 5.5 ± 0.05 (0.217 ± 0.002) 1.75 ± 0.10 (0.069 ± 0.004) 4.0 ± 0.10 (0.157 ± 0.004) 2.0 ± 0.05 (0.079 ± 0.002) 4.0 ± 0.05 (0.157 ± 0.002) 1.5+0.1/-0 (0.059+0.004/-0) 1.20 ± 0.15 (0.047 ± 0.006) Soldering Profile TIME TEMPERATURE (°C) tL TIME 25 °C TO PEAK tp ts Tsmax Tsmin Tp TL Tc -5 °C PREHEAT AREA MAX. RAMP UP RATE = 3 °C/s MAX. RAMP DOWN RATE = 6 °C/s Profile Feature Pb-Free Assembly Preheat / Soak: Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (ts) from (Tsmin to Tsmax) 150 °C 200 °C 60~120 seconds Ramp Up Rate (T L to Tp) 3 °C / second max. Liquidous Temperature (TL) Time (tL) maintained above TL 217 °C 60~150 seconds Peak Package Body Temperature (Tp) 260 °C Time within 5 °C of actual peak temperature (T p) 20~30 seconds* Ramp Down Rate (Tp to TL) 6 °C / second max. Time 25 °C to Peak Temperature 8 minutes max. * Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum.

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