CR05-182J-B | DigiCamel IC Datasheet

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MMZ25333B_V01 NXP | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 23

Technical content

1 General description

2 Typical performance

Table 1. Typical PA Driver Performance Table 2. Typical Output PA Performance

3 Features and benefits

P1dB: up to 33 dBm
Gain: More than 40 dB
5 V Supply
Excellent Linearity
High Efficiency
Single−ended Power Detector
Band Tunable Product data sheet MMZ25333B InGaP HBT Linear Amplifier Rev. 2 — 4 April 2024

4 Functional block diagram

Figure 1. Functional Block Diagram

5 Ordering information

Table 3. Ordering Information

6 Maximum ratings

Table 4. Maximum Ratings

7 Thermal characteristics

Table 5. Thermal Characteristics

8 Electrical characteristics

Table 6. Electrical Characteristics

9 ESD protection characteristics

Table 7. ESD Protection Characteristics

10 Moisture sensitivity level

Table 8. Moisture Sensitivity Level

11 Pinning information

Figure 2. Pin Connections ground. N.C. can be connected to GND.

12.1 Test circuit schematic — 2500–2700 MHz

Figure 3. MMZ25333B Test Circuit Schematic Note: Component number C7 is not used.

12.2 Component designations and values — 2500–2700 MHz

Table 9. MMZ25333B Test Circuit Component Designations and Values Note: Component numbers C8 and L4 are labeled on board but not placed.

12.3 Component layout — 2500–2700 MHz

Figure 4. MMZ25333B Test Circuit Component Layout (1) VBIAS [Board] supplies VBA1, VBA2 and VBIAS [Device]. Note: Component number C7 is not used. Component numbers C8* and L4* are labeled on board but not placed.

13 Typical performance graphs, 50 ohm — 2500–2700 MHz

Figure 5. S11 versus Frequency versus Temperature Figure 6. S21 versus Frequency versus Temperature Figure 7. S22 versus Frequency versus Temperature

14.1 Test circuit schematic — 2110–2170 MHz, I CQ = 265 mA

Figure 19. MMZ25333B Test Circuit Schematic Note: Component number C7 is not used.

14.2 Component designations and values — 2110–2170 MHz, I CQ = 265 mA

Table 10. MMZ25333B Test Circuit Component Designations and Values Note: Component numbers C2, C8 and L4 are labeled on board but not placed.

14.3 Component layout — 2110–2170 MHz, I CQ = 265 mA

Figure 20. MMZ25333B Test Circuit Component Layout (1) VBIAS [Board] supplies VBA1, VBA2 and VBIAS [Device]. Note: Component number C7 is not used. Component numbers C2*, C8* and L4* are labeled on board but not placed.

15 Typical performance graphs, 50 ohm — 2110–2170 MHz, I CQ = 265 mA

Figure 21. S11 versus Frequency Figure 22. S21 versus Frequency Figure 23. S22 versus Frequency

16 PCB pad layout

Figure 28. PCB Pad Layout for QFN 4 × 4 structure. All dimensions in mm.

17 Product marking

Figure 29. Product Marking

NXP Semiconductors MMZ25333B InGaP HBT Linear Amplifier All information provided in this document is subject to legal disclaimers. Rev. 2 — 4 April 2024Product data sheet 18 / 23 MMZ25333B /C0069 NXP B.V. 2024. All rights reserved.

NXP Semiconductors MMZ25333B InGaP HBT Linear Amplifier All information provided in this document is subject to legal disclaimers. Rev. 2 — 4 April 2024Product data sheet 19 / 23 MMZ25333B /C0069 NXP B.V. 2024. All rights reserved.

NXP Semiconductors MMZ25333B InGaP HBT Linear Amplifier All information provided in this document is subject to legal disclaimers. Rev. 2 — 4 April 2024Product data sheet 20 / 23 MMZ25333B /C0069 NXP B.V. 2024. All rights reserved.

19 Product documentation, software and tools

Refer to the following resources to aid your design process.

AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software
.s2p File Development Tools
Printed Circuit Boards

20 Failure analysis

party vendors with moderate success. For updates contact your local NXP Sales Office. The following table summarizes revisions to this document. Table 11. Revision History

Package Information: updated to Rev. A, pp. 18–20
Added Legal Information section, pp. 22–23 MMZ25333B Rev. 1 1 August 2014 • Table 1, Maximum Ratings: updated Junction Temperature from 150°C to 175°C to reflect recent test results of the device, p. 2 MMZ25333B Rev. 0 3 June 2014 • Initial release of product data sheet

NXP Semiconductors MMZ25333B InGaP HBT Linear Amplifier All information provided in this document is subject to legal disclaimers. Rev. 2 — 4 April 2024Product data sheet 22 / 23 MMZ25333B /C0069 NXP B.V. 2024. All rights reserved. Legal information Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. 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Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 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Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 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NXP Semiconductors MMZ25333B InGaP HBT Linear Amplifier All information provided in this document is subject to legal disclaimers. Rev. 2 — 4 April 2024Product data sheet 23 / 23 MMZ25333B /C0069 NXP B.V. 2024. All rights reserved. In the event that customer uses the product for design−in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non −English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. Airfast — is a trademark of NXP B.V. Freescale — is a trademark of NXP B.V. Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © 2024 NXP B.V. All rights reserved. For more information, please visit: https://www.nxp.com Date of release: 4 April 2024 Document identifier: MMZ25333B

Product Information

CR05-182J-B specifications and overview.

Summary

InGaP HBT Linear Amplifier Rev. 2 - 4 April 2024

Description

InGaP HBT Linear Amplifier Rev. 2 - 4 April 2024

Source title CR05-182J-B Datasheet(PDF) - NXP Semiconductors

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