MML25231HT1 NXP | Alldatasheet
Document overview
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Technical content
Features
Ultra Low Noise Figure: 0.39 dB @ 1900 MHz, 0.54 dB @ 2500 MHz High Linearity: 34.7 dBm OIP3 @ 1900 MHz, 35.2 dBm @ 2500 MHz Frequency: 1000 –4000 MHz Unconditionally Stable Over Temperature P1dB: 22.6 dBm @ 1900 MHz, 22.5 dBm @ 2500 MHz Small- -Signal Gain: 17.2 dB @ 1900 MHz, 15.2 dB @ 2500 MHz Single 5 V Supply Power- -down Pin Supply Current: 60 mA (adjustable externally) 50 Ohm Operation (some external matching required) Cost- -effective 8- -pin, 2 mm DFN Surface Mount Plastic Package DFN 2 2 1000–4000 MHz, 15.2 dB 23 dBm, 0.36 NF E- -pHEMT LNA MML25231HT1 Table 1. Typical Performance(1)
- VDD =5V d c ,TA =2 5C, 50 ohm system, application circuit
tuned for specified frequency. Table 2. Maximum Ratings Table 3. Thermal Characteristics Freescale Semiconductor, Inc., 2016. All rights reserved.
Figure 1. Pin Connections Freescale Semiconductor, Inc. Table 4. Electrical Characteristics(VDD = 5 Vdc, 2600 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit) Table 5. ESD Protection Characteristics Table 6. Moisture Sensitivity Level Table 7. Ordering Information
- DC current measured with no RF signal applied.
- Limits derived from device characterization.
Table 8. Functional Pin Description
1 VBIAS
2 RFin
3 No Connection
4 No Connection
5 No Connection
6 No Connection
7 RFout/Supply Voltage
8 Power Down (Active High)
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 2500 MHz
Figure 2. MML25231HT1 Test Circuit Schematic Table 9. MML25231HT1 Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 3. MML25231HT1 Test Circuit Component Layout decoupling and grounding are employed.
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS: 2500 MHz
Figure 4. S11 versus Frequency and Figure 5. S12 versus Frequency and Figure 6. S21 versus Frequency and Figure 7. S22 versus Frequency and
11 VDD =5V d c
Freescale Semiconductor, Inc. Figure 8. Noise Figure versus Frequency Figure 9. Power Gain versus Output Power Figure 10. Power Gain versus Output Power
1750 MHz
1920 MHz
2350 MHz
2600 MHz
3600 MHz
Freescale Semiconductor, Inc. Figure 11. Drain Current versus Output Power Figure 12. Drain Current versus Output Power
2350 MHz2600 MHz
Figure 13. Third Order Input Intercept Point Figure 14. Third Order Intermodulation Distortion Figure 15. Third Order Input Intercept Point
Freescale Semiconductor, Inc. Figure 16. Third Order Intermodulation Distortion
2600 MHz1920 MHz
Freescale Semiconductor, Inc.
50 OHM APPLICATION CIRCUIT: 2000 MHz
Figure 17. MML25231HT1 Test Circuit Schematic Table 10. MML25231HT1 Test Circuit Component Designations and Values
Freescale Semiconductor, Inc. Figure 18. MML25231HT1 Test Circuit Component Layout decoupling and grounding are employed.
Freescale Semiconductor, Inc.
50 OHM TYPICAL CHARACTERISTICS: 2000 MHz
Figure 19. S11 versus Frequency Figure 20. S12 versus Frequency Figure 21. S21 versus Frequency Figure 22. S22 versus Frequency
Freescale Semiconductor, Inc. Figure 23. Noise Figure versus Frequency Figure 24. Power Gain versus Output Power
2500 MHz
Figure 25. Drain Current versus Output Power
1920 MHz 2350 MHz
Figure 26. Third Order Input Intercept Point
1750 MHz 1920 MHz
2600 MHz2500 MHz
Figure 27. Third Order Intermodulation
Freescale Semiconductor, Inc. MML25231HT1 PACKAGE DIMENSIONS
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc. MML25231HT1
Freescale Semiconductor, Inc. PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3100: General Purpose Amplifier and MMIC Biasing Software .s2p File Development Tools Printed Circuit Boards To Download Resources Specific to a Given Part Number: 1. Go tohttp://www.freescale.com/rf 2. Search by part number 3. Click part number link 4. Choose the desired resource from the drop down menu FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Apr. 2016 Initial Release of Data Sheet
Freescale Semiconductor, Inc. MML25231HT1 Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2016 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MML25231HT1 Rev. 0, 4/2016