CQB-AU100-20 CHIPQUIK | Alldatasheet
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D a t a s h e e t r e v i s i o n 1 . 0 www.chipquik.com Gold Bonding Wire (Au100) Gold 20um (0.8mil) Product Highlights High Purity Gold > 99.99% (4N) Designed specifically for wire bonding Specifications A l l o y : A u100 Melting Point: 1,064°C (1,947°F) Packaging: Spool Diameter: 20µm (0.8 mil) Length: 100m (328 feet) Shelf Life: > 12 months P u r i t y : 4 N ( > 9 9 . 9 9 % ) Storage and Handling Store in a dry non-corrosive environment. Transportation This product has no shipping restrictions. Test Results Test J-STD-004 or other requirements as stated Test Requirement Result Conflict Minerals Compliance Electronic Industr y Citizenship Coalition (EICC) Compliant REACH Compliance Articles 33 and 67 of Regulation (EC) No 1907/2006 Complian t Conforms to the following Industry Standards: J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes RoHS 3 Directive (EU) 2015/863: Y e s 1 © 1994-2022 Chip Quik® Inc. CCQQBB--AAUU110000--2200uumm