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Technical content
GROSS DIE PER 5 INCH WAFER 84,926 PROCESS CPZ33R Transient Voltage Suppressor
12 Volt Quad TVS Chip
Die Size 14.2 x 14.2 MILS Die Thickness 3.9 MILS Cathode Bonding Pad Areas (4) 4.7 MILS DIAMETER EACH Top Side Metalization Al - 13,000Å Back Side Metalization Au - 12,000Åwww.centralsemi.com R0 (3-January 2012)
Typical Electrical Characteristics www.centralsemi.com R0 (3-January 2012)