CPDZC3V3A-HF COMCHIP | Alldatasheet

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Technical content

Features

  • Bi-directional ESD protection. - Low clamping voltage. - Low leakage current. - IEC 61000-4-2 (ESD) ; ±20KV(contact) - IEC 61000-4-5 (surge) ; Ipp=4A Maximum Rating (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Peak pulse power PPP W Operating temperature range Tj °C Storage temperature range TSTG -55 ~ +150 °C ESD kV IEC 61000-4-2(air) IEC 61000-4-2(contact) ESD capability -55 ~ +125 Peak pulse current IPP ATP = 8/20µs 4 TP = 8/20µs ±20 ESD ±20 100 Symbol TypParameter Min Max UnitConditions VWorking peak reverse voltage VRWM 3.3 Electrical Characteristics (at TA=25°C unless otherwise noted) Breakdown voltage VBR VIT = 1mA 4.5 Reverse leakage current IR nAVRWM = 3.3V 100 Clamping voltage Junction capacitance CJ pFVR = 0V, f = 1MHz 0.2 VC V 14IPP = 1A, TP = 8/20µs IPP = 4A, TP = 8/20µs 25 0.3 VC V Circuit Diagram - Ultra small SMD package. 0.026(0.67) 0.022(0.57) 0201/DFN0603 Dimensions in inches and (millimeter) 0.015(0.37) 0.011(0.27) 0.013(0.340) 0.011(0.275) 0.002(0.06) REF. 0.017(0.435) REF. 0.011(0.275) 0.008(0.205) 0.007(0.175) 0.004(0.105) 0.007(0.175) 0.004(0.105) Mechanical data - Case: 0201/DFN0603 package, molded plastic. - Terminals: Gold plated, solderable per MIL-STD-750, method 2026. - Mounting position: Any - Weight: 0.0004 grams (approx.).

Rating and Characteristic Curves (CPDZC3V3A-HF) Power Rating, (%) Mounting on glass epoxy PCBs 100 120 25 50 75 100 1500 125 Fig.2 - Power Rating Derating Curve Time, (µs) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120%Percentage Of Ipp Ta=25°C Peak Value Ipp Test Waveform parameters tf=8µs td=20µs e -t td= t Ipp/2 Fig.1 - 8/20µs Peak Pulse Current Waveform Acc. IEC 61000-4-5 Ambient Temperature, (°C) Fig.3 - Clamping Voltage Vs. Peak Pulse Current Clamping Voltage, (V) Peak Pulse Current, (A) 321 SMD ESD Protection Diode 0.2 0.4 0.6 0.8 0 1 2 3 3.3 Capacitance Between Terminals, (pF) Reverse Voltage, (V) Fig.4 - Typical Capacitance Between Terminals Characteristics 0.1 0.3 0.5 0.7 Page 2QW-G7127 REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice.

REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. Reel Taping Specification 0.44 ± 0.03 - 0.00 8.00 + 0.30 - 0.10 - 0.004 0.472 + 0.020 - 0.000 E F P P0 P1 T W W1 0201 (DFN0603) 0201 (DFN0603) SYMBOL (mm) (inch) SYMBOL (mm) (inch) A B C d D2D D1 - 0.00 0.059 + 0.004 Trailer Device Leader 400mm (min)160mm (min) Direction of Feed o 120 D2 DD1 A B C d E F P T W

10,000 70201 (DFN0603) REEL (pcs) Reel Size (inch) REEL PACK B C A D E Suggested P.C.B. PAD Layout SIZE (inch) 0.006 (mm) 0.16 0.24 0.34 0.009 0.013 0.40 0.016 E 0.64 0.025 B C D A 0201(DFN0603) Page 4QW-G7127 REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice.