CPDWZ3V3MSBP-HF COMCHIP | Alldatasheet

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Technical content

Features

  • Low leakage current. - Low clamping voltage. - Case: CSP0603-2L package, molded plastic. Mechanical data - Mounting position: Any. QW-JP126 Page 1 REV:B Maximum Rating (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Peak pulse power PPP W14 Operating temperature range TJ °C Storage temperature range TSTG °C kV IEC 61000-4-2(air) IEC 61000-4-2(contact)ESD capability -55 to +125 Peak pulse current IPP ATP = 8/20µs 4 TP = 8/20µs ±12ESD -55 to +150 Electrical Characteristics (at TA=25°C unless otherwise noted) Symbol TypParameter Min Max UnitConditions VReverse working voltage VRWM 3.3 Breakdown voltage VBRIT = 0.1mA 4.5 Reverse leakage current IR µAVRWM = 3.3V 0.1 Clamping voltage V V6.5 IPP = 1A, TP = 8/20µs VC 1.75 VIPP = 4A, TP = 8/20µs VC 2.9 VC VTLP = 16A, tp = 100ns 6.4 Dimensions in inches and (millimeter) CSP0603-2L Circuit Diagram - Bi-directional configurations. 0.014(0.35) 0.010(0.25) 0.026(0.65) 0.022(0.55) 0.013(0.32) 0.011(0.28) 0.002(0.05) Max. 0.015(0.37) 0.013(0.34) 0.012(0.30) 0.008(0.20) 0.009(0.24) 0.006(0.14) 0.009(0.24) 0.006(0.14) Lead soldering temperature (10s) TL 260 °C 0.25 ΩRdynESD dynamic turn-on resistance IEC 61000-4-2 0~+8kV, contact mode, T=25°C Junction capacitance CJ pFVDC = 0V, f = 1MHz 0.25 Clamping voltage - IEC 61000-4-2 (ESD) ±12kV (air/contact) IEC 61000-4-5 (Lightning) 4A (8/20µs) Pin 1 Pin 2 3.5

Typical Rating and Characteristic Curves (CPDWZ3V3MSBP-HF) SMD ESD Protection Diode Comchip Technology CO., LTD. Page 2 -4 -3 -2 -1 2 3 0.1 0.2 0.3 0.4 0.5 0.6 Fig.2 - Typical Variation of CIN VS. VIN VIN, (V) Capacitance, (pF) 410 Pin 1 to Pin 2 Fig.1 - Typical Clamping Voltage vs. Peak Pulse Current Peak Pulse Current, (A) Clamping Voltage, (V) Fig.3 - TLP-Positive Pulse TLP Voltage, (V) TLP Current, (A) -2-6-10 -4 02 Fig.4 - TLP-Negative Pulse TLP Voltage, (V) TLP Current, (A) 86 104 -10 -15 -20 QW-JP126 REV:B

m SMD ESD Protection Diode Comchip Technology CO., LTD. Page 3QW-JP126 Reel Taping Specification 0.39 ± 0.03 0.015 ± 0.001 0.028 ± 0.001 0.014 ± 0.001 1.55 ± 0.05 0.061 ± 0.002 178.00 ± 2.00 7.008 ± 0.079 55.00 ± 5.00 2.165 ± 0.197 0.512 + 0.020 − 0.008 13.00 + 0.50 − 0.20 SYMBOL (mm) (inch) (inch) (mm) SYMBOL A B C d D D1 W W1E F P TP1P0 0.315 ± 0.004

14.40 Max

0.567 Max

120° CSP0603 -2L CSP0603 -2L A d E F P P0 P1 W B C T Trailer Device Leader 200mm (min)160mm (min) Direction of Feed m m REV:B

Comchip Technology CO., LTD. Page 4QW-JP126 Marking Code Part Number Marking Code m Standard Packaging Case Type 10,000 REEL ( pcs ) Reel Size (inch) REEL PACK CSP0603-2L CPDWZ3V3MSBP-HF Suggested P.C.B. PAD Layout SIZE (inch) 0.007 (mm) 0.19 0.27 0.19 0.011 0.007 A B C CSP0603-2L m 0.38 0.015D D A B C REV:B