CPDQC5V0U-HF COMCHIP | Alldatasheet
Document overview
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Technical content
Features
- Uni-directional ESD protection. - Surface mount package. - Ultra small SMD package:0402. - High component density. Mechanical data - Case: standard package, 0402C/SOD-923F molded plastic. - Mounting position: Any. - Weight: 0.001 grams(approx.). Comchip Technology CO., LTD. RoHS Device Halogen Free Dimensions in inches and (millimeter) 0402C/SOD-923F 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.022(0.55) 0.022(0.55) 0.018(0.45) 0.012(0.30) 0.008(0.20) 0.018(0.45) 0.001(0.02) Max. - IEC61000-4-2 Level 4 ESD protection. - Terminals: Matte tin plated, solderable per MIL-STD-750, method 2026. Circuit diagram Company reserves the right to improve product design , functions and reliability without notice. SMD ESD Protection Diode Symbol TypParameter Min Max UnitConditions Breakdown voltage VBR VIT = 1mA 6 Reverse leakage current IR uAVRWM = 5V 2.0 Clamping voltage VC V9.8IPP = 5A, TP = 8/20us IPP = 16A, TP = 8/20us 12.5 0.3 VWorking peak reverse voltage VRWM 5 Junction capacitance 120CJ pFVR = 0V, f = 1MHz Electrical Characteristics (at TA=25°C unless otherwise noted) Forward voltage VF VIF = 10mA 0.8 Maximum Rating (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Peak pulse power PPP W200 Operation temperature range Tj °C Storage temperature range TSTG -55~+150 °C ESD kV IEC 61000-4-2(air) IEC 61000-4-2(contact) ESD capability -40~+125 Peak pulse current IPP ATP = 8/20us 16 TP = 8/20us ±20 ESD ±15
REV:B Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. f=1MHz TA=25°C RATING AND CHARACTERISTIC CURVES (CPDQC5V0U-HF) 120 0 1 2 3 54 100 Capacitance Between Terminals, (PF) Reverse Voltage, (V) Fig. 5 - Capacitance Between Terminals Characteristics Clamping Voltage, VC (V) Peak Pulse Current, IPP (A) 151050 8/20us waveform Forward Voltage, VF (V) Fig. 4 - Forward Voltage vs. Forward Current Forward Current, IF (A) 0.5 0.0 2.0 2.5 3.0 3.5 1.0 1.5 151050 8/20us waveform Power rating, (%) Ambient temperature, ( °C ) Mounting on glass epoxy PCBs 100 120 25 50 75 100 1500 125 Fig.2 - Power Rating Derating Curve Time, (us) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120% Percentage of Ipp e -t td= t Ipp/2 Ta=25°C Peak Valur Ipp Test Waveform parameters tf=8us td=20us Fig.1 - 8/20us Peak Pulse Current Waveform acc. IEC 61000-4-5 Fig.3 - Clamping Voltage vs. Peak Pulse Current SMD ESD Protection Diode
REV:B Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. D1 D2 D T C Reel Taping Specification o 120 Index hole d E F B W P A SMD ESD Protection Diode B C d D D2D1 E F P P0 P1 T SYMBOL A W W1 (mm) SYMBOL (mm) 178.00 ± 1.000402C (SOD-923F) 0402C (SOD-923F) 0.20 + 0.02 - 0.05 0.008 + 0.001 - 0.002 1.50 + 0.10 - 0 60.00 ± 0.50 0.059 + 0.004 - 0 2.362 ± 0.020 12.00 + 0.50 - 0 0.472 + 0.020 - 0 Trailer Device Leader 400mm (min)160mm (min) Direction of Feed
Comchip Technology CO., LTD. Page 4 REV:B Marking Code QW-G7067 Suggested PAD Layout SIZE (inch) 0.028 (mm) 0.70 0.40 0.70 0.016 0.028 0402C/SOD-923F 1.10 0.043 E 0.30 0.012 Standard Packaging A B C D A C B E D Case Type 5,000 REEL ( pcs ) Reel Size (inch) REEL PACK 0402C/SOD-923F Company reserves the right to improve product design , functions and reliability without notice. Part Number CPDQC5V0U-HF Marking Code SMD ESD Protection Diode