CPDQC3V3T-HF

CPDQC3V3T-HF COMCHIP | Alldatasheet

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Technical content

Features

• Bi-directional ESD protection. - Surface mount package. - Ultra small SMD package:0402 - High component density. Mechanical data - Case: 0402C/SOD-923F Standard package, molded plastic. - Terminals: , solderable perMatte tin plated MIL-STD-750,method 2026. - Mounting position: Any. - Weight: 0.001 grams(approx.). Comchip Technology CO., LTD. REV:B QW-G7068 RoHS Device Halogen Free Company reserves the right to improve product design , functions and reliability without notice. - IEC 61000-4-2 ±30kV(Contact). - ESD Rating of Class 3 per Human Body Model. - ESD Rating of Class 4 Machine Model.per Dimensions in inches and (millimeter) 0402C/SOD-923F 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.022(0.55) 0.022(0.55) 0.018(0.45) 0.012(0.30) 0.008(0.20) 0.018(0.45) 0.001(0.02) Max. Circuit diagram SMD ESD Protection Diode Maximum Rating (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Peak pulse power PPP W170 Operation temperature range Tj °C Storage temperature range TSTG -55~+150 °C ESD kV IEC 61000-4-2(air) IEC 61000-4-2(contact) ESD capability -40~+125 Symbol TypParameter Min Max UnitConditions Breakdown voltage VBR VIT = 1mA 3.6 Reverse leakage current IR uAVRWM = 3.3V 0.5 Clamping voltage VC V 4.65IPP = 1A, TP = 8/20us VWorking peak reverse voltage VRWM 3.3 Peak pulse current IPP ATP = 8/20us 16 TP = 8/20us ±30 Junction capacitance 25CJ pFVR = 0V, f = 1MHz Electrical Characteristics (at TA=25°C unless otherwise noted) 4.2 <0.02 ESD ±30 4.6 IPP = 16A, TP = 8/20us 9.8 Clamping voltage VCL V6IPP = 5A, TP 100ns= IPP = 18A, TP = 100ns 8.75 Dynamic resistance RDYN Ω0.18

Comchip Technology CO., LTD. REV:B QW-G7068 Company reserves the right to improve product design , functions and reliability without notice. RATING AND CHARACTERISTIC CURVES (CPDQC3V3T-HF) Fig. 5 - Pin1 To Pin2 Voltage, (V) Current, (A) Fig.6 - Pin2 To Pin1 Voltage, (V) Current, (A) Power Rating, (%) Fig.4 - Power Rating Derating Curve Ambient Temperature, ( °C ) 100 Mounting on glass epoxy PCBs Fig.3 - Clamping Voltage Vs. Peak Pulse Current Clamping Voltage, (V) Peak Pulse Current, (A) 0 25 50 100 15075 1251 120 4 7 10 13 16 Waveform Parameters: tr=8us td=20us Capacitance Between Terminals, (pF) Fig.2 - Typical Capacitance Between Terminals Characteristics Reverse Voltage, (V) 0 1 2 3 4 Time, (us) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120% Percentage of Ipp e -t td= t Ipp/2 Ta=25°C Peak Valur Ipp Test Waveform parameters tf=8us td=20us 20 Fig.1 - 8/20us Peak Pulse Current Waveform ACC. IEC 61000-4-5 SMD ESD Protection Diode

Comchip Technology CO., LTD. REV:B QW-G7068 Company reserves the right to improve product design , functions and reliability without notice. D1 D2 D T C Reel Taping Specification o 120 Index hole d E F B W P A SMD ESD Protection Diode B C d D D2D1 E F P P0 P1 T SYMBOL A W W1 (mm) SYMBOL (mm) 178.00 ± 1.000402C (SOD-923F) 0402C (SOD-923F) 0.20 + 0.02 - 0.05 0.008 + 0.001 - 0.002 1.50 + 0.10 - 0 60.00 ± 0.50 0.059 + 0.004 - 0 2.362 ± 0.020 12.00 + 0.50 - 0 0.472 + 0.020 - 0 Trailer Device Leader 400mm (min)160mm (min) Direction of Feed

Comchip Technology CO., LTD. REV:B QW-G7068 Company reserves the right to improve product design , functions and reliability without notice. Suggested PAD Layout SIZE (inch) 0.028 (mm) 0.70 0.40 0.70 0.016 0.028 0402C/SOD-923F 1.10 0.043 E 0.30 0.012 A B C D A C B E D Marking Code xx xx = Product type marking code Part Number CPDQC3V3T-HF Marking Code Standard Packaging Case Type 5,000 REEL ( pcs ) Reel Size (inch) REEL PACK 0402C/SOD-923F SMD ESD Protection Diode