CPDQC3V3C-HF COMCHIP | Alldatasheet

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Technical content

Features

  • Bi-directional ESD protection. - Surface mount package. - Ultra small SMD package:0402. - High component density. - IEC 61000-4-2 (ESD) ; ±25 KV (Contact) - ESD rating of Class 3B per Human Body Mode. Dimensions in inches and (millimeter) 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.022(0.55) 0.022(0.55) 0.018(0.45) 0.012(0.30) 0.008(0.20) 0.018(0.45) 0.001(0.02) Max. kV A W ±25 VESD IPP PPP -55 to +125 -55 to +125TJOperating temperature range Peak pulse current Peak pulse power Parameter Symbol Value Unit Maximum Rating (at TA=25°C unless otherwise noted) ESD capability Storage temperature range TSTG °C 0402C/SOD-923F Conditions TP = 8/20us TP = 8/20us IEC 61000-4-2(Air) IEC 61000-4-2(Contact) V V3.3 VPT VRWM Punch-through voltage Working peak reverse voltage Parameter Conditions Symbol Min Typ Max Unit IPT = 2uA Snap-back voltage ISB = 50mA VSB Reverse leakage current VRWM = 3.3V V IR 2.8 Clamping voltage IPP = 1 A, Tp = 8/20us VC V 0.50.05 3.5 uA IPP = 5 A, Tp = 8/20us VC V13 Junction capacitance VR = 0 V, f = 1MHz CJ pF6 Electrical Characteristics (at TA=25°C unless otherwise noted) V3.6Diode breakdown volt gea IT = 1mA VBR

Power Rating, (%) Fig.2 - Power Rating Derating Curve Ambient Temperature, ( °C ) 100 Mounting on glass epoxy PCBs Capacitance Between Terminals, (pF) Fig.4 - Capacitance Between Terminals Characteristics Reverse Voltage, (V) 0 0.5 1.5 2.0 3.3 Fig.3 - Clamping Voltage Vs. Peak Pulse Current Clamping Voltage, (V) Peak Pulse Current, (A) 0 25 50 100 12575 RATING AND CHARACTERISTIC CURVES (CPDQC3V3C-HF) 120 Time, (us) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120% Percentage Of Ipp e -t td= t Ipp/2 Ta=25°C Peak Valur Ipp Test Waveform parameters tf=8us td=20us 31 52 4 1.0 2.5 3.0 Waveform parameters tf=8us td=20us Page 2 Comchip Technology CO., LTD. REV:C QW-G7086 Company reserves the right to improve product design , functions and reliability without notice. Fig.1 - 8/20us Peak Pulse Current Waveform Acc. IEC 61000-4-5

Comchip Technology CO., LTD. REV:C QW-G7086 Company reserves the right to improve product design , functions and reliability without notice. o 120 D1 D2 D Trailer Device Leader 400mm (min)160mm (min) Direction of Feed B C d D D2D1 E F P P0 P1 T SYMBOL A W W1 (mm) SYMBOL (mm) 178.00 ± 1.000402C (SOD-923F) 0402C (SOD-923F) 0.20 + 0.02 - 0.05 0.008 + 0.001 - 0.002 1.50 + 0.10 - 0 60.00 ± 0.50 0.059 + 0.004 - 0 2.362 ± 0.020 12.00 + 0.50 - 0 0.472 + 0.020 - 0 T C Index hole d E F B W P A (5,000pcs/ Reel)

o 120 D1 D2 D T C d E F W A B P Trailer Device Leader 400mm (min)160mm (min) Direction of Feed (10,000pcs/ Reel ) Page 4 Comchip Technology CO., LTD. REV:C QW-G7086 Company reserves the right to improve product design , functions and reliability without notice. SMD ESD Protection Diode Reel Taping Specification B C d D DDSYMBOL A 21 (SOD-923F) - 0 E F P P0 P1 T W W1SYMBOL (SOD-923F)

5,000 REEL ( pcs ) Reel Size (inch) REEL PACK 0402C/SOD-923F Suggested PAD Layout SIZE (inch) 0.028 (mm) 0.70 0.40 0.70 0.016 0.028 0402C/SOD-923F 1.10 0.043 E 0.30 0.012 A B C D A C B E D Part Number Marking Code CPDQC3V3C-HF Page 5 Comchip Technology CO., LTD. REV:C QW-G7086 Company reserves the right to improve product design , functions and reliability without notice. 10,000 E3CPDQC3V3C-HFT Packaging 5,000pcs/Reel 10,000pcs/Reel