CPDQC12VE-HF COMCHIP | Alldatasheet

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Technical content

Features

  • Bi-directional ESD protection. - Surface mount package. - Ultra small SMD package:0402. - High component density. Mechanical data - Case: 0402C/SOD-923F standard package, molded plastic. - Terminals: , solderable perMatte tin plated MIL-STD-750, method 2026. - Mounting position: Any. - Weight: 0.001 grams(approx.). Comchip Technology CO., LTD. REV:A QW-G7088 RoHS Device Halogen Free Company reserves the right to improve product design , functions and reliability without notice. Dimensions in inches and (millimeter) 0.041(1.05) 0.037(0.95) 0.026(0.65) 0.022(0.55) 0.022(0.55) 0.022(0.55) 0.018(0.45) 0.012(0.30) 0.008(0.20) 0.018(0.45) 0.001(0.02) Max. 0402C/SOD-923F Maximum Rating (at TA=25°C unless otherwise noted) SymbolParameter Value UnitConditions Peak pulse power PPP W115 Operation temperature range Tj °C Storage temperature range TSTG -55~+150 °C ESD kV IEC 61000-4-2(air) IEC 61000-4-2(contact) ±30ESD capability -55~+125 Symbol TypParameter Min Max UnitConditions Breakdown voltage VBR VIT = 1mA 14 Reverse leakage current IR nAVRWM = 12V 100 Clamping voltage VC V19IPP = 1A, TP = 8/20us IPP = 5A, TP = 8/20us 23 16.315.1 VWorking peak reverse voltage VRWM 12 Peak pulse current IPP ATP = 8/20us 5 TP = 8/20us Junction capacitance 30CJ pFVR = 0V, f = 1MHz Electrical Characteristics (at TA=25°C unless otherwise noted) Circuit Diagram

f=1MHz TA=25°C Comchip Technology CO., LTD. RATING AND CHARACTERISTIC CURVES (CPDQC12VE-HF) SMD ESD Protection Diode Page 2 0 2 4 6 128 Capacitance Between Terminals, (PF) Reverse Voltage, (V) Fig.4 - Capacitance Between Terminals Characteristics Clamping Voltage,VC (V) Fig.3 - Clamping Volatage Vs. Peak Pulse Current Peak Pulse Current, IPP (A) Power Rating (%) Ambient Temperature, ( °C ) Mounting on glass epoxy PCBs 100 120 25 50 75 1000 125 Fig.2 - Power Rating Derating Curve 321 8/20us waveform 4 5 10 REV:A QW-G7088 Time, (us) 20% 40% 60% 80% 100% 0 5 15 25 3010 20 120% Percentage Of Ipp e -t td= t Ipp/2 Ta=25°C Peak Valur Ipp Test Waveform parameters tf=8us td=20us Fig.1 - 8/20us Peak Pulse Current Waveform Acc. IEC 61000-4-5 Company reserves the right to improve product design , functions and reliability without notice.

Comchip Technology CO., LTD. Page 3 SMD ESD Protection Diode REV:A QW-G7088 Company reserves the right to improve product design , functions and reliability without notice. Reel Taping Specification D1 D2 D T C o 120 Index hole d E F B W P A B C d D D2D1 E F P P0 P1 T SYMBOL A W W1 (mm) SYMBOL (mm) 178.00 ± 1.000402C (SOD-923F) 0402C (SOD-923F) 0.20 + 0.02 - 0.05 0.008 + 0.001 - 0.002 1.50 + 0.10 - 0 60.00 ± 0.50 0.059 + 0.004 - 0 2.362 ± 0.020 12.00 + 0.50 - 0 0.472 + 0.020 - 0 Trailer Device Leader 400mm (min)160mm (min) Direction of Feed

Comchip Technology CO., LTD. SMD ESD Protection Diode Page 4QW-G7088 REV:A Company reserves the right to improve product design , functions and reliability without notice. Marking Code E2Part Number CPDQC12VE-HF Marking Code Suggested PAD Layout SIZE (inch) 0.028 (mm) 0.70 0.40 0.70 0.016 0.028 0402C/SOD-923F 1.10 0.043 E 0.30 0.012 Standard Packaging A B C D A C B E D Case Type 5,000 REEL ( pcs ) Reel Size (inch) REEL PACK 0402C/SOD-923F