CPDH3V3-HF COMCHIP | Alldatasheet

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REV:A SP-JP009 Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. Dimensions in inches and (millimeter) SOD-523 0.051(1.30) 0.043(1.10) 0.035(0.90) 0.028(0.70) 0.067(1.70) 0.059(1.50) 0.014(0.35) 0.010(0.25) 0.008(0.20) Max 0.028(0.70) 0.020(0.50) ESD per IEC 61000-4-2 (air) ESD per IEC 61000-4-2 (contact) VESD ±30 ±30 kV Maximum Rating (at Ta=25°C unless otherwise noted) Peak pulse power (8/20µs) Operating temperature range Storage temperature range PPP TOPT TSTG -55 to +150 350 W Parameter UnitValueSymbol -55 to +150 - Peak power dissipation: 400W (8/20µs). - IEC61000-4-4 (EFT) 40A (5/50ns). - IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact). - Protects one directional I/O line. - Low capacitance. - Case: SOD-523 package. Mechanical data - Terminals: Gold plated, solderable per MIL-STD-750, method 2026. Circuit Diagram 1 2

Electrical Characteristics (at Ta=25°C unless otherwise noted) Rating and Characteristic Curves (CPDH3V3-HF) SMD ESD Protection Diode Page 2 REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. Symbol TypParameter Min Max UnitConditions Reverse breakdown voltage VBRIT = 1mA 4.0 Reverse leakage current IR µAVRWM = 3.3V 1.0 VReverse working voltage VRWM 3.3 V Clamping voltage VC V16IPP = 23A, TP = 8/20µs 45Junction capacitance CJ pFVR = 0V, f = 1MHz SP-JP009 Clamping voltage VCIPP = 1A, TP = 8/20µs 6.0 V6.5 Fig.1 - Pulse Waveform Time, (µs) Percent of IPP Fig.2 - Power Derating Curve Ambient Temperature, Ta (°C) % of Rated Power or IPP 100 110 5 3010 20 25 Waveform parameters tr=8µs td=20µs Waveform parameters tr=8µs td=20µs td = IPP/2 120 100 0 25 50 75 100 150125

REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. SP-JP009 Reel Taping Specification (mm) (inch) SOD-523 SYMBOL (inch) SOD-523 SYMBOL A (mm) B C d D D1 D2 E F P P0 P1 W W1 − 0.10 9.40 ± 1.50 − 0.004 0.370 ± 0.059 o 120 DD1D2 Trailer Device Leader Direction of Feed 400mm (min)160mm (min) d W B C E F P0 P1 P A

REV:A Comchip Technology CO., LTD. Company reserves the right to improve product design , functions and reliability without notice. Standard Packaging Case Type SOD-523 REEL (pcs) Reel Size (inch) 73,000 REEL PACK Marking Code XXX xxx = Product type marking code Part Number Marking Code CPDH3V3-HF 3CM Suggested PAD Layout SIZE (inch)(mm) SOD-523 A B C 1.40 0.40 0.055 0.016 0.40 0.016 Note: 1.The pad layout is for reference purposes only. A C B SP-JP009