CPD15 CENTRAL | Alldatasheet
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Semiconductor Corp. TM
145 Adams Avenue
Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com PROCESS CPD15 Ultra Fast Rectifier 500mA Glass Passivated Rectifier Chip PRINCIPAL DEVICE TYPES CBRHDU-02 Series GEOMETRY PROCESS DETAILS BACKSIDE CATHODE R2 (19-September 2003) Process GLASS PASSIVATED MESA Die Size 25 x 25 MILS Die Thickness 9.5 MILS Anode Bonding Pad Area 14.5 x 14.5 MILS Top Side Metalization Au - 5,000Å Back Side Metalization Au - 2,000Å GROSS DIE PER 4 INCH WAFER 18,080
Semiconductor Corp. TM PROCESS CPD15 Typical Electrical Characteristics Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R2 (19-September 2003)