CPC1302 LITTELFUSE | Alldatasheet

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 Telecom Switching  Tip/Ring Circuits  Hook Switch  Modem Switching (Laptop, Notebook, Pocket Size)  Loop Detect  Ringing Detect  Current Sensing  350VP Breakdown Voltage  3750Vrms Input/Output Isolation  Surface Mount Tape & Reel Version Available The CPC1302 is a dual optocoupler with two identical, independent channels, each having a unidirectional input and a high-voltage Darlington output. Light output from the highly efficient infrared LED activates its associated, optically coupled silicon NPN photo-Darlington output transistor. The input LED and the output transistor are separated by a 3750V rms isolation barrier. With a LED current of only 1mA, a current transfer ratio of 1000% to 8000% is guaranteed at the collector of the 350V Darlington output transistor. The CPC1302's low input current capability with high current transfer ratios, output voltage capability, and isolation barrier rating make it ideal for many applications such as telecom, industrial, and power control. Approvals A K A K C E C E  UL 1577 Approved Component: File E76270  CSA Certified Component: Certificate 1172007  TUV EN 62368-1: Certificate B 082667 0008

INTEGRATED CIRCUITS DIVISION www.ixysic.com2 R08 CPC1302 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Absolute Maximum Ratings @ 25ºC Electrical Characteristics @ 25ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Breakdown Voltage I CEO=100µA BV CEO 350 - - V P Emitter-Collector Breakdown Voltage I E=0.1mA BV ECO 0.3 - - V Phototransistor Output (Dark) Current V CEO=200V , IF=0mA I CEO - - 100 nA Saturation Voltage I C=10mA, IF=1mA VCE(sat) -- 1 V IC=100mA, IF=10mA - - 1.2 V Current T ransfer Ratio I F=1mA, VCE=1V CTR 1000 5500 8000 % Output Capacitance V CEO=50V , f=1MHz C OUT -1 3 - p F Input Characteristics Input Control Current I C=10mA, VCE=1V I F - 0.07 1 mA Input Voltage Drop I F=5mA V F 0.9 1.2 1.5 V Input Reverse Current V R=5V I R - - 10 µA Common Characteristics Input to Output Capacitance - C I/O -3 - p F Parameter Ratings Units Breakdown Voltage, BVCEO 350 V P Reverse Input Voltage 5 V Input Control Current 50 mA Peak (10ms) 1 A Input Power Dissipation 1 (Each) 150 mW Phototransistor Power Dissipation 2 (Each) 150 mW Isolation Voltage, Input to Output 3750 V rms Operational T emperature -40 to +85 °C Storage T emperature -40 to +125 °C 1 Derate linearly 1.33 mW / oC 2 Derate linearly 1.5 mW / oC Characteristic Symbol Test Condition Typ Units Rise Time t R VCC=10V IF=10mA RL=100 Fall Time t F 5 T urn-On Time t on 5 Storage Time t S 20 T urn-Off Time t off 60 T urn-On Time t on VCC=10V IF=16mA RL=180 Storage Time t S 40 T urn-Off Time t off 80 Switching Characteristics @ 25ºC Switching Time Test Circuit VCC VCE RL IF Pulse Width=5ms Duty Cycle=50% IF 10% 90% t on t off t S VCE t F t R

INTEGRATED CIRCUITS DIVISION CPC1302 www.ixysic.com 3R08 LED Forward Voltage (V) LED Current (mA) LED Current (IF) vs. LED Forward Voltage (VF) LED Forward Voltage (V) LED Current (mA) 0.1 100 LED Current (IF) vs. LED Forward Voltage (VF) Temperature (ºC) -40 -20 0 20 40 60 80 100 LED Forward Voltage (V) 1.0 1.1 1.2 1.3 1.4 1.5 1.6 LED Forward Voltage vs. Temperature IF=50mA IF=20mA IF=10mA IF=5mA IF=2mA 100000 0.1 1 10 100 10000 1000 100 LED Current (mA) CTR (%) VCE=1.5V VCE=1.0V CTR vs. LED Current (IF) LED Forward Current (mA) Collector Current IC (mA) 0.01 1000 100 0.1 1 10 100 Collector Current vs. LED Current (IF) VCE=1.0V VCE=1.5V Collector Current vs. Temperature Temperature (ºC) Collector Current IC (mA) (VCE = 1.2V) 375 300 225 150 -40 -20 0 20 40 60 80 100 IF=10mA IF=5mA IF=1mA IF=0.5mA Load Resistance (:) 10 100 1K 10K 100K Switching Time (Ps) 0.1 100 1000 Switching Time vs. Load Resistance toff , IF=16mA toff , IF=1.6mA ton , IF=1.6mA ton , IF=16mA Collector-Emitter Voltage VCE (V) Collector Current IC (mA) 180 160 140 120 100 Collector Current vs. Collector-Emitter Voltage IF = 1mA IF = 0.5mA IF = 2mA IF = 5mA IF = 10mA Temperature (ºC) Leakage Current (µA) Leakage vs. Temperature (VCEO=350V) 3.0 2.5 2.0 1.5 1.0 0.5 -40 -20 0 20 40 60 80 120 100 Breakdown Voltage vs. Temperature Temperature (ºC) Breakdown Voltage BVCEO (VP) -40 450 440 430 420 410 400 390 380 370 -15 10 35 60 85 PERFORMANCE DATA* * Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department.

INTEGRATED CIRCUITS DIVISION www.ixysic.com4 R08 CPC1302 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classifi cation CPC1302G / CPC1302GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classifi cation Temperature (Tc) Dwell Time (t p) Max Refl ow Cycles CPC1302G 250ºC 30 seconds 1 CPC1302GS 250ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

INTEGRATED CIRCUITS DIVISION CPC1302 www.ixysic.com 5R08 MECHANICAL DIMENSIONS Dimensions mm (inches) PCB Hole Pattern 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 0.457 ± 0.076 (0.018 ± 0.003) 9.652 ± 0.381 (0.380 ± 0.015) 7 .239 TYP . (0.285) 7 .620 ± 0.254 (0.300 ± 0.010)

4.064 TYP

(0.160) 0.813 ± 0.102 (0.032 ± 0.004) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 7 .620 ± 0.127 (0.300 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 0.254 ± 0.0127 (0.010 ± 0.0005) Notes: 1 . Controlling dimension: Inches 2. Leadframe thickness does not include solder plating (1000μinches max) Dimensions mm (inches) PCB Land Pattern 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 6.350 ± 0.127 (0.250 ± 0.005) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 0.813 ± 0.102 (0.032 ± 0.004) 4.445 ± 0.127 (0.175 ± 0.005) 7 .620 ± 0.254 (0.300 ± 0.010) 0.635 ± 0.127 (0.025 ± 0.005) 0.254 ± 0.0127 (0.010 ± 0.0005) 2.54 (0.10) 8.90 (0.3503)1 .65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) Pin 1 Notes: 1 . Controlling dimension: Inches 2. Coplanarity = 0.004” (0.102 mm) max 3. Leadframe thickness does not include solder plating (1000μinches max) CPC1302G CPC1302GS

INTEGRATED CIRCUITS DIVISION Specification: DS-CPC1302-R08 ©Copyright 2025, Littelfuse, Inc. OptoMOS® is a registered trademark of Littelfuse, Inc. All rights reserved. Printed in USA. 11/18/2025 CPC1302 IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. For additional information please visit our website at: www.ixysic.com Dimensions mm (inches)User Direction of Feed NOTES: 1 . Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) K1=4.20 (0.165) K0=4.90 (0.193) P1=12.00 (0.472) 16.0±0.3 (0.63±0.012) B0=10.30 (0.406) A0=10.30 (0.406) 4.0 (0.16) 2.0 (0.08) 7. 5 (0.30) MECHANICAL DIMENSIONS CPC1302GSTR Tape & Reel